Abstract: An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1. n represents an integer from 0 to 10. In Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.

Abstract: An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1. n represents an integer from 0 to 10. In Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.

Abstract: An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1. n represents an integer from 0 to 10. In Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.

Abstract: A film-like epoxy resin composition includes an epoxy resin (A); a curing agent (B); a cure accelerator (C);an inorganic filler (D); and an organic solvent (E). The film-like epoxy resin composition satisfies all the following requirements (1) to (4): (1) at least one of the epoxy resin (A) and the curing agent (B) contains a component being a liquid at 25° C. in an amount of 30% by mass or more based on the total mass of the epoxy resin (A) and the curing agent (B); (2) the content of a volatile portion that volatilizes by being heated at 180° C. for 10 minutes is 0.2% to 1.5% by mass based on the total amount of the epoxy resin composition; (3) the minimum melt viscosity in temperature rising from 40° C. to 200° C. is 800 Pa·s or less; and (4) the film thickness is 50 to 500 ?m.

Abstract: Provided is a film-like epoxy resin composition including an epoxy resin (A); a curing agent (B); a cure accelerator (C); an inorganic filler (D); and an organic solvent (E) and satisfying all the following requirements (1) to (4): (1) at least one of the epoxy resin (A) and the curing agent (B) contains a component being a liquid at 25° C. in an amount of 30% by mass or more based on the total mass of the epoxy resin (A) and the curing agent (B); (2) the content of a volatile portion that volatilizes by being heated at 180° C. for 10 minutes is 0.2% to 1.5% by mass based on the total amount of the epoxy resin composition; (3) the minimum melt viscosity in temperature rising from 40° C. to 200° C. is 800 Pa·s or less; and (4) the film thickness is 50 to 500 nm.

Abstract: An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1. n represents an integer from 0 to 10. In Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.