Patents by Inventor Hiroki MIYAI
Hiroki MIYAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11822233Abstract: An image pickup apparatus includes a stage configured to support a sample at a plurality of support points, a bending data acquisition unit configured to acquire bending data corresponding to a bending of the sample supported on the stage, a height information detection unit configured to detect a height of the sample supported on the stage, a difference value calculation unit configured to calculate a difference value between a height indicated by height information and a height indicated by the bending data at each of a plurality of points on the sample, a correction data calculation unit configured to calculate correction data based on the difference value, and an estimation unit configured to calculate estimation data for estimating the height of the sample by correcting the bending data using the correction data.Type: GrantFiled: July 16, 2020Date of Patent: November 21, 2023Assignee: Lasertec CorporationInventors: Hiroki Miyai, Yoshito Fujiwara, Yoshihiro Kato
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Publication number: 20210247323Abstract: An inspection device according to the present disclosure includes a spheroidal mirror configured to reflect illumination light as convergent light, a plane mirror configured to reflect the illumination light incident as the convergent light and cause the reflected illumination light to be incident on an object of inspection as incident light, a projection optical system configured to focus reflected light of the incident light reflected by the object of inspection, and a detector configured to detect reflected light focused by the projection optical system, wherein an angle of incidence of an incident optical axis being an optical axis of the incident light on the object of inspection is greater than 6 [deg], an angle of reflection of a reflected optical axis being an optical axis of the reflected light on the object of inspection is greater than 6 [deg].Type: ApplicationFiled: February 4, 2021Publication date: August 12, 2021Applicant: Lasertec CorporationInventors: Kiwamu TAKEHISA, Tsunehito KOHYAMA, Hiroki MIYAI, Haruhiko KUSUNOSE
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Publication number: 20210018832Abstract: An image pickup apparatus includes a stage configured to support a sample at a plurality of support points, a bending data acquisition unit configured to acquire bending data corresponding to a bending of the sample supported on the stage, a height information detection unit configured to detect a height of the sample supported on the stage, a difference value calculation unit configured to calculate a difference value between a height indicated by height information and a height indicated by the bending data at each of a plurality of points on the sample, a correction data calculation unit configured to calculate correction data based on the difference value, and an estimation unit configured to calculate estimation data for estimating the height of the sample by correcting the bending data using the correction data.Type: ApplicationFiled: July 16, 2020Publication date: January 21, 2021Inventors: Hiroki MIYAI, Yoshito FUJIWARA, Yoshihiro KATO
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Patent number: 10706527Abstract: A correction method according to an embodiment includes illuminating an object to be inspected by using critical illumination by illumination light L11 generated by a light source 11, concentrating light from the object to be inspected illuminated by the illumination light L11 and acquiring image data of the object to be inspected by detecting the concentrated light by a first detector 23, concentrating part of the illumination light L11, and acquiring image data of a brightness distribution of the illumination light L11 by detecting the concentrated illumination light L11 by a second detector 33, and correcting the image data of the object to be inspected based on the image data of the brightness distribution.Type: GrantFiled: March 23, 2018Date of Patent: July 7, 2020Assignee: LASERTEC CORPORATIONInventors: Tsunehito Kohyama, Haruhiko Kusunose, Kiwamu Takehisa, Hiroki Miyai, Itaru Matsugu
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Patent number: 10319088Abstract: An inspection apparatus according to an aspect of the present invention includes an EUV light source 11, an illumination optical system 10 provided to apply the EUV light to an EUV mask 60, a concave mirror and a convex mirror 22 configured to reflect the EUV light reflected on the EUV mask 60, a camera 32 configured to detect EUV light reflected on the convex mirror 22 and thereby take an image of the EUV mask 60, an AF light source 16 configured to generate AF light having a wavelength of 450 nm to 650 nm, first and second detectors 27 and 30 configured to detect the AF light reflected on the EUV mask 60 through the concave mirror with the hole 21 and the convex mirror 22, and an processing device 31 configured to adjust a focus point of the EUV light on the EUV mask 60.Type: GrantFiled: February 24, 2017Date of Patent: June 11, 2019Assignee: Lasertec CorporationInventors: Hiroki Miyai, Kiwamu Takehisa
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Patent number: 10156664Abstract: Provided are a mask inspection apparatus and a mask inspection method that can prevent a reduction in a reflectance of a drop-in mirror, which is caused by carbon contaminants. A mask inspection apparatus according to the present invention includes a drop-in mirror including multi-layer film and a reflective surface. The drop-in mirror is configured to reflect illumination light incident on the reflective surface and illuminate the mask. An area of the reflective surface is configured to be greater than an area of an illuminated spot irradiated with the illumination light on the reflective surface. The drop-in mirror is configured to be movable. A position of the illuminated spot on the reflective surface is configured to be moved when the drop-in mirror is moved.Type: GrantFiled: October 21, 2016Date of Patent: December 18, 2018Assignee: Lasertec CorporationInventors: Kiwamu Takehisa, Hiroki Miyai
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Publication number: 20180276812Abstract: A correction method according to an embodiment includes illuminating an object to be inspected by using critical illumination by illumination light L11 generated by a light source 11, concentrating light from the object to be inspected illuminated by the illumination light L11 and acquiring image data of the object to be inspected by detecting the concentrated light by a first detector 23, concentrating part of the illumination light L11, and acquiring image data of a brightness distribution of the illumination light L11 by detecting the concentrated illumination light L11 by a second detector 33, and correcting the image data of the object to be inspected based on the image data of the brightness distribution.Type: ApplicationFiled: March 23, 2018Publication date: September 27, 2018Inventors: Tsunehito KOHYAMA, Haruhiko KUSUNOSE, Kiwamu TAKEHISA, Hiroki MIYAI, Itaru MATSUGU
