Patents by Inventor Hiromasa Amma

Hiromasa Amma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9975346
    Abstract: Provided are a liquid ejection head, a liquid ejection apparatus and a manufacturing method for the liquid ejection head which make it possible to achieve both of high-speed printing and a reduction in number of recovering operations. A liquid chamber which is formed in a part of a flow passage that guides liquid to an ejection element substrate includes plural supply paths which are able to supply the liquid by capillarity, are connected together and are different from one another in width.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: May 22, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiromasa Amma, Mikiya Umeyama, Genji Inada, Takuya Iwano, Yasuyuki Takanaka, Masaya Uetsuki
  • Patent number: 9969167
    Abstract: A liquid ejection head has a plurality of ejection ports for ejecting a liquid, and a housing provided with a pair of liquid chambers which supply the liquid to a corresponding ejection port. A method for manufacturing the liquid ejection head includes: arranging a pair of mold pieces, of which width decreases gradually, to adjoin in the width direction thereof with the width decreasing in the opposite directions, molding a housing, and forming the pair of liquid chambers by drawing the pair of mold pieces from the molded housing in the direction in which the width increases.
    Type: Grant
    Filed: March 21, 2016
    Date of Patent: May 15, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiromasa Amma, Mikiya Umeyama, Genji Inada, Takuya Iwano
  • Patent number: 9931850
    Abstract: A housing and a cover member are injection-molded and these housing and cover member are joined within a pair of mold. When the housing and the cover member are joined by molten resin, a mold for suppressing deformation is positioned at a face of the housing opposite to a face receiving a pressure of the molten resin.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: April 3, 2018
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Takuya Iwano, Yukuo Yamaguchi, Mikiya Umeyama, Satoshi Oikawa, Hiromasa Amma, Satoshi Kimura, Naoko Tsujiuchi, Yasushi Iijima, Kyosuke Toda
  • Publication number: 20180086064
    Abstract: An opposed surface of a first flow path forming member has a groove portion forming a supply passage, and a protruding portion protruding from the edge of the groove portion to form the side wall of the groove portion. An opposed surface of a second flow path forming member has a lid portion that abuts against the protruding portion of the first flow path forming member to cover the opening of the groove portion in the first flow path forming member. A joining member is formed by injection-molding of a resin to abut against an outer surface of the protruding portion of the first flow path forming member and the opposed surfaces of the first and second flow path forming members.
    Type: Application
    Filed: September 14, 2017
    Publication date: March 29, 2018
    Inventors: Satoshi Kimura, Yukuo Yamaguchi, Mikiya Umeyama, Yasushi Iijima, Kyosuke Toda, Naoko Tsujiuchi, Hiromasa Amma, Takuya Iwano, Satoshi Oikawa
  • Patent number: 9902163
    Abstract: A liquid ejecting head and a liquid ejecting apparatus that can suppress the influence of noise on a control signal includes a plurality of terminals for being electrically connected with a contact point provided in a liquid ejecting apparatus, and a liquid ejecting element substrate having a liquid ejecting element formed for ejecting liquid in response to a control signal transmitted from the liquid ejecting apparatus. The plurality of terminals includes signal terminals and ground terminals for control, for controlling the liquid ejecting element, and the signal terminals and the ground terminals for control are arranged at positions closer to the liquid ejecting element substrate than other terminals.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: February 27, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shimpei Yoshikawa, Chiaki Muraoka, Tokuji Kudo, Hiromasa Amma, Takuya Iwano, Kimiyuki Hayasaki
  • Patent number: 9884485
    Abstract: A liquid ejecting head and a liquid ejecting apparatus are designed so as to suppress the influence of noise on control signals. The liquid ejecting head has a plurality of terminals electrically connected with a contact point provided in the liquid ejecting apparatus, and a liquid ejecting element substrate having a liquid ejecting element formed for ejecting liquid in response to the control signals transmitted from the liquid ejecting apparatus. A power source terminal for drive and a ground terminal for drive, which are provided for driving the liquid ejecting element, are arranged adjacent to each other, and a power source wiring that connects the power source terminal for drive with the liquid ejecting element substrate and a ground wiring that connects the ground terminal for drive with the liquid ejecting element substrate are at least partially arranged in parallel.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: February 6, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shimpei Yoshikawa, Chiaki Muraoka, Tokuji Kudo, Hiromasa Amma, Takuya Iwano, Kimiyuki Hayasaki
  • Publication number: 20180029266
    Abstract: There is provided a liquid supply member capable of suppressing deformation of a liquid supply path and decrease in sealing property of a liquid supply path, during molding, and a manufacturing method of the liquid supply member. For that purpose, in die-slide injection molding that combines two components, a protection portion that protects a part of one component easily affected by heat and pressure, is provided on the other component.
