Patents by Inventor Hiroki Nakai
Hiroki Nakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240135924Abstract: A sound collection apparatus A server (10) causes a terminal device (30) to display a setting user interface, and receives a prohibition time zone setting command. Server sets a prohibition time zone for a target device based on the prohibition time zone setting command. Server (10) causes the target device to utter, when a time for causing the target device to utter is determined not to correspond to the prohibition time zone.Type: ApplicationFiled: June 14, 2021Publication date: April 25, 2024Inventors: Masafumi TORIKAI, Kentaro NAKAI, Hiroki URABE
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Publication number: 20240111645Abstract: An utterance test method for an utterance device, an utterance test server, an utterance test system, and a program perform an utterance test on a test device (20). The utterance test system includes at least one utterance device (20) capable of uttering, a terminal device (30), and an utterance test server (10). The utterance test server (10) receives an utterance test start command from the terminal device (30), sets at least one utterance device (20) to be a test device (20) as a target of an utterance test, sets test content of the utterance test, and causes the test device (20) to utter the test content.Type: ApplicationFiled: July 14, 2021Publication date: April 4, 2024Inventors: Hiroki URABE, Kentaro NAKAI, Satoru MATSUNAGA, Yoshiki OHASHI
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Publication number: 20220299699Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a plate-shaped light transmissive member having a first face, a second face opposite to the first face and a lateral face between the first face and the second face, the plate-shaped light transmissive member disposed so that the second face faces a light emission face of the light emitting element; a light shielding frame having an inner perimeter face surrounding the lateral face; a first light reflecting member disposed between the lateral face and the inner perimeter face so as to expose the first face of the light transmissive member; and a second light reflecting member disposed between the first light reflecting member and the substrate to cover a side face of the light emitting element.Type: ApplicationFiled: June 10, 2022Publication date: September 22, 2022Applicant: NICHIA CORPORATIONInventors: Kensuke YAMAOKA, Hiroki NAKAI
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Patent number: 11391884Abstract: A method of manufacturing a light emitting device includes: mounting a light emitting element on a substrate; disposing a light shielding frame on a sheet, the light shielding frame having an opening; disposing a plate-shaped light transmissive member in the opening, the plate-shaped light transmissive member having a first face and a second face opposite the first face, wherein an outer perimeter of the first face is smaller than an inner perimeter of the opening; forming a light guide support member by filling the space with a first light reflecting member; bonding the light guide support member by bonding an upper face of the light emitting element and the second face of the light transmissive member; and forming a second light reflecting member surrounding the light emitting element by filling the space between the substrate and the light shielding frame with a second reflecting resin.Type: GrantFiled: March 29, 2019Date of Patent: July 19, 2022Assignee: NICHIA CORPORATIONInventors: Kensuke Yamaoka, Hiroki Nakai
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Patent number: 11171274Abstract: A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, first external connecting parts and at least one second external connecting part. The semiconductor layered body includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode is connected to the first semiconductor layer at exposed parts through openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film. The first external connecting parts are connected to the first electrode. The first external connecting parts are spaced apart from the exposed parts in a plan view, and at least two of the first external connecting parts being arranged between at least one set of adjacent ones of the exposed parts in the plan view. The second external connecting part is connected to the second electrode.Type: GrantFiled: April 14, 2020Date of Patent: November 9, 2021Assignee: NICHIA CORPORATIONInventors: Hiroki Nakai, Kensuke Yamaoka
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Patent number: 11152552Abstract: A light emitting device includes a substrate, a light emitting element, and a frame. The substrate has a base and a wiring component. The frame surrounds the light emitting element on the substrate and has an inner edge and an outer edge. The wiring component has a first wiring layer constituting at least a part of an outermost surface of the wiring component inside of the outer edge of the frame, and connected to the light emitting element, and a second wiring layer constituting at least a part of the outermost surface of the wiring component outside of the inner edge of the frame, and made from a different material from the first wiring layer. A boundary between the first wiring layer and the second wiring layer on the outermost surface of the wiring component is disposed inside the outer edge of the frame.Type: GrantFiled: October 3, 2019Date of Patent: October 19, 2021Assignee: NICHIA CORPORATIONInventor: Hiroki Nakai
