Abstract: An optical device (10) includes a joining structure in which a first conductive film (110) and a second conductive film (130) are joined to each other. The first conductive film (110) that constitutes the joining structure is constituted by a conductive material. The second conductive film (130) that constitutes the joining structure is constituted by a metal material. Apart of the second conductive film (130) comes into contact with the first conductive film (110). A plurality of concave portions are provided in a contact surface of the second conductive film (130) which comes into contact with the first conductive film (110). The contact surface has a surface roughness greater than a surface roughness of a non-contact surface of the second conductive film (130) which does not come into contact with the first conductive film (110).

Abstract: An optical device includes a joining structure in which a first conductive film (110) and a second conductive film (130) are joined to each other. The first conductive film (110), which constitutes the joining structure, is constituted by a transparent conductive material and the like. The second conductive film (130), which constitutes the joining structure, is constituted by a metal material. A dispersing agent, which is constituted by a material different from the transparent conductive material, exists at a portion of the first conductive film (110) which is located at the periphery of the second conductive film (130).

Abstract: An optical device (10) has a joining structure in which a first conductive film (110) and a second conductive film (130) are joined to each other. The first conductive film (110) that constitutes the joining structure is constituted by a transparent conductive material and the like. In addition, the second conductive film (130) that constitutes the joining structure is constituted by a metal material. A transition region, in which the transparent conductive material and the metal material are mixed, exists between the first conductive film (110) and the second conductive film (130). The transparent conductive material includes, for example, a conductive polymer.

Abstract: A light-emitting device (10) includes a first light-emitting region (100) and a second light-emitting region (200). The first light-emitting region (100) emits a light ray having a first color by making a first light-emitting layer group including at least two or more kinds of light-emitting layers emit light. In addition, the second light-emitting region (200) emits alight ray having the first color (for example, daylight color, natural white color, white color, warm white color, or incandescent color) by making a second light-emitting layer group including at least two or more kinds of light-emitting layers emit light. In addition, at least one kind of light-emitting layer included in the second light-emitting layer group emits a light ray having a different spectrum peak from all of the light-emitting layers included in the first light-emitting layer group. Therefore, the color-rendering properties of light emitted from the light-emitting device (10) are improved.

Abstract: When a coating film 4 is formed on a substrate 1, on which elements 3 are formed, by an ALD film forming method or the like, the coating film 4 is partially removed in a simple step. A method for manufacturing an electronic device includes a step of coating the substrate 1 partially with a partially coating member 2, a step of forming the elements 3 on the substrate 1, a step of forming the coating film 4 on the substrate 1 to cover the elements 3 and the partially coating member 2, and a step of forming a crack 4A in the coating film 4 on the partially coating member 2.

Abstract: It is an object of the present invention to eliminate a color deviation possibly caused by a film formation failure in an organic layer of organic EL devices, thereby improving product yield. A method of manufacturing organic EL devices according to the invention comprises: a pre-treating step for forming lower electrodes and the like on a substrate, a film formation step to be performed after the pre-treating step for forming on the lower electrodes an organic layer containing at least an organic luminescent layer and also forming upper electrodes thereon, and a sealing step to be performed after the film formation step for sealing up the organic layer and the upper electrodes, characterized in that an inspection step is performed after the pre-treating step but before the formation of the upper electrodes.

Abstract: A method and an apparatus for fabricating a self-emission device are provided, including forming a bottom electrode on a substrate directly or via another layer and forming a top electrode on a stack of layers overlying the bottom electrode, in which no deposition defect portion is formed even in the presence of a foreign matter or a bump or a dip on a deposited surface such as on the bottom electrode. The apparatus includes a deposition chamber, a substrate holder for holding a substrate in the deposition chamber, a pressure control gas inflow path for introducing a pressure control gas into the deposition chamber, and a material gas generation portion, provided in the deposition chamber separately from the pressure control gas inflow path, for generating a deposition material gas. The bottom or top electrode or at least one of the stack of layers is deposited under pressure with the pressure control gas introduced into the deposition chamber.

Abstract: It is an object of the present invention to eliminate a color deviation possibly caused by a film formation failure in an organic layer of organic EL devices, thereby improving product yield. A method of manufacturing organic EL devices according to the invention comprises: a pre-treating step for forming lower electrodes and the like on a substrate, a film formation step to be performed after the pre-treating step for forming on the lower electrodes an organic layer containing at least an organic luminescent layer and also forming upper electrodes thereon, and a sealing step to be performed after the film formation step for sealing up the organic layer and the upper electrodes, characterized in that an inspection step is performed after the pre-treating step but before the formation of the upper electrodes.