Patents by Inventor Hiromasa Kato

Hiromasa Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220240960
    Abstract: An endoscopic treatment device includes a sheath formed from a resin; a flow-passage formation member attached to a distal end portion of the sheath to be rotatable around a longitudinal axis of the sheath; a pair of forceps pieces supported by the flow-passage formation member such that the pair of forceps pieces are able to be opened and closed; a link mechanism connected to the pair of forceps pieces and configured to open and close the pair of forceps pieces; an operation wire extending along the longitudinal axis of the sheath; and a connection member configured to connect a proximal end arm of the link mechanism and the operation wire.
    Type: Application
    Filed: January 27, 2022
    Publication date: August 4, 2022
    Applicant: OLYMPUS MEDICAL SYSTEMS CORP.
    Inventors: Yusuke SHIOTA, Chika MIYAJIMA, Hiromasa KATO, Kotaro YAMADA, Tomohiro TSUJI
  • Publication number: 20220241002
    Abstract: An endoscopic treatment device includes a sheath formed from a resin; a tubular hollow needle inserted into the sheath and having a sharp distal end; a rod formed from a metal and having a conduit; a shaft attached to a proximal end of the rod and having an internal space communicating with the conduit of the rod; and an operation portion including (i) a slider attached to a proximal end of the shaft, and (ii) and a lever attached to a proximal end of the hollow needle.
    Type: Application
    Filed: January 27, 2022
    Publication date: August 4, 2022
    Applicant: OLYMPUS MEDICAL SYSTEMS CORP.
    Inventors: Yusuke SHIOTA, Chika MIYAJIMA, Hiromasa KATO, Kotaro YAMADA, Tomohiro TSUJI
  • Publication number: 20220104351
    Abstract: A ceramic copper circuit board according to an embodiment includes a ceramic substrate and a first copper part. The first copper part is bonded at a first surface of the ceramic substrate via a first brazing material part. The thickness of the first copper part is 0.6 mm or more. The side surface of the first copper part includes a first sloped portion. The width of the first sloped portion is not more than 0.5 times the thickness of the first copper part. The first brazing material part includes a first jutting portion jutting from the end portion of the first sloped portion. The length of the first jutting portion is not less than 0 ?m and not more than 200 ?m. The contact angle between the first jutting portion and the first sloped portion is 65° or less.
    Type: Application
    Filed: December 9, 2021
    Publication date: March 31, 2022
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Hiromasa KATO, Takashi SANO
  • Publication number: 20220104350
    Abstract: A ceramic copper circuit board according to an embodiment includes a ceramic substrate and a first copper part. The first copper part is bonded at a first surface of the ceramic substrate via a first brazing material part. The thickness of the first copper part is 0.6 mm or more. The side surface of the first copper part includes a first sloped portion. The width of the first sloped portion is not more than 0.5 times the thickness of the first copper part. The first brazing material part includes a first jutting portion jutting from the end portion of the first sloped portion. The length of the first jutting portion is not less than 0 ?m and not more than 200 ?m. The contact angle between the first jutting portion and the first sloped portion is 65° or less.
    Type: Application
    Filed: December 9, 2021
    Publication date: March 31, 2022
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Hiromasa KATO, Takashi SANO
  • Patent number: 11277911
    Abstract: A ceramic copper circuit board according to an embodiment includes a ceramic substrate and a first copper part. The first copper part is bonded at a first surface of the ceramic substrate via a first brazing material part. The thickness of the first copper part is 0.6 mm or more. The side surface of the first copper part includes a first sloped portion. The width of the first sloped portion is not more than 0.5 times the thickness of the first copper part. The first brazing material part includes a first jutting portion jutting from the end portion of the first sloped portion. The length of the first jutting portion is not less than 0 ?m and not more than 200 ?m. The contact angle between the first jutting portion and the first sloped portion is 65° or less.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: March 15, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Hiromasa Kato, Takashi Sano
  • Publication number: 20220037225
    Abstract: A ceramic copper circuit board including a ceramic substrate, and a copper circuit part located on the ceramic substrate, wherein an arbitrary line parallel to a first direction at a cross section of the copper circuit part parallel to the first direction crosses multiple copper crystal grains, the first direction is from the ceramic substrate toward the copper circuit part, an average of multiple distances in a second direction between the line and edges of the copper crystal grains is not more than 300 ?m, and the second direction is perpendicular to the first direction.
