Abstract: According to one embodiment, an information processing device includes processing circuitry configured to calculate a first index based on a plurality of pieces of first prediction data on an amount of electric power generated by a first electric power generation resource and a penalty imposed when an amount of electric power supplied to an electric power system is insufficient or excessive for a first amount of electric power which corresponds to a planned value of electric power generation amount, the first index being an index related to a yield obtained in a case that the first amount of electric power is tentatively bid in a first market; and determine a second amount of electric power to be bid in the first market based on the first index.

Abstract: An image processing apparatus includes a movement estimation unit that estimates, on the basis of a first timestamp provided to an image captured by synchronous scanning, an event signal generated corresponding to an intensity change of light at one or a plurality of pixels of the image, and a second timestamp that is provided to the event signal and is in synchronism with the first timestamp, a movement of an imaging target in the image, an inverse filter generation unit that generates an inverse filter on the basis of the movement, and a filter application unit that applies the inverse filter to the image.

Abstract: A first support is open toward a first side in an axial direction. A press member is at such a position as to press a first friction plate and second friction plate of a friction clutch device from the first side in the axial direction. An intermediate member includes a body between the press member and a second support in the axial direction and a protrusion protruding toward the first side of the body in the axial direction. The press member has an insertion hole extending through the press member in the axial direction and configured to receive the protrusion.

Abstract: A first support is open toward a first side in an axial direction. A press member is at such a position as to press a first friction plate and second friction plate of a friction clutch device from the first side in the axial direction. An intermediate member includes a body between the press member and a second support in the axial direction and a protrusion protruding toward the first side of the body in the axial direction. The press member has an insertion hole extending through the press member in the axial direction and configured to receive the protrusion.

Abstract: A semiconductor device includes: a first chip to restrict current flow in a first direction through a current path; a second chip to restrict the current flow in a second direction opposite to the first direction, through the current path; a wiring having one end connected to the first chip and the other end connected to the second chip, and provided as a part of the current path by relaying the first chip and the second chip; a lead frame having a first lead arranged and fixed with the first chip and a second lead is arranged and fixed with the second chip; and molding resin sealing the first chip, the second chip, the wiring and the lead frame. The wiring is a shunt resistor having a resistive body. The lead frame further has a sense terminal to detect a voltage drop across the resistive body.

Abstract: Adhesive matter remaining at the end of a cuboid metal material is reliably removed in a relatively short time while suppressing the decrease in yield rate of the metal material. Distances of the upper surface and the lower surface of a cuboid metal material from a reference position are measured using a distance measurement device in the longitudinal direction of the slab including the longitudinal end of the slab. On the basis of the measurement results, the state of remaining of adhesive matter remaining on the upper and lower surfaces of the longitudinal end of the slab is comprehended. On the basis of the state of remaining of adhesive matter, the amount and position of cutting by a cutting tool is determined. Corner removing cutting is performed on the upper and lower surfaces of the longitudinal end of the slab using the cutting tool in accordance with the determined amount and position of cutting.

Abstract: A semiconductor device includes: a first chip to restrict current flow in a first direction through a current path; a second chip to restrict the current flow in a second direction opposite to the first direction, through the current path; a wiring having one end connected to the first chip and the other end connected to the second chip, and provided as a part of the current path by relaying the first chip and the second chip; a lead frame having a first lead arranged and fixed with the first chip and a second lead is arranged and fixed with the second chip; and molding resin sealing the first chip, the second chip, the wiring and the lead frame. The wiring is a shunt resistor having a resistive body. The lead frame further has a sense terminal to detect a voltage drop across the resistive body.

Abstract: A shunt resistor has a resistance element with a predetermined resistivity at least at a part, and the shunt resistor to which a bonding wire is to be connected. The bonding wire is for detecting a value of current flowing between two electrodes bridged through the shunt resistor by detecting a voltage drop at the resistance element. The shunt resistor includes: a pair of connection parts to be respectively electrically connected to the two electrodes; a bridge part having the resistance element, extending from one of the connection parts to the other of the connection parts, and bridging the pair of connection parts; and a mark configured to define a virtual line segment. The mark is arranged to allow the virtual line segment to be oblique with respect to an extending direction of the bridge part.

Abstract: An electronic device includes first to third terminals and a clip. The clip includes first to third joint portions and a connection portion. The first to third joint portions correspond to and are bonded to the first to third terminals, respectively. The connection portion connects the first to third joint portions. One terminal in the first to third terminals has a depressed portion depressed to one side in a predetermined direction to store a conductive bonding material. A variation in positions of the first to third terminals in the predetermined direction is absorbed by deformation of the conductive bonding material when one joint portion in the first to third joint portions corresponding to the one terminal is bonded to the one terminal through the conductive bonding material.

