Patents by Inventor Hiroki Shimoda

Hiroki Shimoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240414848
    Abstract: A flexible printed circuit board includes an electrically conductive line, and a land connected to the electrically conductive line and to be connected to a terminal, the land including soldering portions that have metal surfaces and to which the terminal is to be soldered. The terminal includes an overlapping section that overlaps the flexible printed circuit board and a protruding section that protrudes outward from the flexible printed circuit board and is soldered to a connecting member that connects electrode portions of power storage elements.
    Type: Application
    Filed: August 22, 2024
    Publication date: December 12, 2024
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Hideo TAKAHASHI, Shinichi TAKASE, Hiroki SHIMODA, Tsutomu KITAJIMA, Yoshiro ADACHI, Yuuki OOHASHI, Manabu SUDOU
  • Patent number: 12144107
    Abstract: A wiring module 20 is included in a power storage module 2 including a plurality of power storage elements 10 each having electrode terminals 11A and 11B and is connected to the power storage elements 10. The wiring module 20 includes a flexible FPC 21A including a first conductive path 23 and a circuit board 30 including a second conductive path that is electrically connected to the first conductive path 23. The FPC 21A includes a main body portion 24 and a circuit connecting portion 27 that extends from the main body portion 24 and is overlaid on the circuit board 30. The first conductive path 23 includes a first land 23A included in the circuit connecting portion 27. The second conductive path includes a second land 32A that is electrically connected to the first land 23A. The connected portion between the first land 23A and the second land 32A is covered by a covering portion 60 constituted by a resin having insulating properties.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: November 12, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Nobuyuki Matsumura, Shinichi Takase, Hiroki Shimoda, Taiji Yanagida
  • Patent number: 12125612
    Abstract: The wire harness includes a base film having flexibility, a cover film covering the base film and having flexibility, and electric wires disposed between the base film and the cover film. The electric wires include first end sections that extend outside the base film and the cover film and second end sections that extend outside from the base film and the cover film from an opposite side from the first end sections. The base film and the cover film include welding portions at which the base film and the cover film are joined with welding.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: October 22, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Nobuyuki Matsumura, Hiroki Shimoda, Isamu Hamamoto, Yutaroh Gotoh
  • Patent number: 12113243
    Abstract: A connection module includes a FPC and bus bars connected to the FPC and connecting the electrode terminals of power storage elements that are adjacent to each other. The FPC includes a first wiring portion, a second bus bar mount portion, and a third bus bar mount portion to which the bus bars are connected. The FPC further includes a second expandable/contractable portion and a third expandable/contractable portion. The second expandable/contractable portion is continuous from the second bus bar mount portion and allowed to be expanded and contracted in a direction to be closer to and farther away from the first wiring portion and the third bus bar mount portion. The third expandable/contractable portion is continuous from the third bus bar mount portion and allowed to be expanded and contracted in a direction to be closer to and farther away from the second bus bar mount portion.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: October 8, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hideo Takahashi, Shinichi Takase, Hiroki Shimoda, Kouichi Nagamine, Masayuki Ueda, Yoshifumi Uchita, Takayuki Tsumagari
  • Patent number: 12114429
    Abstract: A flexible printed circuit board including a terminal includes a flexible printed circuit board that includes an electrically conductive line and the terminal soldered to the flexible printed circuit board. The flexible printed circuit board includes a land and a soldering restricting section. The land is electrically connected to the electrically conductive line and has a metal surface and is soldered to the terminal. The soldering restricting section has a non-metal surface and is not soldered to the terminal. The terminal includes an overlapping section and a protrusion section. The overlapping section overlaps the land and is soldered to the land and includes a removed section that is formed in such a manner that a portion is partially removed in a predefined area. The protruding section is continuous from the overlapping section and protrudes to an area that does not overlap the flexible printed circuit board.
    Type: Grant
    Filed: September 7, 2020
    Date of Patent: October 8, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Hideo Takahashi, Shinichi Takase, Hiroki Shimoda, Tsutomu Kitajima, Yoshiro Adachi, Yuuki Oohashi, Manabu Sudou
  • Patent number: 12101888
    Abstract: A flexible printed circuit board includes an electrically conductive line and a land that is connected to the electrically conductive line and to be connected to a terminal. The land includes soldering portions that have metal surfaces and to which the terminal is to be soldered. A dividing section is between the soldering portions and the dividing section has a non-metal surface and defines each of the soldering portions that are adjacent to each other.
