Patents by Inventor Hiroki Nakatsukasa
Hiroki Nakatsukasa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10508255Abstract: Provided are a cleaner composition that can exhibit excellent cleaning ability by including a predetermined amount of water, and can also effectively suppress metal corrosion; and a cleaning method thereof. Disclosed is a cleaner composition in a white turbid state including first to fourth organic solvents and water, in which the first organic solvent is a hydrophobic aromatic compound or the like; the second organic solvent is a hydrophobic monoalcohol compound; the third organic solvent is a predetermined hydrophilic nitrogen-containing compound or the like; the fourth organic solvent is a hydrophilic amine compound; the amount of incorporation of water is adjusted to a value within the range of 50 to 3,900 pbw with respect to 100 pbw of the total amount of the organic solvents, and when the cleaner composition is subjected to phase separation, the water concentration in the oil phase is adjusted to a value of 5 wt. % or less.Type: GrantFiled: December 2, 2016Date of Patent: December 17, 2019Assignee: KAKEN TECH CO., LTD.Inventors: Shigeo Hori, Hiroki Nakatsukasa, Yuki Akamatsu
-
Publication number: 20190048294Abstract: Provided are a cleaner composition that can exhibit excellent cleaning ability by including a predetermined amount of water, and can also effectively suppress metal corrosion; and a cleaning method thereof. Disclosed is a cleaner composition in a white turbid state including first to fourth organic solvents and water, in which the first organic solvent is a hydrophobic aromatic compound or the like; the second organic solvent is a hydrophobic monoalcohol compound; the third organic solvent is a predetermined hydrophilic nitrogen-containing compound or the like; the fourth organic solvent is a hydrophilic amine compound; the amount of incorporation of water is adjusted to a value within the range of 50 to 3,900 pbw with respect to 100 pbw of the total amount of the organic solvents, and when the cleaner composition is subjected to phase separation, the water concentration in the oil phase is adjusted to a value of 5 wt. % or less.Type: ApplicationFiled: December 2, 2016Publication date: February 14, 2019Applicant: c/o KAKEN TECH Co., Ltd.Inventors: Shigeo HORI, Hiroki NAKATSUKASA, Yuki AKAMATSU
-
Patent number: 9085751Abstract: Provided is a liquid concentrate for cleaning composition which could exhibit excellent environmental safety etc. by adding afterward a predetermined amount of water, and also has excellent regeneration efficiency, and provided are a cleaning composition and a cleaning method thereof. Disclosed is a liquid concentrate for cleaning composition which is used as a mixture with water and is intended for cleaning an object to be cleaned in a clouded state, with a predetermined amount of water having been added thereto, the liquid concentrate for cleaning composition including, a first organic solvent which is a predetermined hydrophobic glycol ether compound or the like, and a second organic solvent which is a predetermined hydrophilic amine compound.Type: GrantFiled: May 31, 2011Date of Patent: July 21, 2015Assignee: KAKEN TECH CO., LTD.Inventors: Shigeo Hori, Hiroki Nakatsukasa, Yuki Akamatsu
-
Publication number: 20130096044Abstract: Provided is a liquid concentrate for cleaning composition which could exhibit excellent environmental safety etc. by adding afterward a predetermined amount of water, and also has excellent regeneration efficiency, and provided are a cleaning composition and a cleaning method thereof. Disclosed is a liquid concentrate for cleaning composition which is used as a mixture with water and is intended for cleaning an object to be cleaned in a clouded state, with a predetermined amount of water having been added thereto, the liquid concentrate for cleaning composition including, a first organic solvent which is a predetermined hydrophobic glycol ether compound or the like, and a second organic solvent which is a predetermined hydrophilic amine compound.Type: ApplicationFiled: May 31, 2011Publication date: April 18, 2013Applicant: Kaken Tech Co., Ltd.Inventors: Shigeo Hori, Hiroki Nakatsukasa, Yuki Akamatsu
-
Patent number: 7776808Abstract: The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property in the rinsing using an alcoholic solvent in a next step. Accordingly, the present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of a glycol compound is below 1 weight % with respect to a total amount of the cleaning agent for removing the solder flux, and sets a content of benzyl alcohol to a value which falls within a range of 15 to 99 weight % and a content of amino alcohol to a value which falls within a range of 0.Type: GrantFiled: August 5, 2008Date of Patent: August 17, 2010Assignee: Kaken Tech Co., Ltd.Inventors: Shigeo Hori, Hisakazu Takahashi, Hirohiko Furui, Hiroki Nakatsukasa
-
Publication number: 20080305979Abstract: The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property in the rinsing using an alcoholic solvent in a next step. Accordingly, the present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of a glycol compound is below 1 weight % with respect to a total amount of the cleaning agent for removing the solder flux, and sets a content of benzyl alcohol to a value which falls within a range of 15 to 99 weight % and a content of amino alcohol to a value which falls within a range of 0.Type: ApplicationFiled: August 5, 2008Publication date: December 11, 2008Inventors: Shigeo Hori, Hisakazu Takahashi, Hirohiko Furui, Hiroki Nakatsukasa
-
Patent number: 7435711Abstract: The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property in the rinsing using an alcoholic solvent in a next step. Accordingly, the present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of a glycol compound is below 1 weight % with respect to a total amount of the cleaning agent for removing the solder flux, and sets a content of benzyl alcohol to a value which falls within a range of 15 to 99 weight % and a content of amino alcohol to a value which falls within a range of 0.Type: GrantFiled: August 10, 2004Date of Patent: October 14, 2008Assignee: Kaken Tech Co., Ltd.Inventors: Shigeo Hori, Hisakazu Takahashi, Hirohiko Furui, Hiroki Nakatsukasa
-
Publication number: 20060223732Abstract: The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property in the rinsing using an alcoholic solvent in a next step. Accordingly, the present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of a glycol compound is below 1 weight % with respect to a total amount of the cleaning agent for removing the solder flux, and sets a content of benzyl alcohol to a value which falls within a range of 15 to 99 weight % and a content of amino alcohol to a value which falls within a range of 0.Type: ApplicationFiled: August 10, 2004Publication date: October 5, 2006Inventors: Shigeo Hori, Hisakazu Takahashi, Hirohiko Furui, Hiroki Nakatsukasa