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Patent number: 10957822Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a light transmissive member having a plate shape and having an upper face and a lower face that is larger than the upper face, disposed such that the lower face opposes a light emission face of the light emitting element; a light reflecting member covering lateral faces of the light transmissive member; and a light shielding frame covering lateral faces of the light transmissive member via the light reflecting member. The light shielding frame has an opening. An outer perimeter of the lower face of the light transmissive member is positioned outward of an inner perimeter of the opening in a plan view as seen from above.Type: GrantFiled: June 29, 2020Date of Patent: March 23, 2021Assignee: NICHIA CORPORATIONInventors: Hiroki Nakai, Kensuke Yamaoka
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Publication number: 20200328328Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a light transmissive member having a plate shape and having an upper face and a lower face that is larger than the upper face, disposed such that the lower face opposes a light emission face of the light emitting element; a light reflecting member covering lateral faces of the light transmissive member; and a light shielding frame covering lateral faces of the light transmissive member via the light reflecting member. The light shielding frame has an opening. An outer perimeter of the lower face of the light transmissive member is positioned outward of an inner perimeter of the opening in a plan view as seen from above.Type: ApplicationFiled: June 29, 2020Publication date: October 15, 2020Applicant: NICHIA CORPORATIONInventors: Hiroki NAKAI, Kensuke YAMAOKA
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Patent number: 10741727Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a light transmissive member having a plate shape and having an upper face and a lower face disposed such that the lower face opposes a light emission face of the light emitting element; a light reflecting member covering lateral faces of the light emitting element and lateral faces of the light transmissive member; and a light shielding frame disposed on the upper face of the light reflecting member surrounding the light transmissive member. The light shielding frame has an opening, an inner perimeter of the opening is positioned at a distance apart from an outer perimeter of the upper face of the light transmissive member in a plan view as seen from above, and the light reflecting member is interposed between the inner perimeter of the opening and the outer perimeter of the upper face of the light transmissive member.Type: GrantFiled: November 28, 2018Date of Patent: August 11, 2020Assignee: NICHIA CORPORATIONInventors: Hiroki Nakai, Kensuke Yamaoka
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Publication number: 20200243740Abstract: A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, first external connecting parts and at least one second external connecting part. The semiconductor layered body includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode is connected to the first semiconductor layer at exposed parts through openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film. The first external connecting parts are connected to the first electrode. The first external connecting parts are spaced apart from the exposed parts in a plan view, and at least two of the first external connecting parts being arranged between at least one set of adjacent ones of the exposed parts in the plan view. The second external connecting part is connected to the second electrode.Type: ApplicationFiled: April 14, 2020Publication date: July 30, 2020Inventors: Hiroki NAKAI, Kensuke YAMAOKA
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Patent number: 10658559Abstract: A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, first external connecting parts and at least one second external connecting part. The semiconductor layered body includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode is connected to the first semiconductor layer at exposed parts through openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film. The first external connecting parts are connected to the first electrode. The first external connecting parts are spaced apart from the exposed parts in a plan view. A group comprising at least one of the first external connecting parts and other group comprising at least one of the first external connecting parts respectively surround adjacent ones of the exposed parts while being spaced apart from each other in the plan view.Type: GrantFiled: February 13, 2019Date of Patent: May 19, 2020Assignee: NICHIA CORPORATIONInventors: Hiroki Nakai, Kensuke Yamaoka
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Publication number: 20200127179Abstract: A light emitting device includes a substrate, a light emitting element, and a frame. The substrate has a base and a wiring component. The frame surrounds the light emitting element on the substrate and has an inner edge and an outer edge. The wiring component has a first wiring layer constituting at least a part of an outermost surface of the wiring component inside of the outer edge of the frame, and connected to the light emitting element, and a second wiring layer constituting at least a part of the outermost surface of the wiring component outside of the inner edge of the frame, and made from a different material from the first wiring layer. A boundary between the first wiring layer and the second wiring layer on the outermost surface of the wiring component is disposed inside the outer edge of the frame.Type: ApplicationFiled: October 3, 2019Publication date: April 23, 2020Inventor: Hiroki NAKAI
