Patents by Inventor Hirokuni Miyazaki

Hirokuni Miyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7552528
    Abstract: In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second height position. This makes it possible to decrease a gap between an upper end portion of an expanding ring and a lower face of the wafer sheet and allows efficient and uniform processing. Moreover, setting the height position so as to avoid the contact between the wafer sheet and the upper end portion of the expanding ring at least when the slack removal processing is completed reliably prevents shrinking operation of the wafer sheet from being disturbed by the contact between the wafer sheet and the upper end portion.
    Type: Grant
    Filed: May 19, 2005
    Date of Patent: June 30, 2009
    Assignee: Panasonic Corporation
    Inventors: Shoriki Narita, Shuichi Hirata, Takafumi Tsujisawa, Hirokuni Miyazaki, Satoshi Shida
  • Publication number: 20080141526
    Abstract: In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.
    Type: Application
    Filed: February 11, 2008
    Publication date: June 19, 2008
    Inventors: Shoriki Narita, Shuichi Hirata, Kanji Hata, Hirokuni Miyazaki, Youhei Matsumoto
  • Patent number: 7350289
    Abstract: In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.
    Type: Grant
    Filed: December 1, 2003
    Date of Patent: April 1, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shoriki Narita, Shuichi Hirata, Kanji Hata, Hirokuni Miyazaki, Youhei Matsumoto
  • Publication number: 20080010818
    Abstract: In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second height position. This makes it possible to decrease a gap between an upper end portion of an expanding ring and a lower face of the wafer sheet and allows efficient and uniform processing. Moreover, setting the height position so as to avoid the contact between the wafer sheet and the upper end portion of the expanding ring at least when the slack removal processing is completed reliably prevents shrinking operation of the wafer sheet from being disturbed by the contact between the wafer sheet and the upper end portion.
    Type: Application
    Filed: May 19, 2005
    Publication date: January 17, 2008
    Inventors: Shoriki Narita, Shuichi Hirata, Takafumi Tsujisawa, Hirokuni Miyazaki, Satoshi Shida
  • Publication number: 20060104754
    Abstract: In component feeding head appratus, a head unit having a holding for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.
    Type: Application
    Filed: December 1, 2003
    Publication date: May 18, 2006
    Inventors: Shoriki Narita, Shuichi Hirata, Kanji Hata, Hirokuni Miyazaki, Youhei Matsumoto