Abstract: A semiconductor laser light-emitting device includes: a mounting base (mounting substrate); a submount disposed above the mounting base; a connecting member that connects the mounting base and the submount and is composed of a porous metal material; and a semiconductor laser disposed above the submount. The submount includes a front face that is a face on the light emission side of the semiconductor laser. The connecting member includes a peripheral portion that continuously covers at least part of the front face of the submount and the peripheral area of a first area of the top surface of the mounting base, where the first area corresponds to the submount. The top surface of the peripheral portion is straight or recessed at a cross section that intersects the front face of the submount and the top surface of the mounting base.

Abstract: A semiconductor laser light emitting device includes: a mounting substrate that is an example of a mounting base including a step; a submount disposed above a bottom face of the step; and a semiconductor laser disposed on the submount. A first lateral face of the step and a front face of the submount are in thermal contact with each other, the front face of the submount being a face of the submount on a light-emission direction side of the semiconductor laser.

Abstract: A light emitting device includes a light emitting element; a sub-mount including a sub-mount substrate with a front surface on which the light emitting element is disposed, and a back surface electrode disposed in a back surface that is on a back side of the front surface of the sub-mount substrate; a main-mount in which the sub-mount is disposed, the main-mount including a front surface metal pattern including a wiring electrode bonded to the back surface electrode via solder. The front surface metal pattern has a slit, in a plan view, at a position away from a disposition region in which the sub-mount is disposed.

Abstract: A light emitting device includes a light emitting element; a sub-mount including a sub-mount substrate with a front surface on which the light emitting element is disposed, and a back surface electrode disposed in a back surface that is on a back side of the front surface of the sub-mount substrate; a main-mount in which the sub-mount is disposed, the main-mount including a front surface metal pattern including a wiring electrode bonded to the back surface electrode via solder. The front surface metal pattern has a slit, in a plan view, at a position away from a disposition region in which the sub-mount is disposed.