Patents by Inventor Hiroko Amasaki

Hiroko Amasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8308967
    Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: November 13, 2012
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
  • Patent number: 8252423
    Abstract: There is provided a resin laminate having a layer construction of a first inorganic material layer/insulating layer/second inorganic material layer or a layer construction of an inorganic material layer/insulating layer, wherein the insulating layer has a multi-layer structure of two or more resin layers of a core insulating layer and an adhesive insulating layer. In this case, the resin laminate has the adhesive insulating layer which can realize optimal etching, is suitable for etching by a wet process, and has excellent adhesion. At least one of the layers constituting the insulating layer is formed of a polyimide resin which comprises repeating units represented by formula (1) and has a glass transition point of 150 to 360° C. and is dissolvable in a basic solution at a rate of more than 3 ?m/min, preferably more than 5 ?m/min, and most preferably more than 8 ?m/min.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: August 28, 2012
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Shigeki Kawano, Hiroko Amasaki, Hidetsugu Tazawa, Kazunari Ikeda, Kouhei Ohno
  • Publication number: 20110108519
    Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.
    Type: Application
    Filed: January 13, 2011
    Publication date: May 12, 2011
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya SAKAYORI, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
  • Publication number: 20110076855
    Abstract: There is provided a resin laminate having a layer construction of a first inorganic material layer/insulating layer/second inorganic material layer or a layer construction of an inorganic material layer/insulating layer, wherein the insulating layer has a multi-layer structure of two or more resin layers of a core insulating layer and an adhesive insulating layer. In this case, the resin laminate has the adhesive insulating layer which can realize optimal etching, is suitable for etching by a wet process, and has excellent adhesion. At least one of the layers constituting the insulating layer is formed of a polyimide resin which comprises repeating units represented by formula (1) and has a glass transition point of 150 to 360° C. and is dissolvable in a basic solution at a rate of more than 3 ?m/min, preferably more than 5 ?m/min, and most preferably more than 8 ?m/min.
    Type: Application
    Filed: October 25, 2010
    Publication date: March 31, 2011
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya SAKAYORI, Shigeki KAWANO, Hiroko AMASAKI, Hidetsugu TAZAWA, Kazunari IKEDA, Kouhei OHNO
  • Patent number: 7226806
    Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer—insulating layer—second inorganic material layer or a layer construction of inorganic material layer—insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: June 5, 2007
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
  • Publication number: 20070120229
    Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable byawet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer—insulating layer—second inorganic material layer or a layer construction of inorganic material layer—insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.
    Type: Application
    Filed: January 25, 2007
    Publication date: May 31, 2007
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
  • Patent number: 6942817
    Abstract: A wireless suspension blank is made using a two-layer laminate composed of a metallic layer with the spring property and an electrically insulating layer. The first method includes a first step for working the metallic layer by the photo etching method, a second step for forming a wiring part on the insulating layer by the semi-additive method and a third step for working the insulating layer by the wet-etching method. The second method includes a first step for working the metallic layer by the photo etching method, a second step for forming a wiring part on the insulating layer by the semi-additive method and a third step for working the insulating layer by the plasma etching method. The third method includes a first step for forming a wiring part on the metallic layer by the semi-additive method, a second step for working the metallic layer by the wet-etching method and a third step for working the insulating layer by the dry-etching method or the wet-etching method.
    Type: Grant
    Filed: March 21, 2001
    Date of Patent: September 13, 2005
    Assignee: Dainippon Printing Co., Ltd.
    Inventors: Hiroshi Yagi, Shigeki Kawano, Kazuo Umeda, Jiro Takei, Yukio Iimura, Satoshi Sasaki, Katsuya Sakayori, Hiroko Amasaki
  • Patent number: 6750148
    Abstract: A method of manufacturing a wireless suspension blank wherein three-layered laminate formed of a metallic layer having a spring property and a conductive layer laminated on the metallic layer through an electrically insulating layer are used. The laminate used is a laminate in which an insulating layer is formed of a core-insulating layer and adhesive layers laminated on both sides of the core-insulating layer, and the ratio of higher etching rate to lower etching rate of the respective layers of the insulating layer is between 6:1 and 1:1. The metallic layer and the conductive layer are processed by the photo etching method. The insulating layer is processed by the wet etching method.
