Patents by Inventor Hiroki Nakata

Hiroki Nakata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240118700
    Abstract: A terminal apparatus includes a camera, a display that displays a display screen including a mobile robot that autonomously travels, and a control circuit. The control circuit acquires a first planned route of the mobile robot, displays, on the display, a screen having the first planned route superimposed on a camera image taken by the camera, detects a contact point on the display on which the screen is displayed, generates a second planned route of the mobile robot that travels through the contact point, and transmits the second planned route to the mobile robot.
    Type: Application
    Filed: December 5, 2023
    Publication date: April 11, 2024
    Inventors: Yuko TSUSAKA, Mikiya NAKATA, Hiroki TAKEUCHI, Tadahiro TANIGUCHI, Yoshinobu HAGIWARA
  • Publication number: 20240114781
    Abstract: The present invention is to provide a photoelectric conversion element with an excellent photoelectric conversion efficiency, an imaging element, an optical sensor, and a compound. The photoelectric conversion element of the present invention includes, in the following order, a conductive film, a photoelectric conversion film, and a transparent conductive film, in which the photoelectric conversion film contains a compound represented by Formula (1).
    Type: Application
    Filed: April 26, 2023
    Publication date: April 4, 2024
    Applicant: FUJIFILM Corporation
    Inventors: Masaki MORITA, Ryo FUJIWARA, Hiroki SUGIURA, Yasunori YONEKUTA, Hiyoku NAKATA
  • Publication number: 20240087730
    Abstract: An ambulance service support device receives biological information to be used for personal identification of a person to be transported. The ambulance service support device identifies, using a database storing personal medical information, the personal medical information of the person to be transported by using the acquired biological information. The personal medical information is personal information regarding medical care including the biological information. The ambulance service support device outputs emergency support information obtained from the identified personal medical information.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Applicant: NEC Corporation
    Inventors: Hiroki NAOSHIMA, Hironori NAKATA, Eiji TAKADA, Yuji TAKAGI, Yuri MASHIMO
  • Publication number: 20240087732
    Abstract: An ambulance service support device receives biological information to be used for personal identification of a person to be transported. The ambulance service support device identifies, using a database storing personal medical information, the personal medical information of the person to be transported by using the acquired biological information. The personal medical information is personal information regarding medical care including the biological information. The ambulance service support device outputs emergency support information obtained from the identified personal medical information.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: NEC Corporation
    Inventors: Hiroki NAOSHIMA, Hironori NAKATA, Eiji TAKADA, Yuji TAKAGI, Yuri MASHIMO
  • Publication number: 20230242725
    Abstract: A laminated film in which curl is suppressed when the film is heat-sealed with a material different from that of a substrate, the substrate is made of polyethylene terephthalate; and a sealant laminated on one side of the substrate and being to be sealed with a dissimilar material that is a material different from that of the substrate, wherein, when a laminate including a 100 mm×100 mm square of a portion of the laminated film and an 80 mm×80 mm square of the dissimilar material is placed on a flat surface so that the dissimilar material faces down, the portion of the laminated film including a portion of the substrate and a portion of the sealant, the dissimilar material being heat-sealed on a central portion of the portion of the sealant, each corner of the dissimilar material has a rise height of 20 mm or less.
    Type: Application
    Filed: April 7, 2023
    Publication date: August 3, 2023
    Applicant: TOPPAN INC.
    Inventor: Hiroki NAKATA
  • Patent number: 11558967
    Abstract: Electronic equipment includes a plurality of heat generating elements, a single heat sink, and a single cover. The heat generating elements are arranged adjacent to one another in a one-dimensional array in a predetermined alignment direction. The faces of the heat generating elements on one side are fixed directly or indirectly to the heat sink. The faces of the heat generating elements on the other side are in direct or indirect contact with the cover. The cover is fixedly screwed to the heat sink at opposite ends in the alignment direction on the outer side of the heat generating elements. The heat generating elements are sandwiched and held between the heat sink and the cover. This allows heat generated by the heat generating elements to be efficiently radiated via the heat sink and allows the heat generating elements to be easily connected to the heat sink.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: January 17, 2023
    Assignee: DIAMOND & ZEBRA ELECTRIC MFG. CO., LTD.
    Inventors: Yuuki Ookado, Tatsuya Ooue, Hiroki Nakata
  • Patent number: 11147173
    Abstract: An electronic device includes a housing, a circuit substrate, a connector, and a seal obtained by a sealant having fluidity being hardened. The housing includes a lower case and an upper case that covers the lower case. The connector is disposed between the upper case and the lower case. The lower case has a case groove. A connector projection disposed on the connector and a case projection disposed on the upper case are fitted into the case groove. The connector includes a connector groove, and the case projection is fitted into the connector groove. An obstructor for inhibiting flow of the sealant is disposed in the case groove or the connector groove.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: October 12, 2021
    Assignee: DIAMOND ELECTRIC MFG. CO., LTD.
