Abstract: A probe card attaching method makes it easy to attach/detach a probe card to/from a transfer stage. In a wafer inspection apparatus 10, a reference position is determined by moving a transfer stage 18 to align a stage-side camera 28 with a tester-side camera 16 in a tester 15, a first distance from the reference position to a center of a pogo frame 19 in the tester 15 is determined by checking a pin mark 24 in the tester 15 with the stage-side camera 28, a second distance from the reference position to a center of a probe card 20 is determined by checking a target mark 32 in the probe card 20 with the tester-side camera 16. Then, the transfer stage 18 is moved to allow the probe card 20 to face the pogo frame 19 based on the reference position, the first distance, and the second distance.

Abstract: A probe card attaching method makes it easy to attach/detach a probe card to/from a transfer stage. In a wafer inspection apparatus 10, a reference position is determined by moving a transfer stage 18 to align a stage-side camera 28 with a tester-side camera 16 in a tester 15, a first distance from the reference position to a center of a pogo frame 19 in the tester 15 is determined by checking a pin mark 24 in the tester 15 with the stage-side camera 28, a second distance from the reference position to a center of a probe card 20 is determined by checking a target mark 32 in the probe card 20 with the tester-side camera 16. Then, the transfer stage 18 is moved to allow the probe card 20 to face the pogo frame 19 based on the reference position, the first distance, and the second distance.

Abstract: A probe card detecting apparatus includes a probe detecting chamber having a supporting body, a probe card positioned and mounted detachably via a first holder on the predetermined position of the supporting body, a first imaging device movably provided in the probe detecting chamber to detect needle tips of at least two probes of the probe card, a probe correction card positioned and mounted detachably via a second holder to the predetermined position of the supporting body, and a control device. Under the control of the control device, using the first imaging device, a difference between a horizontal position of needle tips of at least two probes and a horizontal position of at least two targets is detected as a correction value for performing a position alignment of the at least two probes with the at least two electrode pads of said semiconductor wafer.

Abstract: Disclosed is a case where an aligning method according to the present invention is applied to a probe apparatus. Target probes are photographed by an upper CCD camera and target electrode pads are photographed by a lower CCD camera. Second virtual images of the photographed probes and first virtual images of the electrode pads are displayed in second and first image data areas on a monitor screen. Dark and light colors in terms of brightness are applied to pixels of the second virtual image and the first virtual image. The second virtual images are moved on the monitor screen, so that the second virtual images are superimposed on the first virtual images. The total sum of the brightness (luminance) of all the first virtual images is calculated. On the basis of the calculated luminance value, a position where the target probes are most successfully brought into contact with the target pads is detected.

Abstract: Disclosed is a case where an aligning method according to the present invention is applied to a probe apparatus. Target probes are photographed by an upper CCD camera and target electrode pads are photographed by a lower CCD camera. Second virtual images of the photographed probes and first virtual images of the electrode pads are displayed in second and first image data areas on a monitor screen. Dark and light colors in terms of brightness are applied to pixels of the second virtual image and the first virtual image. The second virtual images are moved on the monitor screen, so that the second virtual images are superimposed on the first virtual images. The total sum of the brightness (luminance) of all the first virtual images is calculated. On the basis of the calculated luminance value, a position where the target probes are most successfully brought into contact with the target pads is detected.

Abstract: Disclosed is a case where an aligning method according to the present invention is applied to a probe apparatus. Target probes are photographed by an upper CCD camera and target electrode pads are photographed by a lower CCD camera. Second virtual images of the photographed probes and first virtual images of the electrode pads are displayed in second and first image data areas on a monitor screen. Dark and light colors in terms of brightness are applied to pixels of the second virtual image and the first virtual image. The second virtual images are moved on the monitor screen, so that the second virtual images are superimposed on the first virtual images. The total sum of the brightness (luminance) of all the first virtual images is calculated. On the basis of the calculated luminance value, a position where the target probes are most successfully brought into contact with the target pads is detected.

Abstract: Disclosed is a case where an aligning method according to the present invention is applied to a probe apparatus. Target probes are photographed by an upper CCD camera and target electrode pads are photographed by a lower CCD camera. Second virtual images of the photographed probes and first virtual images of the electrode pads are displayed in second and first image data areas on a monitor screen. Dark and light colors in terms of brightness are applied to pixels of the second virtual image and the first virtual image. The second virtual images are moved on the monitor screen, so that the second virtual images are superimposed on the first virtual images. The total sum of the brightness (luminance) of all the first virtual images is calculated. On the basis of the calculated luminance value, a position where the target probes are most successfully brought into contact with the target pads is detected.