Patents by Inventor Hirokiyo Nakase

Hirokiyo Nakase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11390744
    Abstract: More specifically, provided are a polyarylene sulfide resin composition including 100 parts by mass of a polyarylene sulfide resin and 1 to 100 parts by mass of an inorganic filler surface-treated with a sizing agent, wherein the sizing agent is a sizing agent (?) containing at least a urethane-modified epoxy resin having an alkoxy polyoxyalkylene structure and a urethane resin having a sulfonate group, a sizing agent (?) containing a copolymer (?1) having a mass average molecular weight of 5000 to 150000, which is obtained by radical copolymerization of a polymerizable monomer mixture of at least a (meth)acrylic acid ester and maleic acid (anhydride), or a sizing agent (?) containing at least a polyether resin, a urethane resin, and a silane coupling agent, a molded article thereof, an inorganic filler used for the composition, and methods for producing them.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: July 19, 2022
    Assignee: DIC Corporation
    Inventors: Keisuke Yamada, Hirokiyo Nakase, Takashi Goto, Masahiro Kajikawa
  • Publication number: 20200115552
    Abstract: More specifically, provided are a polyarylene sulfide resin composition including 100 parts by mass of a polyarylene sulfide resin and 1 to 100 parts by mass of an inorganic filler surface-treated with a sizing agent, wherein the sizing agent is a sizing agent (?) containing at least a urethane-modified epoxy resin having an alkoxy polyoxyalkylene structure and a urethane resin having a sulfonate group, a sizing agent (?) containing a copolymer (?1) having a mass average molecular weight of 5000 to 150000, which is obtained by radical copolymerization of a polymerizable monomer mixture of at least a (meth)acrylic acid ester and maleic acid (anhydride), or a sizing agent (?) containing at least a polyether resin, a urethane resin, and a silane coupling agent, a molded article thereof, an inorganic filler used for the composition, and methods for producing them.
    Type: Application
    Filed: July 2, 2018
    Publication date: April 16, 2020
    Inventors: Keisuke Yamada, Hirokiyo Nakase, Takashi Goto, Masahiro Kajikawa
  • Publication number: 20110287201
    Abstract: What is offered is: a polyarylene sulfide resin composition which includes 100 mass parts of a polyarylene sulfide resin (A), 0.1 to 8 mass parts of a metal fine particle (B) containing at least one metal species selected from the group consisting of copper, nickel, and zinc, and 0.1 to 5 mass parts of a thermoplastic elastomer (C); and a piping member for fluid obtained by molding of the pertinent resin composition. This piping member for fluid is useful for water-supply pipes, water-heater pipes, and the like in cold weather climates, as it is high in toughness at low-temperature, inhibits damage or rupture of pipes due to freezing, and also inhibits occurrence of creep deformation at high temperature.
    Type: Application
    Filed: November 16, 2009
    Publication date: November 24, 2011
    Applicant: DIC Corporation
    Inventors: Fumiaki Abe, Hirokiyo Nakase, Shifumi Aizawa, Yasuyuki Yoshino, Yutaka Maruyama, Michiya Nakashima, Kumiko Akiba
  • Patent number: 8044126
    Abstract: The present invention relates to a polyarylene sulfide resin composition, which comprises polyarylene sulfide (A) and polyamide (B) as essential components, and further includes an organic phosphorus compound (C), which is selected from the group consisting of an aromatic phosphite compound and an aromatic phosphonate compound, and an inorganic phosphorus compound (D), which is selected from the group consisting from a metal salt of phosphorous acid and a metal salt of hypophosphoric acid as essential components, in addition to the polyarylene sulfide (A) and the polyamide (B); a manufacturing method thereof; and a surface mount electronic component. The polyarylene sulfide resin composition has excellent heat resistance, does not decrease mechanical properties such as bending strength even if heating treatment is performed under the high temperature condition by passing through a reflow furnace, and has excellent flame retardance.
    Type: Grant
    Filed: January 28, 2009
    Date of Patent: October 25, 2011
    Assignee: DIC Corporation
    Inventors: Yasuyuki Yoshino, Hirokiyo Nakase, Hiroaki Negishi, Yohei Yamaguchi, Shinya Gibo
  • Publication number: 20100331463
    Abstract: The present invention relates to a polyarylene sulfide resin composition, which comprises polyarylene sulfide (A) and polyamide (B) as essential components, and further includes an organic phosphorus compound (C), which is selected from the group consisting of an aromatic phosfite compound and an aromatic phosphonaite compound, and an inorganic phosphorus compound (D), which is selected from the group consisting from a metal salt of phosphorous acid and a metal salt of hypophosphoric acid as essential components, in addition to the polyarylene sulfide (A) and the polyamide (B); a manufacturing method thereof; and a surface mount electronic component. The polyarylene sulfide resin composition has excellent heat resistance, does not decrease mechanical properties such as bending strength even if heating treatment is performed under the high temperature condition by passing through a reflow furnace, and has excellent flame retardance.
    Type: Application
    Filed: January 28, 2009
    Publication date: December 30, 2010
    Applicant: DIC CORPORATION
    Inventors: Yasuyuki Yoshino, Hirokiyo Nakase, Hiroaki Negishi, Yohei Yamaguchi, Shinya Gibo