Patents by Inventor Hiroko Akiyama

Hiroko Akiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package resin composition and usage method thereof
    Patent number: 9773714
    Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: September 26, 2017
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Kohichiro Kawate, Hiroko Akiyama, Naota Sugiyama, Brant U. Kolb, Eric G. Larson
  • Adhesive composition
    Patent number: 9333723
    Abstract: An adhesive composition is disclosed that comprises acrylic adhesive particles having an average diameter of 10 to 100 micrometers obtained by suspension polymerization of an acrylic monomer mixture which comprises a branched C 14-22 alkyl group containing (meth)acrylate and a polar monomer. The adhesive composition may be applied to an adhesive dressing or patch. The adhesive has excellent water vapor permeability, excellent adhesion to skin with low skin irritation when applied, less adhesive residue after peeling, and less keratin damage. The adhesive does not cause wetness or peeling from sweat while being worn.
    Type: Grant
    Filed: March 4, 2011
    Date of Patent: May 10, 2016
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Hiroko Akiyama, Yorinobu Takamatsu, Yoshiteru Kakinuma
  • Semiconductor package resin composition and usage method thereof
    Patent number: 9230873
    Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: January 5, 2016
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Kohichiro Kawate, Hiroko Akiyama, Naota Sugiyama, Brant U. Kolb, Eric G. Larson
  • Semiconductor Package Resin Composition and Usage Method Thereof
    Publication number: 20150329740
    Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.
    Type: Application
    Filed: July 28, 2015
    Publication date: November 19, 2015
    Inventors: Kohichiro Kawate, Hiroko Akiyama, Naota Sugiyama, Brant U. Kolb, Eric G. Larson
  • Semiconductor Package Resin Composition and Usage Method Thereof
    Publication number: 20140217622
    Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.
    Type: Application
    Filed: July 9, 2012
    Publication date: August 7, 2014
    Inventors: Kohichiro Kawate, Hiroko Akiyama, Naota Sugiyama, Brant U. Kolb, Eric G. Larson
  • ADHESIVE COMPOSITION
    Publication number: 20130260137
    Abstract: An adhesive composition is disclosed that comprises acrylic adhesive particles having an average diameter of 10 to 100 micrometers obtained by suspension polymerization of an acrylic monomer mixture which comprises a branched C 14-22 alkyl group containing (meth)acrylate and a polar monomer. The adhesive composition may be applied to an adhesive dressing or patch. The adhesive has excellent water vapor permeability, excellent adhesion to skin with low skin irritation when applied, less adhesive residue after peeling, and less keratin damage. The adhesive does not cause wetness or peeling from sweat while being worn.
    Type: Application
    Filed: March 4, 2011
    Publication date: October 3, 2013
    Inventors: Hiroko Akiyama, Yorinobu Takamatsu, Yoshiteru Kakinuma