    Type: Grant
    Filed: September 7, 2020
    Date of Patent: September 24, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Hideo Takahashi, Shinichi Takase, Hiroki Shimoda, Tsutomu Kitajima, Yoshiro Adachi, Yuuki Oohashi, Manabu Sudou
  • Patent number: 12080914
    Abstract: A connection module includes an FPC and a plurality of bus bars. The plurality of bus bars constitute a first bus bar row disposed along one long side of the FPC, and a second bus bar row disposed along the other long side of the FPC. The FPC includes tolerance absorbing portions each including a slit and a pair of deflection portions disposed with the slit interposed therebetween, and is divided into a plurality of wiring portion by the tolerance absorbing portions. The pair of deflection portions constituting the first tolerance absorbing portion can be deflected in a direction in which the two wiring portions that are adjacent to each other with the first tolerance absorbing portion interposed therebetween move toward and away from each other. The same description also applies to the second tolerance absorbing portion.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: September 3, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hideo Takahashi, Shinichi Takase, Hiroki Shimoda, Hideaki Nakajima
  • Publication number: 20240249900
    Abstract: A circuit assembly includes: a relay; a case that houses the relay; and a bus bar including a fastening part configured to be fastened to a connection part of the relay, and a heat transfer part configured to be in thermally conductive contact with an external heat dissipation target, wherein the relay includes an excitation connector part that is provided on a side surface of the relay, and that is open in a direction opposite to a direction in which the connection part is open, the fastening part of the bus bar protrudes upward from the heat transfer part disposed on a bottom wall side of the case so as to be inclined at an angle larger than 90°, and the excitation connector part of the relay in which the connection part connected to the fastening part of the bus bar is open obliquely upward.
    Type: Application
    Filed: June 15, 2022
    Publication date: July 25, 2024
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Taiji YANAGIDA, Hiroki SHIMODA
  • Patent number: 12021357
    Abstract: An electrical connection box for installation in a vehicle includes a bus bar to electrically and thermally interconnect a plurality of electrical components electrically connected to a power storage device or in-vehicle load installed in the vehicle, a casing to house the plurality of electrical components and the bus bar, and an insulating heat dissipation member thermally connected to the bus bar and the casing, with at least two of the plurality of electrical components being disposed adjacent to each other, and the bus bar dissipating heat from the two electrical components via the heat dissipation member.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: June 25, 2024
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Ayaka Asano, Kazuya Komaki, Hiroki Shimoda, Taiji Yanagida
  • Publication number: 20240195019
    Abstract: A conductive component for electrically connecting a plurality of terminal portions includes a conductive member including a plurality of connection portions being fastened to the respective terminal portions in a connected state and a case having insulation properties while accommodating the conductive member. The at least one of the connection portions, which is configured to be fastened to the terminal portion covered by a terminal portion cover having a terminal portion opening window, is provided with at least one connection-portion-side relay portion. The connection-portion-side relay portion is arranged to connect to the terminal portion inserted through the terminal portion opening window.
    Type: Application
    Filed: February 13, 2024
    Publication date: June 13, 2024
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Taiji YANAGIDA, Hiroki SHIMODA, Nobuyuki MATSUMURA, Yoshinori IKAI, Yasuhiro KUDOU
  • Publication number: 20240186657
    Abstract: An inter-terminal connection structure including a plurality of terminal portions and a conductive component electrically connecting the plurality of terminal portions. The conductive component includes a conductive member having a plurality of connection portions fastened to the respective terminal portions in a connected state. The connection structure also includes a case having insulation properties while accommodating the conductive member, an insulating terminal portion cover covering at least one of the terminal portions, a terminal portion opening window provided to the terminal portion cover to partially expose the terminal portion, and a connection-portion-side relay portion provided to the connection portion fastened to the terminal portion covered by the terminal portion cover, and projecting to an outside of the case and inserted through the terminal portion opening window to be connected to the terminal portion.
    Type: Application
    Filed: February 13, 2024
    Publication date: June 6, 2024
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Taiji YANAGIDA, Hiroki SHIMODA, Nobuyuki MATSUMURA, Yoshinori IKAI, Yasuhiro KUDOU
  • Patent number: 11991815
    Abstract: Provided is a circuit structure having a novel structure that allows heat from a heat-generating component to be dissipated more efficiently. A circuit structure includes: a heat-generating component that generates heat when energized; energization bus bars that are connected to connection portions of the heat-generating component; cooling members that are formed separately from the energization bus bars, and are connected to the connection portions of the heat-generating component along with energization bus bars, and the heat-transfer portions that are provided in the cooling members, and are in heat-conductive contact with a heat-dissipating body.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: May 21, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Koushi Igura, Hiroki Shimoda, Taiji Yanagida, Kazuya Komaki, Ayaka Asano
  • Patent number: 11982712
    Abstract: A configuration is adopted in which a terminal module includes a voltage detection terminal having a terminal connection part connected to an electrode terminal and a wire connection part connected to a wire, and a protector housing at least part of the voltage detection terminal, with two liquid draining parts each including a first extension part extending downward in the direction of gravity being provided between the terminal connection part and the wire connection part in the voltage detection terminal, and the protector having a housing part housing the liquid draining parts and accumulating liquid that travels along the first extension part.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: May 14, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Nobuyuki Matsumura, Hiroki Shimoda