Abstract: A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded.

Abstract: Adhesive matter remaining at the end of a cuboid metal material is reliably removed in a relatively short time while suppressing the decrease in yield rate of the metal material. Distances of the upper surface and the lower surface of a cuboid metal material from a reference position are measured using a distance measurement device in the longitudinal direction of the slab including the longitudinal end of the slab. On the basis of the measurement results, the state of remaining of adhesive matter remaining on the upper and lower surfaces of the longitudinal end of the slab is comprehended. On the basis of the state of remaining of adhesive matter, the amount and position of cutting by a cutting tool is determined. Corner removing cutting is performed on the upper and lower surfaces of the longitudinal end of the slab using the cutting tool in accordance with the determined amount and position of cutting.

Abstract: A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded.

Abstract: A wiring member includes a first leg portion, a second leg portion, a third leg portion, a first connecting wall and a second connecting wall. The first leg portion is electrically connected to a first conductive portion. The second leg portion is electrically connected to a second conductive portion. The third leg portion is electrically connected to a third conductive portion. The first connecting wall connects the first leg portion and the second leg portion. The second connecting wall connects the second leg portion and the third leg portion. The first leg portion, the second leg portion, and the third leg portion are non-linearly arranged.

Abstract: An insulating substrate includes: a transparent insulating layer; a first metal layer that is provided on a first face of the transparent insulating layer; and a second metal layer that is provided on a second face of the transparent insulating layer that is opposite from the first face. The first face of the transparent insulating layer is formed with an exposed section that is an area not provided with the first metal layer. The second metal layer includes an area that is overlapped with the exposed section when seen in an orthogonal direction to the first face.

Abstract: In a semiconductor module, an upper arm switching element is integrated to a high-potential conductor coupled to a high-potential electrode of a power source, and a lower arm switching element is integrated to a load conductor coupled to a load. A first connecting conductor has a first end connected to the upper arm switching element and a second end connected to the load conductor. A second connecting conductor has a first end connected to the lower arm switching element and a second end connected to a low-potential conductor coupled to a low-potential electrode of the power source. At least one of the first connecting conductor and the second connecting conductor serves as a shunt resistor for detecting an electric current flowing in the at least one.

Abstract: A solder paste which solves any nozzle clogging that suddenly occurs in a case of being used in a discharging method and which also realizes residue-free because flux is decomposed by heating during soldering. In the solder paste produced by mixing solder powders with the flux, the flux is flux containing polyalkyl-methacrylate of not less than 1.0 mass % and less than 2.0 mass % as methacrylate polymer of an amount such that it prevents the solder powders from being sedimented at ordinary temperature and it is decomposed or evaporated in the process of heating during the soldering, and containing stearic acid amide of not less than 5.0 mass % and less than 15.0 mass %, as viscosity modifier, wherein viscosity is 50 through 150 Pa·s. It is preferable that the content of flux in the solder paste is not less than 11 mass % and less than 13 mass %.

Abstract: An electronic device includes first to third terminals and a clip. The clip includes first to third joint portions and a connection portion. The first to third joint portions correspond to and are bonded to the first to third terminals, respectively. The connection portion connects the first to third joint portions. One terminal in the first to third terminals has a depressed portion depressed to one side in a predetermined direction to store a conductive bonding material. A variation in positions of the first to third terminals in the predetermined direction is absorbed by deformation of the conductive bonding material when one joint portion in the first to third joint portions corresponding to the one terminal is bonded to the one terminal through the conductive bonding material.

Abstract: An insulating substrate includes: a transparent insulating layer; a first metal layer that is provided on a first face of the transparent insulating layer; and a second metal layer that is provided on a second face of the transparent insulating layer that is opposite from the first face. The first face of the transparent insulating layer is formed with an exposed section that is an area not provided with the first metal layer. The second metal layer includes an area that is overlapped with the exposed section when seen in an orthogonal direction to the first face.

Abstract: A controller has a control board, a power module and a power board. MOS transistors, inverter input terminals, coil terminals, inverter ground terminals, control terminals, a control power input terminal and a control ground terminal are integrally molded in a molded portion of a power module. Electrical connections between the power module and the control and power boards are made through the terminals provided in the molded portion.

Abstract: A power module substrate having a heatsink, includes: a power module substrate having an insulating substrate having a first face and a second face, a circuit layer formed on the first face, and a metal layer formed on the second face; and a heatsink directly connected to the metal layer, cooling the power module substrate, wherein a ratio B/A is in the range defined by 1.55?B/A?20, where a thickness of the circuit layer is represented as A, and a thickness of the metal layer is represented as B.