Abstract: A piezoelectric vibration device is provided that includes a piezoelectric vibration piece and a housing in which the piezoelectric vibration piece is containable. The piezoelectric vibration device further has electrically conductive pads formed on a surface of the housing to which the piezoelectric vibration piece is mountable. The piezoelectric vibration piece is bonded to the electrically conductive pads using metal bumps. An outer surface of the cabinet opposite to the mounting surface is dented toward the mounting surface so as to form a space that overlaps with the electrically conductive pads in plan view.