Patents by Inventor Hiroki Yamasaki

Hiroki Yamasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230149994
    Abstract: Provided are: an upper work roll, radial bearings and a thrust bearing provided on a work side and a drive side of the upper work roll and supporting the upper work roll. Shift cylinders are provided on the work side of the upper work roll and apply forces in both a work side direction and a drive side direction to the thrust bearing. Shift cylinders are also provided on the drive side of the upper work roll and apply forces in both the work side direction and the drive side direction to the radial bearing 790B. The shift cylinders each apply a force in the same direction to the radial bearing and the thrust bearing when the upper work roll does not shift in an axial direction at least during rolling.
    Type: Application
    Filed: August 7, 2020
    Publication date: May 18, 2023
    Inventors: Kenji HORII, Toshihiro USUGI, Akihiro YAMAMOTO, Hikaru NAKAYA, Daisuke IWAKI, Hiroki YAMASAKI
  • Patent number: 11380407
    Abstract: According to one or more embodiments, a memory system includes a nonvolatile semiconductor memory, a capacitor, a constant current circuit, a measurement circuit, and a controller. The capacitor stores charges to be supplied to the nonvolatile semiconductor memory. The constant current circuit extracts the charge from the capacitor at a constant current. The measurement circuit measures a terminal voltage of the capacitor. The controller controls the nonvolatile semiconductor memory. The controller calculates a capacitance value of the capacitor based both on a resistance value of a leakage resistance of the capacitor and a change in the measured terminal voltage over time in each of a first period during which the capacitor naturally discharges and a second period during which the constant current circuit extracts the charge from the capacitor.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: July 5, 2022
    Assignee: KIOXIA CORPORATION
    Inventor: Hiroki Yamasaki
  • Patent number: 11371783
    Abstract: A disclosed loop heat pipe includes an evaporator configured to absorb heat from outside by a wall to evaporate a working fluid from a liquid phase to a gas phase; a condenser configured to condense a gas phase working fluid introduced from the evaporator into a liquid phase; an elastic wick configured to contact an inner wall of the evaporator by an elastic force from the elastic wick; and a wick deformation member configured to deform the elastic wick increase a contact pressure of the elastic wick against the inner wall of the evaporator.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: June 28, 2022
    Assignee: RICOH COMPANY, LTD.
    Inventors: Tomoyasu Hirasawa, Kiyotada Katoh, Takeshi Endoh, Takashi Tanaka, Toshihiko Baba, Keisuke Ikeda, Hiroki Yamasaki
  • Publication number: 20220084604
    Abstract: According to one or more embodiments, a memory system includes a nonvolatile semiconductor memory, a capacitor, a constant current circuit, a measurement circuit, and a controller. The capacitor stores charges to be supplied to the nonvolatile semiconductor memory. The constant current circuit extracts the charge from the capacitor at a constant current. The measurement circuit measures a terminal voltage of the capacitor. The controller controls the nonvolatile semiconductor memory. The controller calculates a capacitance value of the capacitor based both on a resistance value of a leakage resistance of the capacitor and a change in the measured terminal voltage over time in each of a first period during which the capacitor naturally discharges and a second period during which the constant current circuit extracts the charge from the capacitor.
    Type: Application
    Filed: February 25, 2021
    Publication date: March 17, 2022
    Inventor: Hiroki YAMASAKI
  • Publication number: 20190390918
    Abstract: A disclosed loop heat pipe includes an evaporator configured to absorb heat from outside by a wall to evaporate a working fluid from a liquid phase gas phase; a condenser configured to condense a gas phase working fluid introduced from the evaporator into a liquid phase; an elastic wick configured to contact an inner wall of the evaporator by an elastic force from the elastic wick; and a wick deformation member configured to deform the elastic wick increase a contact pressure of the elastic wick against the inner wall of the evaporator.
    Type: Application
    Filed: June 18, 2019
    Publication date: December 26, 2019
    Inventors: Tomoyasu Hirasawa, Kiyotada Katoh, Takeshi Endoh, Takashi Tanaka, Toshihiko Baba, Keisuke Ikeda, Hiroki Yamasaki
  • Publication number: 20190008187
    Abstract: An object of the present invention is to provide a dispersion stabilizer that has an effect of improving or stabilizing the dispersibility of solids insoluble in aqueous media and/or liquid components immiscible therewith. The above object can be achieved by a dispersion stabilizer comprising welan gum.
