Abstract: A laser machining apparatus includes a height controller that performs an approach operation. The height controller uses a first approach speed and a first gain when performing the approach operation in a non-peripheral-edge portion of the workpiece, and uses a second approach speed lower than the first approach speed and a second gain lower than the first gain when performing the approach operation in a peripheral edge portion of the workpiece, and to make the time required when the approach operation is performed in the non-peripheral-edge portion of the workpiece shorter than the time required when the approach operation is performed in the peripheral edge portion of the workpiece.

Abstract: A laser beam machine cuts a workpiece into a plurality of parts and a remainder material. The machine includes a workpiece supporting unit including supports arranged at intervals and supporting the workpiece and a machining head radiating a laser beam to the workpiece. The machine includes a relative movement unit relatively moving the machining head and the workpiece supporting unit and a control apparatus controlling the relative movement unit and the machining head to cut the workpiece. The control apparatus forms, when cutting the workpiece, joints for coupling, to a partial remainder material that is a portion of the remainder material, both of a part that drops off from the supports after cutting and a part that cannot be attracted by the conveying and attracting unit after cutting such that the partial remainder material and the part are restricted from dropping from the supports and are attractable by the conveying and attracting unit.

Abstract: A laser machining apparatus includes a height controller that performs an approach operation. The height controller uses a first approach speed and a first gain when performing the approach operation in a non-peripheral-edge portion of the workpiece, and uses a second approach speed lower than the first approach speed and a second gain lower than the first gain when performing the approach operation in a peripheral edge portion of the workpiece, and to make the time required when the approach operation is performed in the non-peripheral-edge portion of the workpiece shorter than the time required when the approach operation is performed in the peripheral edge portion of the workpiece.

Abstract: A laser machining method includes a trial machining step of placing a machined material serving as a target of laser machining on a machining table and performing trial machining of the machined material before performing actual machining for cutting out a product from the machined material, wherein the trial machining step includes a cutting-out step of cutting out a trial-machining cut piece having a preset shape from a trial machining area that is set in the machined material by laser machining, a detecting step of detecting whether the trial-machining cut piece remains in the machined material by using the machined material having undergone the cutting-out step as a target to confirm whether the trial-machining cut piece is present, and a determining step of determining whether shifting to the actual machining is permitted according to a detection result at the detecting step.

Abstract: A laser processing apparatus in which a workpiece is placed on a work support base that supports the workpiece at a plurality of support points and performs, while moving a processing head in a horizontal direction with respect to the workpiece, laser processing on the workpiece on the work support base by the processing head, includes a tilt judging unit that judges, based on a positional relationship between a product chip that is to be separated from the workpiece when the workpiece is subjected to laser processing and support points, whether the product chip tilts in a height direction and projects upward on a side of the processing head from the workpiece before laser processing; and a drive control unit that controls a height of the processing head with respect to the workpiece when moving the processing head to a processing position for a next product chip after completing laser processing on the product chip based on a judgment result of the tilt judging unit.

Abstract: A control apparatus for controlling a laser processing machine, includes: a HDD as data storing means for storing shape data on a shape of a processed part to which laser processing of the laser processing machine is applied and data on a processing condition of the laser processing machine; and a CPU as processing condition adjusting means for performing adjustment of the processing condition with reference to the shape data and the data on the processing condition stored in the data storing means. The shape data that is acquired as to a work when the work to which the laser processing is applied is determined to be a defective item and the data on the processing condition that is adjusted by the processing condition adjusting means according to the determination of being a defective item are accumulated in the data storing means in association with each other.

Abstract: It aims to improve electron emission efficiency in an electron beam apparatus which includes laminated electron-emitting devices. To achieve this, there are provided an insulating member which has a concave portion on its surface, a cathode which is positioned astride a side surface of the insulating member and an inner surface of the concave portion, a gate which is positioned opposite to the cathode, and a protruding portion which is formed on the gate. In this constitution, the low potential surface of the cathode which is positioned inside the concave portion is inclined to the side of the gate from the entrance toward the interior of the concave portion.

Abstract: A manufacturing method of an electron-emitting device according to the present invention includes the steps of: preparing a substrate having a first electrode and a second electrode, and a conductive film for connecting the first electrode and the second electrode; and forming a gap on the conductive film by applying a voltage between the first electrode and the second electrode; wherein a planar shape of the conductive film has a V-shape portion between the first electrode and the second electrode.

Abstract: A laser processing apparatus in which a workpiece is placed on a work support base that supports the workpiece at a plurality of support points and performs, while moving a processing head in a horizontal direction with respect to the workpiece, laser processing on the workpiece on the work support base by the processing head, includes a tilt judging unit that judges, based on a positional relationship between a product chip that is to be separated from the workpiece when the workpiece is subjected to laser processing and support points, whether the product chip tilts in a height direction and projects upward on a side of the processing head from the workpiece before laser processing; and a drive control unit that controls a height of the processing head with respect to the workpiece when moving the processing head to a processing position for a next product chip after completing laser processing on the product chip based on a judgment result of the tilt judging unit.

Abstract: The shortest distance L [?m] from an arbitrary point on an exposed insulating surface on a base to a conductive member on the base and a sheet resistivity Rs [?/?] of the arbitrary point satisfy Rs×L2<4.2×1022 [?×?m2]. By this, in an image display apparatus having an electron-emitting device, an increase in the potential of an insulating surface on a substrate is suppressed and deterioration in the electron-emitting device is prevented, without using an antistatic film, etc.

Abstract: It aims to improve electron emission efficiency in an electron beam apparatus which includes laminated electron-emitting devices. To achieve this, there are provided an insulating member which has a concave portion on its surface, a cathode which is positioned astride a side surface of the insulating member and an inner surface of the concave portion, a gate which is positioned opposite to the cathode, and a protruding portion which is formed on the gate. In this constitution, the low potential surface of the cathode which is positioned inside the concave portion is inclined to the side of the gate from the entrance toward the interior of the concave portion.

Abstract: A manufacturing method of an electron-emitting device according to the present invention includes the steps of: preparing a substrate having a first electrode and a second electrode, and a conductive film for connecting the first electrode and the second electrode; and forming a gap on the conductive film by applying a voltage between the first electrode and the second electrode; wherein a planar shape of the conductive film has a V-shape portion between the first electrode and the second electrode.