Abstract: A management apparatus for managing a status of a plurality of storage cabinets whose use can be changed, includes a managing unit configured to collect storage cabinet information including the use of the plurality of storage cabinets and information relating to a usage status of the plurality of storage cabinets, and store the storage cabinet information in a storage unit; an acquiring unit configured to acquire information relating to a package to be stored; a storage cabinet managing unit configured to change the use of the storage cabinet; and an output unit configured to output information indicating a vacancy status of the storage cabinet corresponding to the use of the package, based on the information relating to the package and the storage cabinet information.

Abstract: A storage includes: an automatic transport part configured to move between a loading area where a user loads goods and a storage area where the goods loaded by the user are stored; a detecting part configured to detect a state in the loading area; and a determining part configured to determine whether the goods loaded in the loading area can be stored in the storage area, based on the state in the loading area detected by the detecting part.

Abstract: A management apparatus for managing a status of a plurality of storage cabinets whose use can be changed, includes a managing unit configured to collect storage cabinet information including the use of the plurality of storage cabinets and information relating to a usage status of the plurality of storage cabinets, and store the storage cabinet information in a storage unit; an acquiring unit configured to acquire information relating to a package to be stored; a storage cabinet managing unit configured to change the use of the storage cabinet; and an output unit configured to output information indicating a vacancy status of the storage cabinet corresponding to the use of the package, based on the information relating to the package and the storage cabinet information.

Abstract: A storage provided with a temperature adjustment area for storing an article, includes an arrangement determining unit configured to determine an arrangement in the temperature adjustment area, of an article to be stored in the temperature adjustment area or an article that is stored in the temperature adjustment area, according to status information of the temperature adjustment area and a temperature relating to the article.

Abstract: The eating timing of food/drink in a storage is adjusted according to the request of a receiver who receives the food/drink in the storage. A storage according to an embodiment of the present disclosure includes a control unit; and an actuator configured to adjust an environment based on an instruction from the control unit, wherein the control unit acquires information relating to food/drink in the storage and a specified date, and gives the instruction to the actuator regarding a control target value of a storage environment of the food/drink, based on the information relating to the food/drink and the specified date.

Abstract: A pickup and delivery or selling apparatus is transportable, and includes: a reserving section in which an article can be reserved; a receiving part in which the article to be reserved in the reserving section is received; a delivering part in which the article is delivered; a plurality of support members each used for supporting the article in the reserving section; a transfer unit configured to transfer the support members each supporting the article between the reserving section and either the receiving part or the delivering part; and an abnormality-managing unit configured to perform a predetermined response to an abnormality occurring in the support members.

Abstract: Provided is an alicyclic epoxy compound product used in applications for forming a cured product excellent in transparency and heat resistance. An alicyclic epoxy compound product of the present disclosure has a purity of a compound represented by Formula (1) of 85 wt. % or greater; and a total content of a compound represented by Formula (a) and a compound represented by Formula (b) of 0.5 wt. % or less, where X represents a single bond or a linking group. The alicyclic epoxy compound product of the present disclosure can be produced through subjecting a compound represented by Formula (1?) to a dehydration reaction to obtain a compound represented by Formula (1?), and reacting the resulting compound represented by Formula (1?) with an organic peracid.

Abstract: Provided is an epoxy-amine adduct. The epoxy-amine adduct is a compound that may be a compound I containing two or more amino groups per molecule, a compound corresponding to the compound I, except being modified with a compound II-1 containing two or more (meth)acryloyl groups per molecule, a compound corresponding to the compound I, except being modified with a lactone II-2, or a salt of the compound I. The compound I is an adduct between an epoxide (A) containing two or more cycloaliphatic epoxy groups per molecule and an amine (B) containing two or more amino groups per molecule. The compound I includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) and contains amino groups at both ends.

Abstract: Provided is a compound that contributes to better adhesion between resins and additive materials in polymer composites and is readily blendable with another component such as a resin. Related is an epoxy-amine adduct. The epoxy-amine adduct is a compound selected from the group consisting of a compound I containing two or more amino groups per molecule, a compound corresponding to the compound I, except being modified with a compound II-1 containing two or more (meth)acryloyl groups per molecule, a compound corresponding to the compound I, except being modified with a lactone II-2, and a salt of the compound I. The compound I is an adduct between an epoxide (A) containing two or more cycloaliphatic epoxy groups per molecule and an amine (B) containing two or more amino groups per molecule. The compound I includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) and contains amino groups at both ends.