    Type: Application
    Filed: August 20, 2016
    Publication date: January 10, 2019
    Inventors: Takashi KONDA, Yasuharu SATO, Satoshi TOYOIZUMI, Makoto ONODERA, Hiroki YAMASAKI, Yuri SHIMA, Hiroyasu MIHARA, Eiji OKUDA, Minami TAKESONO, Kyousuke NAKAMURA, Yusuke FUJITA, Kazumi IWAI, Yudai SATO
  • Publication number: 20180317536
    Abstract: An object of the present invention is to provide a protein-containing food having a smooth, grittiness-free texture without aggregation or roughness of the protein, even after severe sterilization such as retort sterilization. The object of the present invention is achieved by a protein aggregation inhibitor comprising welan gum.
    Type: Application
    Filed: October 7, 2016
    Publication date: November 8, 2018
    Inventors: Kohei NAKAJIMA, Satoshi TOYOIZUMI, Eiji OKUDA, Masaharu SAGA, Hiroki YAMASAKI, Kazumi IWAI, Dai KAWASHIMA, Daizo HARA
  • Patent number: 10090077
    Abstract: The present invention provides a polyamide resin composition not only having an appropriate melt viscosity despite addition of a conductive filler thereto but also having excellent moldability, conductivity, low-temperature impact resistance, and fuel barrier properties. The present invention is a polyamide resin composition containing specific amounts of a polyamide, a modified resin, and a conductive filler. The polyamide contains: dicarboxylic acid units containing 50 mol % or more of terephthalic acid units and/or naphthalenedicarboxylic acid units; and diamine units containing 60 mol % or more of aliphatic diamine units having 4 to 18 carbon atoms, and has terminal amino groups in an amount of 5 to 60 ?mol/g. The modified resin has been modified with an unsaturated compound having a carboxyl group and/or an acid anhydride group.
    Type: Grant
    Filed: January 12, 2012
    Date of Patent: October 2, 2018
    Assignee: KURARAY CO., LTD.
    Inventors: Hiroe Kumazawa, Hiroki Yamasaki, Hideaki Suzuki, Kozo Tamura
  • Publication number: 20130295308
    Abstract: The present invention provides a polyamide resin composition not only having an appropriate melt viscosity despite addition of a conductive filler thereto but also having excellent moldability, conductivity, low-temperature impact resistance, and fuel barrier properties. The present invention is a polyamide resin composition containing specific amounts of a polyamide, a modified resin, and a conductive filler. The polyamide contains: dicarboxylic acid units containing 50 mol % or more of terephthalic acid units and/or naphthalenedicarboxylic acid units; and diamine units containing 60 mol % or more of aliphatic diamine units having 4 to 18 carbon atoms, and has terminal amino groups in an amount of 5 to 60 ?mol/g. The modified resin has been modified with an unsaturated compound having a carboxyl group and/or an acid anhydride group.
    Type: Application
    Filed: January 12, 2012
    Publication date: November 7, 2013
    Applicant: KURARAY CO., LTD.
    Inventors: Hiroe Kumazawa, Hiroki Yamasaki, Hideaki Suzuki, Kozo Tamura
  • Patent number: 7937183
    Abstract: A molded-component characteristic estimation device that estimates the stress-strain curve of each portion of a molded-component includes a storage unit that stores correlation data showing the correlation between solidification time and mechanical characteristics of a material for the molded-component; and a controller that estimates solidification time of each portion of the molded-component using a shape model of the molded-component, calculates a mechanical characteristic value of each portion based on the correlation data and the estimated solidification time, and estimates the stress-strain curve of each portion of the molded-component based on the calculated mechanical characteristic value. With this device, the stress-strain curve of each portion of the molded-component is estimated without actual measurement.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: May 3, 2011
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Hiroki Yamasaki, Yuan Zhong, Noritaka Takagi
  • Publication number: 20090098325
    Abstract: A semi-aromatic polyamide resin is provided which has a high level of residence stability, hot-water resistance and chemical resistance and is also excellent in adhesive properties and compatibility with other resins and the like. The semi-aromatic polyamide resin comprises: dicarboxylic acid units in which 50 to 100 mol % of the dicarboxylic acid units are aromatic dicarboxylic acid units; and diamine units in which 60 to 100 mol % of the diamine units are aliphatic diamine units having 9 to 13 carbon atoms. Furthermore, at least 10% of terminal groups of molecular chains of the polyamide resin are blocked with a terminal-blocking agent, and the amount of terminal amino groups of the molecular chains is 60 ?eq/g or more and 120 ?eq/g or less. In addition, [NH2]/[COOH]?6 is satisfied, where [NH2] (?eq/g) represents the amount of the terminal amino groups and [COOH] (?eq/g) represents the amount of terminal carboxyl groups.
