Abstract: The present disclosure provides a method for producing a microchannel device, which can form a channel that has high hydrophobicity, high solvent resistance as well, and also resistance to heat and damage, on demand with high accuracy, and produces the microchannel device at a low cost, while having high productivity. The method for producing a microchannel device includes: forming a channel pattern from a hydrophobic resin on a porous substrate by an electrophotographic method; melting the channel pattern by heat to allow the channel pattern to permeate into the porous substrate, thereby forming a channel in the inside of the porous substrate.

Abstract: A valuable metal recovery method includes: recovering a battery slag from lithium ion battery waste; adding an acid to the battery slag; adding a sulfur compound the leachate; filtering the first processed product to obtain a first processed filtrate; adding a sulfur compound to the first processed filtrate; filtering the second processed product to obtain a second processed filtrate; adding calcium hydroxide to the second processed filtrate; filtering the third processed product to obtain a third processed filtrate; adding sodium carbonate to the third processed filtrate; filtering the processed product; heating the fourth processed filtrate; blowing carbon dioxide or adding a carbonate; and filtering the processed product, wherein a pH of the second processed product is higher than a pH of the first processed product, and a pH of the third processed product is higher than the pH of the second processed product.

Abstract: Provided is a separation and recovery apparatus for continuously separating and recovering, from a resin mixture containing a resin containing a hydrolyzable polymer and a resin containing a nonhydrolyzable polymer, a hydrolytic component a of the hydrolyzable polymer A and the nonhydrolyzable polymer B, the apparatus including: a crushing unit that crushes the resin mixture a melting/discharging unit that melts a crushed product obtained by the crushing unit to form a fluid and discharges the fluid at a high pressure; and a hydrothermal reaction treatment unit that continuously subjects the fluid discharged from the melting/discharging unit to a hydrothermal reaction treatment, wherein, in the melting/discharging unit, the hydrolyzable polymer A is hydrolyzed, and the hydrolytic component a thereof is dissolved and transferred into water permeating a sintered alloy diaphragm, thereby separating the nonhydrolyzable polymer B.

Abstract: A Li recovery method includes: an acid leaching step of adding an acid to a battery slag to produce a leachate; a first addition step of adding a Ca content to the leachate to produce a first processed product; a post-first-addition filtration step of filtering the first processed product to be separated into a first processing filtrate and a first processing residue; a second addition step of adding sodium carbonate to the first processing filtrate to produce a second processed product; a post-second-addition filtration step of filtering the second processed product to be separated into a second processing filtrate and a second processing residue; heating the second processing filtrate; blowing carbon dioxide into the heated second processing filtrate to produce a third processed product; and a post-carbonation filtration step of filtering the third processed product to be separated into a third processing filtrate and a third processing residue.

Abstract: According to one embodiment, a sensor includes a base body, a support portion fixed to the base body, and a first member supported by the support portion. A gap is provided between the base body and a part of the first member. The first member includes a supported region, a first movable region, a first structure, a first support structure, a first connection structure, a first connect portion, and a first beam. The support portion is located between the base body and the supported region in a first direction from the base body to the support portion. The first beam extends along a second direction crossing the first direction. A first beam position of the first beam is located between a first movable region position of the first movable region and a support portion position of the support portion in the second direction.

Abstract: According to one embodiment, a sensor includes a base, a first support portion fixed to the substrate, and a first member supported by the first support portion. A gap is provided between the base and the first member. The first beam electrode and the second beam electrode satisfy at least one of a first condition, a second condition, a third condition, a fourth condition, a fifth condition, a sixth condition, a seventh condition, or an eighth condition.

Abstract: This semiconductor device comprises a substrate, a first wiring part, a second wiring part, and a semiconductor element. The first wiring part includes a first through-electrode, first main-surface wiring, and a first wiring electrode. The second wiring section includes a second through-electrode, second main-surface wiring, and a second wiring electrode. An upper surface is depressed toward the interior of the first through-electrode. The first wiring electrode is joined to a first element electrode of the semiconductor element by a first joining member. The second wiring electrode is joined to a second element electrode of the semiconductor element by a second joining member. The first wiring electrode, which is formed on an upper surface of the first main-surface wiring, is larger than the second wiring electrode, which is formed on an upper surface of the second main-surface wiring, as seen from the thickness direction.

Abstract: There are provided a temperature sensor that has following capability to a temperature measurement object and has excellent responsiveness, and a temperature detection device and an image forming apparatus each including the temperature sensor. A temperature sensor used in contact with a temperature measurement object, includes: a thermosensitive element configured to detect a temperature of the temperature measurement object; a heat collection member including an abutting portion configured to abut on the temperature measurement object, and configured to be thermally joined with the thermosensitive element; and a holding member including a housing portion configured to house the heat collection member. The heat collection member is swingably held by the holding member, to maintain a state where the abutting portion abuts on the temperature measurement object.

Abstract: There are provided a temperature sensor that has following capability to a temperature measurement object and has excellent responsiveness, and a temperature detection device and an image forming apparatus each including the temperature sensor. A temperature sensor used in contact with a temperature measurement object, includes: a thermosensitive element configured to detect a temperature of the temperature measurement object; a heat collection member including an abutting portion configured to abut on the temperature measurement object, and configured to be thermally joined with the thermosensitive element; and a holding member including a housing portion configured to house the heat collection member. The heat collection member is swingably held by the holding member, to maintain a state where the abutting portion abuts on the temperature measurement object.