    Type: Grant
    Filed: July 6, 2001
    Date of Patent: June 15, 2004
    Assignee: Dainippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Shigeki Kawano, Hiroko Amasaki, Kazuo Umeda, Satoshi Sasaki, Hiroshi Yagi
  • Patent number: 6709988
    Abstract: The present invention relates to a production process which, in the production of an electronic component by wet etching of an insulating layer in a laminate, is low in cost, does not use any organic solvent, which poses a problem of waste treatment. The production process of an electronic component comprises the steps of: wet etching a laminate of conductive inorganic material layer—insulating layer—conductive inorganic material layer or a laminate of conductive inorganic material layer—insulating layer to pattern the conductive inorganic material layer; and then performing wet etching to pattern the insulating layer. The patterning of the insulating layer by wet etching is carried out in a continuous form using a dry film resist; and, the dry film resist is laminated by roll pressing onto the laminate under a reduced pressure of not more than 80 KPa.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: March 23, 2004
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Shigeki Kawano, Hiroko Amasaki, Michiaki Uchiyama, Hiroshi Yagi
  • Publication number: 20040043232
    Abstract: A laminate having a layer structure of first inorganic layer-insulating layer-second inorganic layer or inorganic layer-insulating layer, characterized in that the insulating layer comprises two or more resin layers containing a core insulating layer and an adhesive insulating layer, and at least one layer constituting the insulating layer comprises a polyimide resin which has a recurring unit represented by the general formula (1), has a glass transition temperature of 150° C. to 360° C., and exhibits a rate of dissolution in a basic solution of 3 &mgr;/min or more, preferably 5 ?m/min or more, most preferably 8 &mgr;/min or more.
    Type: Application
    Filed: February 21, 2002
    Publication date: March 4, 2004
    Inventors: Katsuya Sakayori, Shigeki Kawano, Hiroko Amasaki, Hidetsugu Tazawa, Kazunari Ikeda, Kouhei Ohno
  • Publication number: 20030085451
    Abstract: The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer—insulating layer—second inorganic material layer or a layer construction of inorganic material layer—insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.
    Type: Application
    Filed: June 10, 2002
    Publication date: May 8, 2003
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Terutoshi Momose, Shigeki Kawano, Tomoko Togashi, Hiroko Amasaki, Nobuhiro Sakihama, Tsuyoshi Yamazaki, Michiaki Uchiyama, Hiroshi Yagi
  • Publication number: 20030052078
    Abstract: The present invention relates to a production process which, in the production of an electronic component by wet etching of an insulating layer in a laminate, is low in cost, does not use any organic solvent, which poses a problem of waste treatment, and can produce the electronic component with high accuracy and with significantly increased productivity.
    Type: Application
    Filed: March 28, 2002
    Publication date: March 20, 2003
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Shigeki Kawano, Hiroko Amasaki, Michiaki Uchiyama, Hiroshi Yagi
  • Publication number: 20020027127
    Abstract: A wireless suspension blank is made using a two-layer laminate composed of a metallic layer with the spring property and an electrically insulating layer. The first method includes a first step for working the metallic layer by the photo etching method, a second step for forming a wiring part on the insulating layer by the semi-additive method and a third step for working the insulating layer by the wet-etching method. The second method includes a first step for working the metallic layer by the photo etching method, a second step for forming a wiring part on the insulating layer by the semi-additive method and a third step for working the insulating layer by the plasma etching method. The third method includes a first step for forming a wiring part on the metallic layer by the semi-additive method, a second step for working the metallic layer by the wet-etching method and a third step for working the insulating layer by the dry-etching method or the wet-etching method.
    Type: Application
    Filed: March 21, 2001
    Publication date: March 7, 2002
    Inventors: Hiroshi Yagi, Shigeki Kawano, Kazuo Umeda, Jiro Takei, Yukio Iimura, Satoshi Sasaki, Katsuya Sakayori, Hiroko Amasaki
  • Publication number: 20020003127
    Abstract: A method of manufacturing a wireless suspension blank is a method of manufacturing a wireless blank in which three-layered laminate formed of a metallic layer having the spring property and a conductive layer laminated on the metallic layer through an electrically insulating layer are used, wherein as the laminate used is a laminate in which an insulating layer is formed of core-insulating layer and adhesive layers laminated on both sides of the core-insulating layer, and the ratio of higher etching rate to lower etching rate of the respective layers of the insulating layer is between 6:1 and 1:1. By the photo etching method processed are the metallic layer and the conductive layer. The insulating layer is processed by the wet etching method.
    Type: Application
    Filed: July 6, 2001
    Publication date: January 10, 2002
    Inventors: Katsuya Sakayori, Shigeki Kawano, Hiroko Amasaki, Kazuo Umeda, Satoshi Sasaki, Hiroshi Yagi