    Type: Application
    Filed: March 17, 2006
    Publication date: April 16, 2009
    Applicant: KURARAY CO. LTD.
    Inventors: Koichi Uchida, Hirofumi Kikuchi, Tsugunori Kashimura, Takashi Yamashita, Hiroki Yamasaki
  • Patent number: 7472942
    Abstract: A vehicle side portion structure, which is applied to a vehicle body, has a pillar that is arranged at the side of a vehicle body and which extends in the substantially up and down directions of the vehicle; and a side door turnably supported around a door hinge attached to pillar. A preset gap is set between the surfaces of the pillar and the side door that face each other. A load-conveying component is provided at the gap or vicinity thereof, and this suppresses the rotational displacement of the pillar around the door hinge when a frontal collision load is input and makes the frontal collision load act upon the side door as an axial force towards the rear side of the vehicle.
    Type: Grant
    Filed: February 10, 2006
    Date of Patent: January 6, 2009
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Hiroki Yamasaki
  • Publication number: 20070270989
    Abstract: A molded-component characteristic estimation device that estimates the stress-strain curve of each portion of a molded-component includes a storage unit that stores correlation data showing the correlation between solidification time and mechanical characteristics of a material for the molded-component; and a controller that estimates solidification time of each portion of the molded-component using a shape model of the molded-component, calculates a mechanical characteristic value of each portion based on the correlation data and the estimated solidification time, and estimates the stress-strain curve of each portion of the molded-component based on the calculated mechanical characteristic value. With this device, the stress-strain curve of each portion of the molded-component is estimated without actual measurement.
    Type: Application
    Filed: May 11, 2007
    Publication date: November 22, 2007
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hiroki YAMASAKI, Yuan Zhong, Noritaka Takagi
  • Publication number: 20060197359
    Abstract: A vehicle side portion structure, which is applied to a vehicle body, has a pillar that is arranged at the side of a vehicle body and which extends in the substantially up and down directions of the vehicle; and a side door turnably supported around a door hinge attached to pillar. A preset gap is set between the surfaces of the pillar and the side door that face each other. A load-conveying component is provided at the gap or vicinity thereof, and this suppresses the rotational displacement of the pillar around the door hinge when a frontal collision load is input and makes the frontal collision load act upon the side door as an axial force towards the rear side of the vehicle.
    Type: Application
    Filed: February 10, 2006
    Publication date: September 7, 2006
    Inventor: Hiroki Yamasaki
  • Patent number: 6176543
    Abstract: A flange is formed at an upper edge of a lower arm, and the strength of an upper portion of the lower arm is set to be greater than the strength of a lower portion thereof. A fragile portion is formed in a longitudinally intermediate portion of the lower arm, and when an impact of a predetermined value or greater is applied in the rearward direction of the vehicle during a rear collision of the vehicle, the lower arm is adapted to absorb the impact by undergoing deformation beginning at the fragile portion. In addition, with respect to the load applied to the seat back from the rear by luggage or the like during a front collision of the vehicle, the deformation of the lower arm can be effectively suppressed by the flange.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: January 23, 2001
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Katsumi Nawata, Makoto Sekizuka, Atsushi Hiroshige, Hiroshi Tamura, Hiroki Yamasaki
  • Patent number: 5603305
    Abstract: An exhaust gas recirculation valve comprises a housing which constructs a part of an exhaust gas path for receiving exhaust gas from an exhaust pipe of an internal combustion engine, the housing accommodating a valve mechanism for controlling the amount of flow of the exhaust gas passing therethrough, a fixed cylinder disposed in the housing, a movable cylinder assembly composed of at least one movable cylinder disposed in the fixed cylinder, a piston movably disposed in the movable cylinder assembly for controlling an opening of the valve mechanism, and a pressure applying mechanism for respectively applying pressure to the movable cylinder and the piston so as to move them through respective predetermined strokes.
    Type: Grant
    Filed: December 14, 1995
    Date of Patent: February 18, 1997
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshihiko Miyake, Katsuyuki Nitta, Hiroki Yamasaki, Mutsuo Sekiya