Abstract: An apparatus comprises a grouping unit dividing substrates into groups, and determining reference and non-reference substrates for each group, a measurement unit measuring a first number of points for the reference substrate, and measuring a second number, smaller than the first number, of points for the non-reference substrate, a correction value determining unit determining a first correction value to position the reference substrate, and a second correction value to position the non-reference substrate, and an exposure unit exposing the reference substrate by positioning it based on the first correction value, and exposing the non-reference substrate by positioning it based on the second correction value, the correction value determining unit determining the first correction value based on the measurement of the reference substrate, and determining the second correction value based on the measurement of the non-reference substrate, and the measurement of the reference substrate or the first correction valu

Abstract: An apparatus comprises a grouping unit dividing substrates into groups, and determining reference and non-reference substrates for each group, a measurement unit measuring a first number of points for the reference substrate, and measuring a second number, smaller than the first number, of points for the non-reference substrate, a correction value determining unit determining a first correction value to position the reference substrate, and a second correction value to position the non-reference substrate, and an exposure unit exposing the reference substrate by positioning it based on the first correction value, and exposing the non-reference substrate by positioning it based on the second correction value, the correction value determining unit determining the first correction value based on the measurement of the reference substrate, and determining the second correction value based on the measurement of the non-reference substrate, and the measurement of the reference substrate or the first correction valu

Abstract: An apparatus comprises a grouping unit dividing substrates into groups, and determining reference and non-reference substrates for each group, a measurement unit measuring a first number of points for the reference substrate, and measuring a second number, smaller than the first number, of points for the non-reference substrate, a correction value determining unit determining a first correction value to position the reference substrate, and a second correction value to position the non-reference substrate, and an exposure unit exposing the reference substrate by positioning it based on the first correction value, and exposing the non-reference substrate by positioning it based on the second correction value, the correction value determining unit determining the first correction value based on the measurement of the reference substrate, and determining the second correction value based on the measurement of the non-reference substrate, and the measurement of the reference substrate or the first correction valu

Abstract: An exposure method and an exposure apparatus in which one or more plural sample shot processes are made to a substrate and an exposure process is made to the substrate after completion of the sample shot process or processes. The procedure includes a first determining step for determining the processing order in a first sample shot process, of the plural sample shot processes, and a second determining step for determining the processing order in a second sample shot process to be made after the first sample shot process. In at least one of the first and second determining steps, the determination is made under a condition that an interval between a shot to be processed last in the first sample shot process and a shot to be processed first in the second sample shot process is shortened.

Abstract: An apparatus is disclosed, which includes a user interface unit, a detection unit to detect whether a user exists, and a first setting unit to set an item operable from the user interface unit based on a detection result of the detection unit.

Abstract: In editing of a job parameter in a semiconductor exposure apparatus controlled by the job parameter, which is a collection of parameters, a first parameter set independent of the model of the semiconductor exposure apparatus and a second parameter set dependent upon the model are edited and saved independently. This makes it possible to improve operability of parameter editing and management in the semiconductor exposure apparatus, ease of maintenance thereof and the ability to use job parameters among various models of apparatus.

Abstract: Mark detecting method and apparatus usable, for example, in a semiconductor exposure apparatus such as a stepper for printing a pattern of a reticle upon a semiconductor wafer, for detecting, by using an image sensor, an alignment mark provided on a reticle or wafer for alignment of the same. Plural search marks are provided two-dimensionally around the alignment mark, each search mark having a first pattern and one or more second patterns indicative of the position of the alignment mark. When at least one first pattern of the search mark is caught by an image pickup device, the reticle is displaced in accordance with the positional information as indicated by the second pattern of the search mark. This brings the alignment mark within the image pickup region of the image sensor. The alignment mark is subsequenlty used to accurately align the reticle with a predetermined position. Thus, the time required for completing the reticle alignment can be reduced remarkably.

Abstract: A mark detecting method and device suitably applicable to the alignment of a reticle in a semiconductor device manufacturing exposure apparatus, called a stepper, is disclosed. A mark is provided by repeated patterns having specific pitches. These patterns are set so that at least one pitch of the patterns differs, on a light-receiving surface of an image sensor which receives an image of the mark, from a multiple, by an integral number, of the sampling pitch (pitch of picture elements) of the image sensor. In one preferred form, the mark is formed by repeated patterns of a number N (.gtoreq.2), wherein at least one pitch Pp of the patterns satisfies, on the light-receiving surface of the image sensor, a relationship Pp=(m+n/N).times.Pix where m is an arbitrary number, n is an integral number which satisfies 1.ltoreq.n.ltoreq.N, and Pix is the sampling pitch of the image sensor. The image of such a mark is photoelectrically converted to thereby determine the position of the mark.