Patents by Inventor Hiroki Sugi

Hiroki Sugi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8907025
    Abstract: The present invention is to provide an adhesive agent composition, including: a main agent containing a polyether polyurethane polyol and a bisphenol A-type epoxy resin; and a curing agent, wherein the polyether polyurethane polyol is obtained by reacting a polyalkylene glycol including repeating units each having a carbon number of 3 or 4 and an alkane diol monomer with an organic diisocyanate at an equivalent ratio (NCO/OH) of 0.7 or more but less than 1, a weight average molecular weight thereof is in the range of 20,000 to 70,000, and an urethane bond equivalent thereof is in the range of 320 to 600 g/eq, and wherein a number average molecular weight of the bisphenol A-type epoxy resin is in the range of 400 to 5,000, and the bisphenol A-type epoxy resin is of a solid state or a semisolid state at normal temperature.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: December 9, 2014
    Assignee: Toyo Ink SC Holdings Co., Ltd.
    Inventors: Hiroki Sugi, Bungo Yasui, Seiji Maeda, Katsuyuki Ueki, Kenshiro Shimada
  • Publication number: 20130296504
    Abstract: The present invention is to provide an adhesive agent composition, including: a main agent containing a polyether polyurethane polyol and a bisphenol A-type epoxy resin; and a curing agent, wherein the polyether polyurethane polyol is obtained by reacting a polyalkylene glycol including repeating units each having a carbon number of 3 or 4 and an alkane diol monomer with an organic diisocyanate at an equivalent ratio (NCO/OH) of 0.7 or more but less than 1, a weight average molecular weight thereof is in the range of 20,000 to 70,000, and an urethane bond equivalent thereof is in the range of 320 to 600 g/eq, and wherein a number average molecular weight of the bisphenol A-type epoxy resin is in the range of 400 to 5,000, and the bisphenol A-type epoxy resin is of a solid state or a semisolid state at normal temperature.
    Type: Application
    Filed: January 20, 2012
    Publication date: November 7, 2013
    Applicants: TOYOCHEM CO., LTD., TOYO INK SC HOLDINGS CO., LTD.
    Inventors: Hiroki Sugi, Bungo Yasui, Seiji Maeda, Katsuyuki Ueki, Kenshiro Shimada
  • Publication number: 20110104482
    Abstract: A polyurethane adhesive for outdoor use that uses a base material and a curing agent, wherein the base material comprises a polyol (A) composed of a polyester polyol and/or polyester polyurethane polyol containing a dibasic acid component comprising 40 to 80 mol % of an aromatic dibasic acid and 20 to 60 mol % of an aliphatic dibasic acid having 9 or more carbon atoms, and a polyhydric alcohol component comprising 20 to 100 mol % of an aliphatic polyhydric alcohol having 5 or more carbon atoms, and the curing agent comprises a polyisocyanate (B) containing an isocyanurate in a weight ratio of 50 to 100%.
    Type: Application
    Filed: November 18, 2008
    Publication date: May 5, 2011
    Applicant: TOYO INK MFG. CO., LTD.,
    Inventors: Bungo Yasui, Seiji Maeda, Hiroki Sugi, Kenshiro Shimada