    Inventors: Tatsuya Ooue, Hiroki Nakata
  • Publication number: 20210014984
    Abstract: Electronic equipment includes a plurality of heat generating elements, a single heat sink, and a single cover. The heat generating elements are arranged adjacent to one another in a one-dimensional array in a predetermined alignment direction. The faces of the heat generating elements on one side are fixed directly or indirectly to the heat sink. The faces of the heat generating elements on the other side are in direct or indirect contact with the cover. The cover is fixedly screwed to the heat sink at opposite ends in the alignment direction on the outer side of the heat generating elements. The heat generating elements are sandwiched and held between the heat sink and the cover. This allows heat generated by the heat generating elements to be efficiently radiated via the heat sink and allows the heat generating elements to be easily connected to the heat sink.
    Type: Application
    Filed: March 23, 2020
    Publication date: January 14, 2021
    Inventors: Yuuki OOKADO, Tatsuya OOUE, Hiroki NAKATA
  • Publication number: 20200367372
    Abstract: An electronic device includes a housing, a circuit substrate, a connector, and a seal obtained by a sealant having fluidity being hardened. The housing includes a lower case and an upper case that covers the lower case. The connector is disposed between the upper case and the lower case. The lower case has a case groove. A connector projection disposed on the connector and a case projection disposed on the upper case are fitted into the case groove. The connector includes a connector groove, and the case projection is fitted into the connector groove. An obstructor for inhibiting flow of the sealant is disposed in the case groove or the connector groove.
    Type: Application
    Filed: March 30, 2020
    Publication date: November 19, 2020
    Applicant: DIAMOND ELECTRIC MFG. CO., LTD.
    Inventors: Tatsuya OOUE, Hiroki NAKATA
  • Patent number: 10579302
    Abstract: A semiconductor device includes a first substrate on which an interface unit connectable to a host device is provided, a first memory module on the first substrate, and a first controller on the first substrate. The first controller includes a control unit that controls the first memory module, and a switching unit that switches an operation mode in response to a command from the host device. A first connecting portion is provided on the first substrate and is electrically connected to the first memory module and the first controller. The first controller can directly access a second memory module through the first connecting portion. Thus, for example the first controller can read data stored in the second memory module depending on operation mode.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: March 3, 2020
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Hiroki Nakata, Manabu Matsumoto
  • Patent number: 9727097
    Abstract: A storage device includes a base board and a memory chip package. The base board includes, on a first edge, a connector that is connectable to a host device and through which the storage device communicates with the host device, on a second edge that is opposite to the first edge, a first engaging portion by which the base board is fixable to the host device, and in an intermediate portion that is located between the first edge and the second edge, a second engaging portion by which the base board is fixable to the host device when an end portion of the base board between the second edge and the intermediate portion is removed. The memory chip package is disposed on a surface of the base board and between the first edge and the intermediate portion.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: August 8, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Katsumi Izawa, Hiroki Nakata, Manabu Matsumoto
  • Publication number: 20170131748
    Abstract: A storage device includes a base board and a memory chip package. The base board includes, on a first edge, a connector that is connectable to a host device and through which the storage device communicates with the host device, on a second edge that is opposite to the first edge, a first engaging portion by which the base board is fixable to the host device, and in an intermediate portion that is located between the first edge and the second edge, a second engaging portion by which the base board is fixable to the host device when an end portion of the base board between the second edge and the intermediate portion is removed. The memory chip package is disposed on a surface of the base board and between the first edge and the intermediate portion.
    Type: Application
    Filed: March 7, 2016
    Publication date: May 11, 2017
    Inventors: Katsumi IZAWA, Hiroki NAKATA, Manabu MATSUMOTO
  • Publication number: 20170109098
    Abstract: A semiconductor device includes a first substrate on which an interface unit connectable to a host device is provided, a first memory module on the first substrate, and a first controller on the first substrate. The first controller includes a control unit that controls the first memory module, and a switching unit that switches an operation mode in response to a command from the host device. A first connecting portion is provided on the first substrate and is electrically connected to the first memory module and the first controller. The first controller can directly access a second memory module through the first connecting portion. Thus, for example the first controller can read data stored in the second memory module depending on operation mode.
