Patents by Inventor Hiroki Oosedo

Hiroki Oosedo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100151137
    Abstract: An embodiment of the invention relates to an epoxy resin composition for fiber reinforced composite material having an epoxy resin that is liquid at room temperature (component 1), aromatic polyamine that is liquid at room temperature (component 2) and diaminodiphenylsulfone (component 3). The proportion of component (1) relative to the entire epoxy resin in the composition is 60-100 wt %. The sum of the proportions of components (2) and (3) relative to the entire polyamine in the composition is 70-100 wt %. The proportion of component (3) relative to the entire polyamine in the composition is 25-60 wt %. The stoichiometric ratio of the entire polyamine to the entire epoxy resin in the composition is 0.7-1.3. Additional embodiments of the invention relate to other aspects of the invention.
    Type: Application
    Filed: February 23, 2010
    Publication date: June 17, 2010
    Applicant: Toray Industries, Inc.
    Inventors: Shinji KOUCHI, Mariko Ishikawa, Hiroki Oosedo, Go Tanaka, Toshiya Kamae
  • Patent number: 7709582
    Abstract: An embodiment of the invention relates to an epoxy resin composition for fiber reinforced composite material having an epoxy resin that is liquid at room temperature (component 1), aromatic polyamine that is liquid at room temperature (component 2) and diaminodiphenylsulfone (component 3). The proportion of component (1) relative to the entire epoxy resin in the composition is 60-100 wt %. The sum of the proportions of components (2) and (3) relative to the entire polyamine in the composition is 70-100 wt %. The proportion of component (3) relative to the entire polyamine in the composition is 25-60 wt %. The stoichiometric ratio of the entire polyamine to the entire epoxy resin in the composition is 0.7-1.3. Additional embodiments of the invention relate to other aspects of the invention.
    Type: Grant
    Filed: June 6, 2007
    Date of Patent: May 4, 2010
    Assignee: Toray Industries, Inc.
    Inventors: Shinji Kouchi, Mariko Ishikawa, Hiroki Oosedo, Go Tanaka, Toshiya Kamae
  • Patent number: 7501087
    Abstract: An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic ring-containing proton donor of a polyhydric alcohol and/or a polymercaptan.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: March 10, 2009
    Assignee: Toray Industries, Inc.
    Inventors: Toshiya Kamae, Hiroki Oosedo, Go Tanaka, Shigeo Iwasawa
  • Publication number: 20080160860
    Abstract: The invention provides epoxy resin composition containing, as epoxy resin, the following epoxy resin (a) and epoxy resin (b), solid rubber at a ratio of 1 to 20 parts by weight to 100 parts by weight of the entire epoxy resins, and an aromatic amine as a curing agent and having a glass transition temperature of 160 to 220° C. in form of a cured material after heat curing at 180° C. for 2 hours: (a) an epoxy resin having oxazolidone rings and (b) a glycidylamine type epoxy resin.
    Type: Application
    Filed: March 2, 2005
    Publication date: July 3, 2008
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Motohiro Kuroki, Nobuyuki Tomioka, Naomi Wadahara, Kenichi Yoshioka, Hiroaki Sakata, Eisuke Wadahara, Hiroki Oosedo
  • Publication number: 20080108761
    Abstract: An embodiment of the invention relates to an epoxy resin composition for fiber reinforced composite material having an epoxy resin that is liquid at room temperature (component 1), aromatic polyamine that is liquid at room temperature (component 2) and diaminodiphenylsulfone (component 3). The proportion of component (1) relative to the entire epoxy resin in the composition is 60-100 wt %. The sum of the proportions of components (2) and (3) relative to the entire polyamine in the composition is 70-100 wt %. The proportion of component (3) relative to the entire polyamine in the composition is 25-60 wt %. The stoichiometric ratio of the entire polyamine to the entire epoxy resin in the composition is 0.7-1.3. Additional embodiments of the invention relate to other aspects of the invention.
    Type: Application
    Filed: June 6, 2007
    Publication date: May 8, 2008
    Inventors: Shinji Kouchi, Mariko Ishikawa, Hiroki Oosedo, Go Tanaka, Toshiya Kamae
  • Publication number: 20070104937
    Abstract: An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic ring-containing proton donor of a polyhydric alcohol and/or a polymercaptan.
    Type: Application
    Filed: October 26, 2006
    Publication date: May 10, 2007
    Applicant: Toray Industries, Inc.
    Inventors: Toshiya Kamae, Hiroki Oosedo, Go Tanaka, Shigeo Iwasawa
  • Patent number: 7148294
    Abstract: An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic ring-containing proton donor of a polyhydric alcohol and/or a polymercaptan.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: December 12, 2006
    Assignee: Toray Industries, Inc.