  • Patent number: 11962038
    Abstract: A power storage component module includes power storage components and a bus bar connecting the power storage components to one another. At least one positioning boss is provided on an electrode included in the power storage components. The at least one positioning boss protrudes upward. The at least one positioning boss includes a base end and a distal end having a diameter less than a diameter of the base end. At least one through hole opens in the bus bar. The bus bar is placed on the at least one positioning boss and a hole edge of the at least one through hole is disposed around the at least one positioning boss between the base end of the at least one positioning boss and the distal end of the at least one positioning boss in a vertical direction.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: April 16, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Nobuyuki Matsumura, Shinichi Takase, Hiroki Shimoda, Yusuke Suzuki, Isamu Hamamoto
  • Patent number: 11942657
    Abstract: An inter-terminal connection structure electrically connecting terminal portions via a conductive component. The conductive component includes a conductive member having connection portions that are fastened so as to be connected to the respective terminal portions, and a case having insulation properties while accommodating the conductive member, an insulating cover covering at least one of the terminal portions and the connection portions, an opening window provided to the insulating cover and exposing at least one of the terminal portions and the connection portions, and a relay portion provided to the connection portion or the terminal portion fastened to the at least one of the terminal portions and the connection portions covered by the insulating cover while being inserted through the opening window to be connected to the at least one of the terminal portions and the connection portions.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: March 26, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Taiji Yanagida, Hiroki Shimoda, Nobuyuki Matsumura, Yoshinori Ikai, Yasuhiro Kudou
  • Patent number: 11912214
    Abstract: A wiring module includes a flexible substrate, a sensor component (temperature sensor), a connecting member (bus bar), and a holding part-equipped relay member, wherein the holding part-equipped relay member includes: a relay member main body including a base part (first main plate) that is to be fixed to the flexible substrate and the bus bar, and a holding part (first holding piece) that is continuous with the first main plate; a pedestal part (housing) that is to be held by the first holding piece so as to be displaceable in a direction toward or away from the first main plate, and that is to be fixed to a position of the flexible substrate where the temperature sensor is mounted; and a biasing member that has elastic force, that has one end held by the first main plate, and that biases the housing in the direction away from the first main plate.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: February 27, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Nobuyuki Matsumura, Shinichi Takase, Hiroki Shimoda, Hideo Takahashi
  • Publication number: 20240057294
    Abstract: Disclosed is a circuit assembly having a novel structure capable of reducing thermal resistance in a heat-dissipating path and increasing heat dissipation while ensuring insulation between a heat-dissipating portion and a heat-dissipation target. A circuit assembly includes: heat-generating components that generate heat as a result of a current flowing therethrough; metal plates connected to connecting portions of the heat-generating components, and each having a heat-dissipating portion configured to come into thermal contact with an external heat-dissipation target; a case accommodating the heat-generating components and the metal plates, and having opening portions that expose the heat-dissipating portions of the metal plates to an outside; and an insulating film sealing the opening portions of the case and fixed to the case.
    Type: Application
    Filed: December 14, 2021
    Publication date: February 15, 2024
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Taiji YANAGIDA, Hiroki SHIMODA
  • Publication number: 20240032210
    Abstract: Disclosed is a circuit assembly having a novel structure capable of reducing thermal resistance in a heat-dissipating path and increasing heat dissipation while ensuring insulation between a heat-dissipating portion and a heat-dissipation target.
    Type: Application
    Filed: December 14, 2021
    Publication date: January 25, 2024
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Taiji YANAGIDA, Hiroki SHIMODA
  • Patent number: 11811094
    Abstract: A wiring module includes a first housing section row, a second housing section row, and linking sections. The first housing section row includes first housing sections that are arranged in an arrangement direction and include connection bus bars therein, respectively. The second housing section row includes second housing sections that are arranged in the arrangement direction and include the connection bus bars and output bus bars therein, respectively, and is disposed away from the first housing section row with respect to a crossing direction that crosses the arrangement direction. The linking sections are disposed between the first and second housing section rows and link the first and second housing section rows. The first housing sections are connected by a first warping section that can be deformed with warping and the second housing sections are connected by a second warping section that can be deformed with warping.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: November 7, 2023
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Taiji Yanagida, Hiroki Shimoda, Yoshinori Ito, Takehito Yoda
  • Publication number: 20230247760
    Abstract: A wiring module is included in a power storage module including a plurality of power storage elements each having electrode terminals and is connected to the power storage elements. The wiring module includes a flexible FPC including a first conductive path and a circuit board including a second conductive path that is electrically connected to the first conductive path. The FPC includes a main body portion and a circuit connecting portion that extends from the main body portion and is overlaid on the circuit board. The first conductive path includes a first land included in the circuit connecting portion. The second conductive path includes a second land that is electrically connected to the first land. The connected portion between the first land and the second land is covered by a covering portion constituted by a resin having insulating properties.
    Type: Application
    Filed: May 28, 2021
    Publication date: August 3, 2023
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Nobuyuki MATSUMURA, Shinichi TAKASE, Hiroki SHIMODA, Taiji YANAGIDA