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Patent number: 9786057Abstract: In an inspection apparatus according to one aspect of the present invention, a processing apparatus includes: a profile data generation unit that divides each of a plurality of images according to a circumferential position to generate profile data in which a radial direction position and luminance data are associated with each other; a deconvolution operation unit that carries out a deconvolution operation using a one-dimensional point spread function to generate deconvolution operation data based on the profile data; an estimation unit that estimates estimation data of the deconvolution operation data in a desired focus position in the optical axis direction using the deconvolution operation data; and a synthesis unit that synthesizes the estimation data estimated by the estimation unit for each radial direction position to generate the image in the desired focus position.Type: GrantFiled: August 27, 2015Date of Patent: October 10, 2017Assignee: Lasertec CoporationInventors: Hiroki Miyai, Masafumi Shinoda
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Publication number: 20170256045Abstract: An inspection apparatus according to an aspect of the present invention includes an EUV light source 11, an illumination optical system 10 provided to apply the EUV light to an EUV mask 60, a concave mirror and a convex mirror 22 configured to reflect the EUV light reflected on the EUV mask 60, a camera 32 configured to detect EUV light reflected on the convex mirror 22 and thereby take an image of the EUV mask 60, an AF light source 16 configured to generate AF light having a wavelength of 450 nm to 650 nm, first and second detectors 27 and 30 configured to detect the AF light reflected on the EUV mask 60 through the concave mirror with the hole 21 and the convex mirror 22, and an processing device 31 configured to adjust a focus point of the EUV light on the EUV mask 60.Type: ApplicationFiled: February 24, 2017Publication date: September 7, 2017Inventors: Hiroki Miyai, Kiwamu Takehisa
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Publication number: 20170235031Abstract: Provided are a mask inspection apparatus and a mask inspection method that can prevent a reduction in a reflectance of a drop-in mirror, which is caused by carbon contaminants. A mask inspection apparatus according to the present invention includes a drop-in mirror including multi-layer film and a reflective surface. The drop-in mirror is configured to reflect illumination light incident on the reflective surface and illuminate the mask. An area of the reflective surface is configured to be greater than an area of an illuminated spot irradiated with the illumination light on the reflective surface. The drop-in mirror is configured to be movable. A position of the illuminated spot on the reflective surface is configured to be moved when the drop-in mirror is moved.Type: ApplicationFiled: October 21, 2016Publication date: August 17, 2017Inventors: Kiwamu TAKEHISA, Hiroki MIYAI
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Patent number: 9638739Abstract: A defect coordinates measurement method includes a step of detecting detected coordinates of a fiducial mark and a defect of a mask blank placed on support pins, a step of detecting detected coordinates of the alignment mark of a reference mask placed on the support pins, a step of extracting a reference mark near the detected coordinates of the defect among the plurality of reference marks based on the detected coordinates of the defect of the mask blank and the alignment mark of the reference mask, a step of detecting detected coordinates of the extracted reference mark, and a step of calculating coordinates of the defect based on the detected coordinates of the reference mark and the detected coordinates of the defect.Type: GrantFiled: March 8, 2013Date of Patent: May 2, 2017Assignee: Lasertec CorporationInventors: Haruhiko Kusunose, Hiroki Miyai
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Publication number: 20160088213Abstract: In an inspection apparatus according to one aspect of the present invention, a processing apparatus includes: a profile data generation unit that divides each of a plurality of images according to a circumferential position to generate profile data in which a radial direction position and luminance data are associated with each other; a deconvolution operation unit that carries out a deconvolution operation using a one-dimensional point spread function to generate deconvolution operation data based on the profile data; an estimation unit that estimates estimation data of the deconvolution operation data in a desired focus position in the optical axis direction using the deconvolution operation data; and a synthesis unit that synthesizes the estimation data estimated by the estimation unit for each radial direction position to generate the image in the desired focus position.Type: ApplicationFiled: August 27, 2015Publication date: March 24, 2016Inventors: Hiroki Miyai, Masafumi Shinoda
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Publication number: 20130245971Abstract: A defect coordinates measurement method includes a step of detecting detected coordinates of a fiducial mark and a defect of a mask blank placed on support pins, a step of detecting detected coordinates of the alignment mark of a reference mask placed on the support pins, a step of extracting a reference mark near the detected coordinates of the defect among the plurality of reference marks based on the detected coordinates of the defect of the mask blank and the alignment mark of the reference mask, a step of detecting detected coordinates of the extracted reference mark, and a step of calculating coordinates of the defect based on the detected coordinates of the reference mark and the detected coordinates of the defect.Type: ApplicationFiled: March 8, 2013Publication date: September 19, 2013Applicant: Lasertec CorporationInventors: Haruhiko KUSUNOSE, Hiroki MIYAI
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Publication number: 20130234597Abstract: The plasma shield device (13) comprises a hollow structure (40) made of monocrystal body of silicon carbide and having an inside space (40a) and a first and second openings (40b,40c) which are opposed to each other across the inside space. During operation of the plasma generation apparatus, the internal space of the hollow structure forms a discharge zone in which the plasma is generated. Discharge gas is supplied to the internal space of the hollow structure through the first opening and the EUV radiation is mainly emitted through the second opening.Type: ApplicationFiled: March 7, 2013Publication date: September 12, 2013Applicant: LASERTEC CORPORATIONInventors: Haruhiko KUSUNOSE, Kiwamu TAKEHISA, Tomohiro SUZUKI, Hiroki MIYAI