    Type: Application
    Filed: July 13, 2017
    Publication date: February 1, 2018
    Inventors: Naoko Tsujiuchi, Yukuo Yamaguchi, Mikiya Umeyama, Satoshi Oikawa, Hiromasa Amma, Takuya Iwano, Satoshi Kimura, Yasushi Iijima, Kyosuke Toda
  • Publication number: 20180029267
    Abstract: There is provided a manufacturing method of a liquid supply member capable of suppressing decrease in sealing property of a liquid supply path and deformation of the liquid supply path or the external shape. For that purpose, a manufacturing process of a liquid supply member prevents inflow of a molten resin into a concave portion of a portion other than a liquid supply flow path in a liquid supply member.
    Type: Application
    Filed: July 13, 2017
    Publication date: February 1, 2018
    Inventors: Naoko Tsujiuchi, Yukuo Yamaguchi, Mikiya Umeyama, Satoshi Oikawa, Hiromasa Amma, Takuya Iwano, Satoshi Kimura, Yasushi Iijima, Kyosuke Toda
  • Publication number: 20180001527
    Abstract: A resin molding method includes a first molding step of molding a first molded part and a second molded part in a mold and a second molding step of joining the first molded part and the second molded part. In the first molding step, the second molded part is formed by injecting resin into an area where a first core movable in the first direction and a second core movable in a second direction are engaged. In the second molding step, the second molded part is joined to the first molded part by injecting the resin while the first core is in contact with the second molded part and the second core is removed from the second molded part. Areas where the first core and the second core are located in the first molding step become hollow areas connected to each other and part of ends of the first core in the first direction is not in contact with the second core.
    Type: Application
    Filed: June 23, 2017
    Publication date: January 4, 2018
    Inventors: Yasushi Iijima, Yukuo Yamaguchi, Mikiya Umeyama, Satoshi Oikawa, Hiromasa Amma, Takuya Iwano, Satoshi Kimura, Naoko Tsujiuchi, Kyosuke Toda
  • Publication number: 20170368829
    Abstract: A filter is compressed between facing surfaces of a first configuration component and a second configuration component, and a molten resin is poured in such a compressed state. Injection molding of the first configuration component and the second configuration component, joining of the configuration components, and sealing of the circumference of the filter are performed by a pair of metal molds.
    Type: Application
    Filed: June 21, 2017
    Publication date: December 28, 2017
    Inventors: Kyosuke Toda, Yukuo Yamaguchi, Mikiya Umeyama, Satoshi Oikawa, Hiromasa Amma, Takuya Iwano, Satoshi Kimura, Naoko Tsujiuchi, Yasushi Iijima
  • Publication number: 20170368728
    Abstract: A resin molding method includes a first molding step, a sliding step, a second molding step and a mold opening step. In the first molding step, first molded part supported in a fixed mold and a second molded part supported in a die slide mold are molded in different positions in a second direction. In the sliding step, the movable mold is removed in a first direction and the first molded part and the second molded part are aligned by the die slide mold is moved in the second direction. In the second molding step, the movable mold is clamped again with the fixed mold and resin is injected into engaged portions. Each of the first molded part and the second molded part includes at least one wall extending in the first direction, and in the second molding step, the first molded part and the second molded part are engaged with each other at sides of the walls extending in the first direction.