Abstract: An object of the present invention is to provide a novel epoxy compound capable of forming a highly heat-resistant cured product. The epoxy compound of the present invention is a compound represented by the following formula (1): wherein X1 and X2 are the same or different and represent an alkylene group, an oxygen atom, a sulfur atom, or no bond; R represents a bivalent group having one or more atoms; R1 to R8 are the same or different and represent a hydrogen atom, an alkenyl group which may have a substituent, an epoxidized alkenyl group which may have a substituent, or an alkyl group which may have a substituent; and Y1 and Y2 are the same or different and are a bivalent group represented by the following formula (a): or a bivalent group represented by the following formula (b): provided that least one of R1 to R2 in formula (1) is an alkenyl group which may have a substituent, an epoxidized alkenyl group which may have a substituent, or an alkyl group which may have a substituent.

Abstract: A semiconductor device is disclosed that includes a substrate, a first wiring structure arranged on the substrate which first wiring structure includes a first insulating layer and a first wiring layer arranged within the first insulating layer, a second wiring structure arranged on the first wiring structure which second wiring structure includes a second insulating layer including a shock absorbing layer made of an insulating film and a second wiring layer arranged within the second insulating layer, and a third wiring structure arranged on the second wiring structure which third wiring structure includes a third insulating layer and a third wiring layer arranged within the third insulating layer. The fracture toughness value of the shock absorbing layer is arranged to be greater than the fracture toughness value of the first insulating film and the fracture toughness value of the third insulating film.

Abstract: A semiconductor element is formed over a surface of a semiconductor substrate. A first insulating film is formed over the surface of the semiconductor substrate, the first insulating film covering the semiconductor element. A second insulating film is formed over the first insulating film, the second insulating film having a dielectric constant lower than that of the first insulating film. A first wiring pattern is formed over the second insulating film. A conductive connection member buried in the second and first insulating films electrically interconnects the first wiring pattern and semiconductor element.

Abstract: A semiconductor element is formed over a surface of a semiconductor substrate. A first insulating film is formed over the surface of the semiconductor substrate, the first insulating film covering the semiconductor element. A second insulating film is formed over the first insulating film, the second insulating film having a dielectric constant lower than that of the first insulating film. A first wiring pattern is formed over the second insulating film. A conductive connection member buried in the second and first insulating films electrically interconnects the first wiring pattern and semiconductor element.

Abstract: A semiconductor element is formed over a surface of a semiconductor substrate. A first insulating film is formed over the surface of the semiconductor substrate, the first insulating film covering the semiconductor element. A second insulating film is formed over the first insulating film, the second insulating film having a dielectric constant lower than that of the first insulating film. A first wiring pattern is formed over the second insulating film. A conductive connection member buried in the second and first insulating films electrically interconnects the first wiring pattern and semiconductor element.

Abstract: On a substrate, a first insulating film, a first interlayer insulating film, a second and third insulating films, and a second interlayer insulating film are formed. Wire trenches are formed reaching the upper surface of the third insulating film, and via holes are formed from the bottom of the wire trench to the upper surface of the first insulating film. Formation of the wire trench is performed by etching the second interlayer insulating film under a condition in which the second interlayer insulating film is selectively etched. The third insulating film exposed at the bottoms of the wire trenches and the first insulating film exposed at the bottoms of the via holes are removed by etching under a condition in which the third insulating film is selectively etched. Wires are filled in the via holes and the wire trenches.

Abstract: A composition for the formation of an insulating film comprising a low dielectric constant polymeric material and a sublimating material, which are dissolved in a solvent. Preferred low dielectric constant polymeric materials include polyaryl ethers. Preferred sublimating materials include silicone compounds having a closed stereostructure having atoms at its vertexes, such as those known as Si-T8 and Si-T12. A method of forming a low dielectric constant insulating film and electronic parts or components using an insulating film formed thereby are also disclosed.