    Type: Application
    Filed: February 23, 2016
    Publication date: April 20, 2017
    Inventors: Hiroki NAKATA, Manabu MATSUMOTO
  • Publication number: 20070098858
    Abstract: The present invention provides a solid food, a cooked food containing the solid food as an ingredient thereof, and a method for producing the same, and the present invention relates to a method for producing a solid food imparted with a function of maintaining texture and improving storageability, comprising: (a) contacting an alkaline substance and a coating substance with the surface of a solid food; (b) coating the surface of the food with the coating substance by placing the food in an atmosphere at a temperature equal to or higher than the temperature at which the protein in the food is denatured by heat and the coating substance forms a coating; (c) heating the food under conditions equivalent to or more than a temperature of 80° C.
    Type: Application
    Filed: September 28, 2006
    Publication date: May 3, 2007
    Applicant: HOUSE FOODS CORPORATION
    Inventors: Chie Masuyama, Kazunori Sonobe, Yasushi Morishita, Takeshi Kawamukai, Shigeki Satomi, Hiroki Nakata, Shoichi Ito, Katsue Tsuneizumi
  • Patent number: 5948832
    Abstract: Provided are a resin composition improved in utilization of active compound by controlling the bleeding of the active compound low in vaporizability and a molded product obtained from the resin composition. The resin composition comprises 100 parts by weight of a resin, 0.01-200 parts by weight of an active compound and 0.1-100 parts by weight of a vaporizable plasticizer having a vapor pressure of 0.001 mmHg or higher at 20.degree. C., and the vapor pressure (P1) of the vaporizable plasticizer at 20.degree. C. and the vapor pressure (P2) of the active compound at 20.degree. C. satisfy the formula: P1/P2.gtoreq.2.
    Type: Grant
    Filed: July 9, 1996
    Date of Patent: September 7, 1999
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Tatsuhiro Nagamatsu, Hiroki Nakata, Takanori Kume, Tadashi Sakurai
  • Patent number: 5543470
    Abstract: The present invention provides a vulcanized rubber for a heat resistant vibration-isolator which can be obtained by vulcanizing a composition comprising:(A) 110-175 parts by weight of an oil-extended copolymer comprising 100 parts by weight of an ethylene-.alpha.-olefin-non-conjugated diene copolymer rubber with intrinsic viscosity [.eta.] of 3 dl/g or more and 10-75 parts by weight of an extender oil;(B) 5-20 parts by weight of a liquid diene polymer with melt viscosity of 100-3000 poise at 25.degree. C., per 100 parts by weight of an ethylene-.alpha.-olefin-non-conjugated diene copolymer rubber; and(C) 10-80 parts by weight of a reinforcing filler, per 100 parts by weight of an ethylene-.alpha.-olefin-non-conjugated diene copolymer rubber; with an organic peroxide.The vulcanized rubbers of the present invention have excellent thermal stability and durability, a low dynamic spring constant, and excellent processability.
    Type: Grant
    Filed: December 7, 1994
    Date of Patent: August 6, 1996
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Hiroki Nakata, Mitsuhiko Sato, Masashi Aoshima
  • Patent number: 5272221
    Abstract: The present invention provides a nylon composition having increased hydrolyzability which is obtained by physically mixing 100 parts by weight of a nylon with 1 to 50 parts by weight of at least one polymer selected from the group consisting of polylactic acid, polyglycolic acid and a copolymer containing 50 mol % or more of a lactic acid unit or a glycolic acid unit as a repeating unit in its chain; and a method for increasing the hydrolyzability of a nylon by preparing such a composition. High hydrolyzability can be imparted to the nylon inherently having extremely low hydrolyzability without impairing its original mechanical strength. Therefore, various molded articles made from the nylon can be hydrolyzed under natural circumstances, and thus the wastes are not stored.
    Type: Grant
    Filed: April 3, 1992
    Date of Patent: December 21, 1993
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Toshio Kitao, Yoshiharu Kimura, Hideki Yamane, Hiroki Nakata, Hosei Shinoda
  • Patent number: RE34984
    Abstract: The present invention provides a nylon composition having increased hydrolyzability which is obtained by physically mixing 100 parts by weight of a nylon with 1 to 50 parts by weight of at least one polymer selected from the group consisting of polylactic acid, polyglycolic acid and a copolymer containing 50 mol % or more of a lactic acid unit or a glycolic acid unit as a repeating unit in its chain; and a method for increasing the hydrolyzability of a nylon by preparing such a composition. High hydrolyzability can be imparted to the nylon inherently having extremely low hydrolyzability without impairing its original mechanical strength. Therefore, various molded articles made from the nylon can be hydrolyzed under natural circumstances, and thus the wastes are not stored.
    Type: Grant
    Filed: April 7, 1994
    Date of Patent: June 27, 1995
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Toshio Kitao, Yoshiharu Kimura, Hideki Yamane, Hiroki Nakata, Hosei Shinoda