Abstract: A negative radiation-sensitive two-layer laminated film for forming bumps includes a lower layer that includes a composition including a polymer (A) with a specific structural unit and an organic solvent (B). A process for forming bumps uses the laminated film. The negative radiation-sensitive two-layer laminated film for forming bumps permits excellent printing of a solder paste, is patternable with good configuration, and is easily peeled from a substrate. The bump-forming process using the laminated film provides the same effects.

Abstract: A process is provided whereby thick platings such as bumps and wirings are produced with high precision while a resist shows high swelling resistance to a plating solution and the plating solution is prevented from leaking in between the pattern and substrate. A radiation-sensitive negative resin composition shows high sensitivity in the production process and possesses excellent resolution and heat resistance. A transfer film includes the composition.

Abstract: A substrate holder containing semiconductor substrates is held in an air-tight container for conveyance which is placed over the entrance of a chamber. The gas drawn by a first fan for circulating gas through the bottom wall of the chamber flows through a first duct for circulating gas so as to be cleaned by a first high-efficiency filter and to be supplied into the chamber again in a horizontal laminar flow. The clean gas is supplied into the chamber in a vertical laminar flow from a second duct for circulating gas which has a second fan for circulating gas and a second high-efficiency filter.