    Inventors: Toshiya Kamae, Hiroki Oosedo, Go Tanaka, Shigeo Iwasawa
  • Publication number: 20050191476
    Abstract: The present invention relates: to an epoxy resin composition comprising at least (A) an epoxy resin having a cycloalkane ring or cyclohexene ring but having neither aromatic ring nor aminic nitrogen atom, (B) a carboxylic anhydride having no aromatic ring, and (C) an ultraviolet absorbent, wherein a content of component (A) is from 70 to 100 percents by weight based on the total weight of epoxy resins, and a content of component (B) is from 70 to 100 percents by weight based on the total weight of carboxylic anhydrides. By this constitution, the present invention can provide an epoxy resin composition whose cured product excels in mechanical properties and weatherability, and a fiber reinforced composite material having excellent mechanical properties and weatherability.
    Type: Application
    Filed: April 5, 2005
    Publication date: September 1, 2005
    Applicant: Toray Industries, Inc. a corporation of Japan
    Inventors: Hiroki Oosedo, Go Tanaka, Shinji Kouchi, Shoji Murai
  • Patent number: 6902811
    Abstract: The present invention relates to an epoxy resin composition comprising at least (A) an epoxy resin having a cycloalkane ring or cyclohexene ring but having neither aromatic ring nor aminic nitrogen atom, (B) a carboxylic anhydride having no aromatic ring, and (C) an ultraviolet absorbent, wherein a content of component (A) is from 70 to 100 percents by weight based on the total weight of epoxy resins, and a content of component (B) is from 70 to 100 percents by weight based on the total weight of carboxylic anhydrides. By this constitution, the present invention can provide an epoxy resin composition whose cured product excels in mechanical properties and weatherability, and a fiber reinforced composite material having excellent mechanical properties and weatherability.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: June 7, 2005
    Assignee: Toray Industries, Inc.
    Inventors: Hiroki Oosedo, Go Tanaka, Shinji Kouchi, Shoji Murai
  • Publication number: 20040247882
    Abstract: The present invention relates to an epoxy resin composition for fiber reinforced composite material comprising the following components (1)-(3) as essential components, their mixing ratios meeting the following conditions (I)-(IV), and component (3) being dissolved homogeneously:
    Type: Application
    Filed: April 27, 2004
    Publication date: December 9, 2004
    Inventors: Shinji Kouchi, Mariko Ishikawa, Hiroki Oosedo, Go Tanaka, Toshiya Kamae
  • Publication number: 20040044147
    Abstract: The present invention relates to an epoxy resin composition consisting of components (a), (b) and (c) defined below, wherein the amount of component (c) based on 100 parts by weight of component (a) is 1 to 30 parts by weight; component (a) is liquid; and components (b) and (c) are homogeneously dissolved in component (a):
    Type: Application
    Filed: March 21, 2003
    Publication date: March 4, 2004
    Inventors: Toshiya Kamae, Hiroki Oosedo, Go Tanaka, Shigeo Iwasawa
  • Publication number: 20040031952
    Abstract: The present invention relates to an epoxy resin composition comprising at least (A) an epoxy resin having a cycloalkane ring or cyclohexene ring but having neither aromatic ring nor aminic nitrogen atom, (B) a carboxylic anhydride having no aromatic ring, and (C) an ultraviolet absorbent, wherein a content of component (A) is from 70 to 100 percents by weight based on the total weight of epoxy resins, and a content of component (B) is from 70 to 100 percents by weight based on the total weight of carboxylic anhydrides.
    Type: Application
    Filed: March 27, 2003
    Publication date: February 19, 2004
    Inventors: Hiroki Oosedo, Go Tanaka, Shinji Kouchi, Shoji Murai
  • Publication number: 20030064228
    Abstract: This invention relates to an epoxy resin composition for a fiber-reinforced composite material, which contains the following constituent components (A), (B) and (C).
    Type: Application
    Filed: January 30, 2002
    Publication date: April 3, 2003
    Inventors: Hiroki Oosedo, Shinji Kouchi, Toshiya Kamae
  • Patent number: 6515081
    Abstract: A thermosetting resin composition for carbon fiber reinforced composite materials of the present invention chiefly comprises (A)2 thermosetting resin such as epoxy resin and a curing agent, and (B)2 compound containing one functional group which can react with thermosetting resin (A) or its curing agent, and a moiety selected from the following formulae (1) to (4) Furthermore, the present invention also relates to a prepreg formed by impregnating reinforcing fiber with the aforesaid resin composition and to carbon fiber reinforced composite materials comprising reinforcing fiber and a cured aforesaid thermosetting resin composition.