Abstract: In order to inhibit defective connection between a bump of a semiconductor chip and an electrode pad of a substrate, a semiconductor device includes a substrate provided on a surface with a plurality of electrode pads 15, a semiconductor chip 20 provided on a surface with a plurality of bumps 21 substantially equal in size, and an anisotropic conductive film 30 interposed between the plurality of bumps 21 and the plurality of electrode pads 15 and electrically connecting each of the bumps 21 and corresponding one of the electrode pads 15. The plurality of electrode pads 15 includes a plurality of first electrode pads 15A positioned closest to an end 25 of the semiconductor chip 20, and a plurality of second electrode pads 15B positioned inside the plurality of first electrode pads 15A on the semiconductor chip 20. Each of the second electrode pads 15B is larger in area than each of the first electrode pads 15A.

Abstract: An array circuit board 11B includes a glass substrate, an IC chip 20, two ACFs 30, and a resin film 32. The IC chip 20 is disposed on the glass substrate. The ACFs 30 are disposed between the glass substrate and the IC chip 20 for electrically connecting the glass substrate and the IC chip 20 together. The ACFs 30 are separated from each other. The resin film 32 is made of resin material having cure shrinkage smaller than the ACFs 30 and disposed to fill a gap between the ACFs 30 adjacent to each other between the glass substrate and the IC chip 20.

Abstract: In order to inhibit defective connection between a bump of a semiconductor chip and an electrode pad of a substrate, a semiconductor device includes a substrate provided on a surface with a plurality of electrode pads 15, a semiconductor chip 20 provided on a surface with a plurality of bumps 21 substantially equal in size, and an anisotropic conductive film 30 interposed between the plurality of bumps 21 and the plurality of electrode pads 15 and electrically connecting each of the bumps 21 and corresponding one of the electrode pads 15. The plurality of electrode pads 15 includes a plurality of first electrode pads 15A positioned closest to an end 25 of the semiconductor chip 20, and a plurality of second electrode pads 15B positioned inside the plurality of first electrode pads 15A on the semiconductor chip 20. Each of the second electrode pads 15B is larger in area than each of the first electrode pads 15A.

Abstract: An array circuit board 11B includes a glass substrate, an IC chip 20, two ACFs 30, and a resin film 32. The IC chip 20 is disposed on the glass substrate. The ACFs 30 are disposed between the glass substrate and the IC chip 20 for electrically connecting the glass substrate and the IC chip 20 together. The ACFs 30 are separated from each other. The resin film 32 is made of resin material having cure shrinkage smaller than the ACFs 30 and disposed to fill a gap between the ACFs 30 adjacent to each other between the glass substrate and the IC chip 20.

Abstract: A display apparatus is provided with: a frame; a display panel, which is fixed to the frame; and a plurality of flexible printed circuit boards, which are disposed adjacent to each other, and each of which has one end side pressure bonded to the display panel, and the other end side bent to the frame side, which is the reverse side of the display panel. The display apparatus has adhesive areas wherein a surface of the display panel is adhered and fixed to the frame, the adhesive areas being in areas overlapping the flexible printed circuit boards. In regions among the flexible printed circuit boards adjacent to each other, non-adhesive areas where the surface of the display panel is not adhered and fixed to the frame are provided.

Abstract: A display module 1 of the present invention includes a first board 3, a second board 4, a base film 5, and a circuit member 2. The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3. The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4. The circuit member 2 is formed on the base film 5.

Abstract: The present invention involves forming wiring sections on a substrate capable of UV-ray transmission, and fixing a component to be electrically connected to the wiring sections onto the substrate using a UV-curable ACF. When doing so, fluidity in the UV-curable ACF is produced by applying pressure to the component, and UV rays are directly projected from the surface of the substrate even onto the UV-curable ACF areas shielded by the wiring sections. The UV-curable ACF is made to be fluid by applying pressure to the component after increasing fluidity of the UV-curable ACF by heating.

Abstract: The present invention provides a component securing structure that forms a wiring unit on a TFT glass substrate that is capable of transmitting UV light. A component, such as a driver IC and/or an FPC, is electrically connected to the wiring unit and is secured to the TFT glass substrate by a UV-curable ACF. An opening for transmitting UV light is formed in a light shielding layer of the wiring unit. UV light irradiated from the back side of the TFT glass substrate passes through the opening and directly irradiates the UV-curable ACF.

Abstract: Provided is a circuit board in which visibility of an alignment mark is improved. In a case of manufacturing a substrate module in which a touch panel (20) and an FPC (50) are electrically connected, an alignment mark in the FPC (50) is formed by an opaque metal film, so that visibility is high. Consequently, when an alignment mark (25) in the touch panel (20) is also formed by an opaque metal film, the visibility of the alignment mark (25) also becomes high. By performing alignment using the alignment marks having high visibility, alignment between the touch panel (20) and the FPC (50) can be performed easily with high precision. As a result, the yield of the substrate module increases and modification of an alignment apparatus used for alignment becomes unnecessary, so that the manufacturing cost of the substrate module can be decreased.

Abstract: Affixed to a projection (111) of a glass substrate (110) included in a liquid crystal module (100) are a first ACF (150a), which has low surface tack strength but high connection reliability, and a second ACF (150b), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (130), electronic components (150), etc., are mounted on the glass substrate (110), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.

Abstract: A display apparatus is provided with: a frame; a display panel, which is fixed to the frame; and a plurality of flexible printed circuit boards, which are disposed adjacent to each other, and each of which has one end side pressure bonded to the display panel, and the other end side bent to the frame side, which is the reverse side of the display panel. The display apparatus has adhesive areas wherein a surface of the display panel is adhered and fixed to the frame, the adhesive areas being in areas overlapping the flexible printed circuit boards. In regions among the flexible printed circuit boards adjacent to each other, non-adhesive areas where the surface of the display panel is not adhered and fixed to the frame are provided.