Patents by Inventor Hiroko Ikuta

Hiroko Ikuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070273012
    Abstract: A semiconductor device comprising, a layer on which a semiconductor element is arranged, an insulation layer on which a wiring connected to the semiconductor element is arranged, dummy metal plates arranged in the insulation layer, wherein the dummy metal plates have an aspect ratio larger than 1, and are arranged substantially perpendicularly to the wiring.
    Type: Application
    Filed: June 4, 2007
    Publication date: November 29, 2007
    Applicant: FUJITSU LIMITED
    Inventor: Hiroko Ikuta