    Type: Grant
    Filed: June 14, 1999
    Date of Patent: February 4, 2003
    Assignee: Toray Industries, Inc.
    Inventors: Hiroki Oosedo, Ryuji Sawaoka, Shunsaku Noda, Naomi Miyoshi
  • Patent number: 6410127
    Abstract: An epoxy resin composition having a low viscosity around a room temperature and excellent reinforcing fiber impregnating properties provides a composite material having excellent heat resistance and mechanical properties including compressive strength. The epoxy resin composition includes an aromatic epoxy resin having at least di-functionality, an aromatic amine compound and/or an alicyclic amine compound, wherein 5 minutes after the main agent comprising the epoxy resin and the curing agent comprising the aromatic amine compound and/or the alicyclic amine compound are mixed, the composition shows a viscosity at 25° C. in the range of from 1 to 1500 mPa sec, and Tc, tc, and Tg satisfy the following equation (1): Tg≧Tc+20−k×(Tc−90)  (1), wherein k=0 when 60≦Tc<90 and k=0.35 when 90≦Tc≦200; Tc is the highest temperature (°C.
    Type: Grant
    Filed: November 8, 2001
    Date of Patent: June 25, 2002
    Assignee: Toray Industries, Inc.
    Inventors: Toshiya Kamae, Hiroki Oosedo, Shunsaku Noda, Shinji Kouchi, Ryuji Sawaoka
  • Patent number: 6399199
    Abstract: The invention provides a prepreg, formed by impregnating carbon fiber with an epoxy resin composition comprising an epoxy resin (A) and a curing agent (B) wherein the matrix resin content Wr (wt %) of the prepreg, the 0° tensile modulus E (GPa) of the carbon fiber, and the in-plane shear strength of S (MPa) of the carbon fiber reinforced composition material obtained by heating and curing the prepreg satisfy the following formulae (i) and (ii): S≧205×LOG(E)+610  (i) 15≦Wr≦40  (ii) The prepreg has a high in-plane shear strength, a high mode I interlayer fracture toughness GIC, an excellent CFRP tube in torsion al strength, a high radial compressive strength and a high impact strength and a light weight.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: June 4, 2002
    Assignee: Toray Industries Inc.
    Inventors: Mutsuko Fujino, Shunsaku Noda, Hiroki Oosedo, Hideki Okita
  • Publication number: 20020007022
    Abstract: In order to realize the objectives stated above, the thermosetting resin composition for carbon fiber reinforced composite materials of the present invention chiefly comprises the following components.
    Type: Application
    Filed: June 14, 1999
    Publication date: January 17, 2002
    Inventors: HIROKI OOSEDO, RYUJI SAWAOKA, SHUNSAKU NODA, NAOMI MIYOSHI
  • Patent number: 6287696
    Abstract: The invention provides a resin composition for a fiber reinforced composite which can be used to produce a prepreg excellent in tackiness, drapability and windability around a mandrel, and also provides a prepreg in which reinforcing fibers are impregnated with a resin composition, and a fiber reinforced composite obtained from them. The resin composition includes a thermosetting resin and a thermoplastic resin with a weight average molecular weight of 200,000 to 5,000,000.
    Type: Grant
    Filed: April 21, 1998
    Date of Patent: September 11, 2001
    Assignee: Toray Industries, Inc.
    Inventors: Shunsaku Noda, Hiroki Oosedo, Nobuaki Oki
  • Patent number: 6063839
    Abstract: Disclosed are epoxy resin compositions for fiber-reinforced composite materials, comprising an epoxy resin containing 70 parts by weight or more, per 100 parts by weight of the epoxy resin, of a bi-functional epoxy resin, fine particles comprising a rubber phase and substantially insoluble in epoxy resins and a curing agent. Also disclosed are prepregs and fiber-reinforced composite materials comprising the composition.
    Type: Grant
    Filed: May 9, 1996
    Date of Patent: May 16, 2000
    Assignee: Toray Industries, Inc.
    Inventors: Hiroki Oosedo, Shunsaku Noda
  • Patent number: 6046257
    Abstract: A composition is useful as a prepreg containing reinforcing fibers comprises an epoxy resin, a thermoplastic elastomer of a polyamide and/or polyester block copolymer, a curing agent such as dicyandiamide, and optionally a thermoplastic resin such as a polyvinyl formal resin.
    Type: Grant
    Filed: March 18, 1996
    Date of Patent: April 4, 2000
    Assignee: Toray Industries, Inc.
    Inventors: Hiroki Oosedo, Shunsaku Noda