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Publication number: 20190302350Abstract: A method of manufacturing a light emitting device includes: mounting a light emitting element on a substrate; disposing a light shielding frame on a sheet, the light shielding frame having an opening; disposing a plate-shaped light transmissive member in the opening, the plate-shaped light transmissive member having a first face and a second face opposite the first face, wherein an outer perimeter of the first face is smaller than an inner perimeter of the opening; forming a light guide support member by filling the space with a first light reflecting member; bonding the light guide support member by bonding an upper face of the light emitting element and the second face of the light transmissive member; and forming a second light reflecting member surrounding the light emitting element by filling the space between the substrate and the light shielding frame with a second reflecting resin.Type: ApplicationFiled: March 29, 2019Publication date: October 3, 2019Applicant: NICHIA CORPORATIONInventors: Kensuke YAMAOKA, Hiroki NAKAI
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Publication number: 20190267529Abstract: A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, first external connecting parts and at least one second external connecting part. The semiconductor layered body includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode is connected to the first semiconductor layer at exposed parts through openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film. The first external connecting parts are connected to the first electrode. The first external connecting parts are spaced apart from the exposed parts in a plan view. A group comprising at least one of the first external connecting parts and other group comprising at least one of the first external connecting parts respectively surround adjacent ones of the exposed parts while being spaced apart from each other in the plan view.Type: ApplicationFiled: February 13, 2019Publication date: August 29, 2019Inventors: Hiroki NAKAI, Kensuke YAMAOKA
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Publication number: 20190165218Abstract: A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a light transmissive member having a plate shape and having an upper face and a lower face disposed such that the lower face opposes a light emission face of the light emitting element; a light reflecting member covering lateral faces of the light emitting element and lateral faces of the light transmissive member; and a light shielding frame disposed on the upper face of the light reflecting member surrounding the light transmissive member. The light shielding frame has an opening, an inner perimeter of the opening is positioned at a distance apart from an outer perimeter of the upper face of the light transmissive member in a plan view as seen from above, and the light reflecting member is interposed between the inner perimeter of the opening and the outer perimeter of the upper face of the light transmissive member.Type: ApplicationFiled: November 28, 2018Publication date: May 30, 2019Applicant: Nichia CorporationInventors: Hiroki NAKAI, Kensuke YAMAOKA
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Patent number: 7645362Abstract: Methods for pretreating and improving coking coal quality for producing blast-furnace coke by: (a) rapid-heating the coal charge in a fluidized-bed to a temperature range between not lower than 300° C. and not higher than the temperature at which the coal charge begins to soften, at a rate of 30 to 103 ° C./min., (b) classifying the rapid-heated coal charge to fine- and coarse-size coal, and then (c-1) briquetting the fine-size coal or (c-2) rapid-heating the fine- and coarse-size coal individually in a pneumatic preheater to a temperature range between not lower than 300° C. and not higher than the temperature at which the coal charge begins to soften, at a rate of 103 to 105 ° C./min., and (d) forming the fine-size coal.Type: GrantFiled: September 10, 2004Date of Patent: January 12, 2010Assignee: The Japan Iron and Steel FederationInventors: Kenji Kato, Yukihiro Kubota, Takashi Arima, Masaki Sasaki, Makoto Matsuura, Hiroki Nakai
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Publication number: 20070187222Abstract: Methods for pretreating and improving coking coal quality for producing blast-furnace coke by: (a) rapid-heating the coal charge in a fluidized-bed to a temperature range between not lower than 300° C. and not higher than the temperature at which the coal charge begins to soften, at a rate of 30 to 103 ° C./min., (b) classifying the rapid-heated coal charge to fine- and coarse-size coal, and then (c-1) briquetting the fine-size coal or (c-2) rapid-heating the fine- and coarse-size coal individually in a pneumatic preheater to a temperature range between not lower than 300° C. and not higher than the temperature at which the coal charge begins to soften, at a rate of 103 to 105 ° C./min., and (d) forming the fine-size coal.Type: ApplicationFiled: September 10, 2004Publication date: August 16, 2007Inventors: Kenji Kato, Yukihiro Kubota, Takashi Arima, Masaki Sasaki, Makoto Matsuura, Hiroki Nakai