    Type: Application
    Filed: June 21, 2017
    Publication date: December 28, 2017
    Inventors: Satoshi Oikawa, Yukuo Yamaguchi, Mikiya Umeyama, Hiromasa Amma, Takuya Iwano, Satoshi Kimura, Naoko Tsujiuchi, Yasushi Iijima, Kyosuke Toda
  • Patent number: 9832864
    Abstract: A liquid ejection head includes a circuit board having a wire pattern divided into a plurality of portions in order to provide the circuit board with very reliable bonding.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: November 28, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Junichiro Iri, Ryo Sato, Kazuhiro Idogawa, Chiaki Muraoka, Hiromasa Amma, Takuya Iwano
  • Patent number: 9770911
    Abstract: In a liquid ejection head and a liquid ejection apparatus that can suppress deterioration of image quality, a plurality of second beam-shaped member is provided on the downstream side of a first beam-shaped member in a flow passage connected to an ejection element substrate. The first beam-shaped member divides the flow passage into two flow passages in a liquid-flowing direction and the second beam-shaped member sandwich a line extending from the first beam-shaped member in the liquid-flowing direction.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: September 26, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Genji Inada, Hiromasa Amma, Takuya Iwano, Chiaki Muraoka, Tokuji Kudo, Shimpei Yoshikawa, Monta Matsui
  • Patent number: 9764554
    Abstract: There is provided a method for manufacturing a molded member having a hollow part. The method comprises a step for molding the hollow part by extracting a first piece, a second piece, a third piece and a fourth piece of a mold in four different directions. The second piece has an elongated shape in its extracting direction, the second piece and the fourth piece have extracting directions substantially opposed to each other, and at the molding, each of the first piece, the second piece, the third piece and the fourth piece abuts on at least one of the first piece, the second piece, the third piece and the fourth piece.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: September 19, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Hiromasa Amma, Yukuo Yamaguchi, Mikiya Umeyama, Satoshi Oikawa, Takuya Iwano, Satoshi Kimura, Naoko Tsujiuchi, Yasushi Iijima, Kyosuke Toda
  • Patent number: 9751318
    Abstract: A holding member provided in a liquid ejection apparatus is attached to a receiving member and includes a capturing portion capturing a supply member so as to hold the supply member. The capturing portion is displaceable while the holding member is attached to the receiving member.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: September 5, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takuya Iwano, Hiromasa Amma, Takeshi Sekino, Noboru Shimoyama, Shuichi Hasegawa
  • Patent number: 9744767
    Abstract: A liquid discharge head includes a wiring portion; a print element board including an element for applying discharge energy to liquid; and an electric wiring board including a connecting portion connected to the wiring portion and electrically connecting the wiring portion and the print element board. The connecting portion is provided with a cut portion at a position between both end portions in a width direction of the connecting portion, and a length of the cut portion in the width direction is shorter than a length of the cut portion in a direction orthogonal to the width direction.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: August 29, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Naruyuki Nojo, Hiromasa Amma, Takuya Iwano
  • Patent number: 9718274
    Abstract: In a liquid ejection head and a liquid ejection apparatus capable of reducing the occurrence of ejection malfunction, in a connecting section where a first flow channel and a second flow channel connect, a projecting member is provided on the flow channel wall forming the second flow channel.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: August 1, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Genji Inada, Hiromasa Amma, Takuya Iwano, Chiaki Muraoka, Tokuji Kudo, Shimpei Yoshikawa
  • Publication number: 20170120588
    Abstract: A liquid discharge head includes a recording element substrate including a recording element, an electronic substrate disposed outside the recording element substrate, an electric element mounted on the electronic substrate, a housing that supports the recording element substrate and the electronic substrate and is made of a first resin material, and a cover member that surrounds and shields the electric element and is made of a second resin material, wherein the second resin material has higher heat resistance than the first resin material.
    Type: Application
    Filed: October 25, 2016
    Publication date: May 4, 2017
    Inventors: Chiaki Muraoka, Yukuo Yamaguchi, Mikiya Umeyama, Hiromasa Amma, Takuya Iwano, Tokuji Kudo, Shimpei Yoshikawa
  • Publication number: 20160346970
    Abstract: There is provided a manufacturing method for molding a liquid supply member by using a first mold and a second mold. The method includes a first molding step of performing injection molding to form a first component part of the liquid supply member and a plurality of component parts of the liquid supply member other than the first component part at different positions from each other, with the first and the second mold closed relative to each other, a contacting step of moving each of the formed plurality of component parts relatively to the first component part to bring the formed first component part into contact with the formed plurality of component parts, with the first and the second mold opened relative to each other, and a second molding step of performing injection molding to join the first component part and the plurality of component parts.
    Type: Application
    Filed: May 18, 2016
    Publication date: December 1, 2016
    Inventors: Satoshi Oikawa, Yukuo Yamaguchi, Mikiya Umeyama, Hiromasa Amma, Takuya Iwano, Satoshi Kimura, Naoko Tsujiuchi, Yasushi Iijima, Kyosuke Toda
  • Publication number: 20160346969
    Abstract: Provided is construction that in die slide injection molding, surely leaves each part in a mold on a specified side in the stage of opening a molding mold. In order to accomplish this, in an opening step, a push-out mechanism that applies a force on at least one of the individual parts is used to make the part surely belong to a desired mold.
    Type: Application
    Filed: May 17, 2016
    Publication date: December 1, 2016
    Inventors: Kyosuke Toda, Yukuo Yamaguchi, Mikiya Umeyama, Satoshi Oikawa, Hiromasa Amma, Takuya Iwano, Satoshi Kimura, Naoko Tsujiuchi, Yasushi Iijima