Abstract: An LOC structure semiconductor device having a good solder heat resistance without electrical characteristic failures due to damages to the passivation film and the diffusion layer thereunder attributing to the filler can be obtained by encapsulating an LOC structure semiconductor chip with an encapsulating material comprising an epoxy resin, a curing agent, a curing promoter, and an inorganic filler, the filler having a smaller particle size than the distance between a inner lead and a semiconductor chip and being in an amount of 80 to 95% by weight based on the total weight of the encapsulating material.

Abstract: An epoxy resin molding material comprising an epoxy resin, a phenolic resin and a powder flexibilizer which has a core-shell structure composed of a solid silicone core and an organic polymer shell is an epoxy resin molding material for sealing electronic parts.

Abstract: An epoxy resin molding material comprising an epoxy resin, a phenolic resin and a powder flexibilizer which has a core-shell structure composed of a solid silicone core and an organic polymer shell is a reliable epoxy resin molding material for sealing electronic parts which is excellent in, for example, thermal shock resistance and reflow soldering resistance, and is free from the troublesome deterioration in, for example, the appearance and marking properties of molded products, and to provide a semiconductor sealed by the molding material.

Abstract: A resin-encapsulated semiconductor which is free from the occurrence of blisters or cracks during soldering, suits for continuous production and has excellent moisture resistance reliability is obtained by using an epoxy resin encapsulating material which comprises(A) an epoxy resin component,(B) a curing agent represented by the following general formula (II), ##STR1## wherein m is a number of 0 to 30, (C) at least one cure accelerator selected from the group consisting of compounds represented by the following formulae (III) and (IV), ##STR2## (D) a release agent selected from the group consisting of a polyethylene wax or a mixture thereof with carnauba wax and a mixture of a polyethylene wax or a montanic ester wax, and (E) 65 to 90% by volume of fused silica as a filler.