    Type: Application
    Filed: September 7, 2021
    Publication date: February 3, 2022
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Takayuki NABA, Hiromasa KATO, Keiichi YANO
  • Patent number: 11129282
    Abstract: According to one embodiment, a method for manufacturing a ceramic circuit board is disclosed. The ceramic circuit board includes a copper plate bonded to at least one surface of a ceramic substrate via a brazing material layer including Ag, Cu, and a reactive metal. The method includes: preparing a ceramic circuit board in which a copper plate is bonded on a ceramic substrate via a brazing material layer, and a portion of the brazing material layer is exposed between a pattern shape of the copper plate; a first chemical polishing process of chemically polishing the portion of the brazing material layer; and a first brazing material etching process of etching the chemically polished portion of the brazing material layer by using an etchant having a pH of 6 or less and including one type or two types selected from hydrogen peroxide and ammonium peroxodisulfate.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: September 21, 2021
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Hiromasa Kato, Hideaki Hirabayashi, Fumiyuki Kawashima, Akito Sasaki
  • Patent number: 11013112
    Abstract: According to one embodiment, a ceramic copper circuit board a ceramic substrate, a copper circuit board provided at one surface of the ceramic substrate. A ratio of a thickness of the copper circuit board to a thickness of the ceramic substrate is 1.25 or more. A number of grain boundaries is not less than 5 and not more than 250 along every 10-mm straight line drawn in a front surface of the copper circuit board.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: May 18, 2021
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Hiromasa Kato, Takashi Sano
  • Patent number: 10952317
    Abstract: A ceramic circuit board comprises: a ceramic substrate with a 1.0 mm thickness or less including a first surface and a second surface, the first surface including a first area and a second area; a first metal plate joined to the first area; and a second metal plate joined to the second surface. The second area has a first waviness profile along a first side of the first surface, the first waviness profile having one extreme value or less. The second area has a second waviness profile along a second side of the first surface, the second waviness profile has not less than two nor more than three extreme values.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: March 16, 2021
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Takayuki Naba, Hiromasa Kato, Keiichi Yano
  • Publication number: 20210068253
    Abstract: A ceramic copper circuit board according to an embodiment includes a ceramic substrate and a first copper part. The first copper part is bonded at a first surface of the ceramic substrate via a first brazing material part. The thickness of the first copper part is 0.6 mm or more. The side surface of the first copper part includes a first sloped portion. The width of the first sloped portion is not more than 0.5 times the thickness of the first copper part. The first brazing material part includes a first jutting portion jutting from the end portion of the first sloped portion. The length of the first jutting portion is not less than 0 ?m and not more than 200 ?m. The contact angle between the first jutting portion and the first sloped portion is 65° or less.
    Type: Application
    Filed: November 11, 2020
    Publication date: March 4, 2021
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Hiromasa KATO, Takashi SANO
  • Patent number: 10872841
    Abstract: The present invention provides a ceramic metal circuit board including a ceramic substrate and metal plates bonded to both surfaces of the ceramic substrate through respective bonding layers, wherein a metal film is provided on a surface of one metal plate bonded to one surface of the ceramic substrate; and at least a part of another metal plate bonded to another surface of the ceramic substrate is not provided with the metal film. Preferably, a protruding portion is formed as a portion of the bonding layer so as to protrude from a side surface of each of the metal plates. According to the above-described configuration, it is possible to provide a ceramic circuit board which is easy to use according to the parts to be bonded and is excellent in heat-cycle resistance characteristics.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: December 22, 2020
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Takayuki Naba, Hiromasa Kato, Noboru Kitamori
  • Patent number: 10818565
    Abstract: A circuit board includes: a ceramic substrate that has a first surface and a second surface; a first metal part that has a first metal plate joined to the first surface and a protrusion projecting from a front surface of the first metal plate; and a second metal part that has a second metal plate joined to the second surface. When the ceramic substrate is equally divided into first to third sections along a longer side direction, V1, V2, V3, V4, V5, and V6 are numbers satisfying formula V4/V1+V6/V3?2(V5/V2), 0.5?V4/V1?2, 0.5?V5/V2?2, and 0.5?V6/V3?2.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: October 27, 2020
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Hiromasa Kato, Takashi Sano
  • Patent number: 10790214
    Abstract: To improve a TCT characteristic of a circuit substrate. The circuit substrate comprises a ceramic substrate including a first and second surfaces, and first and second metal plates respectively bonded to the first and second surfaces via first and second bonding layers. A three-point bending strength of the ceramic substrate is 500 MPa or more. At least one of L1/H1 of a first protruding portion of the first bonding layer and L2/H2 of a second protruding portion of the second bonding layer is 0.5 or more and 3.0 or less. At least one of an average value of first Vickers hardnesses of 10 places of the first protruding portion and an average value of second Vickers hardnesses of 10 places of the second protruding portion is 250 or less.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: September 29, 2020
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Takayuki Naba, Hiromasa Kato, Masashi Umehara
  • Publication number: 20200178387
    Abstract: A ceramic circuit board comprises: a ceramic substrate with a 1.0 mm thickness or less including a first surface and a second surface, the first surface including a first area and a second area; a first metal plate joined to the first area; and a second metal plate joined to the second surface. The second area has a first waviness profile along a first side of the first surface, the first waviness profile having one extreme value or less. The second area has a second waviness profile along a second side of the first surface, the second waviness profile has not less than two nor more than three extreme values.
    Type: Application
    Filed: February 4, 2020
    Publication date: June 4, 2020
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Takayuki NABA, Hiromasa KATO, Keiichi YANO
  • Publication number: 20200170118
    Abstract: According to one embodiment, a method for manufacturing a ceramic circuit board is disclosed. The ceramic circuit board includes a copper plate bonded to at least one surface of a ceramic substrate via a brazing material layer including Ag, Cu, and a reactive metal. The method includes: preparing a ceramic circuit board in which a copper plate is bonded on a ceramic substrate via a brazing material layer, and a portion of the brazing material layer is exposed between a pattern shape of the copper plate; a first chemical polishing process of chemically polishing the portion of the brazing material layer; and a first brazing material etching process of etching the chemically polished portion of the brazing material layer by using an etchant having a pH of 6 or less and including one type or two types selected from hydrogen peroxide and ammonium peroxodisulfate.
    Type: Application
    Filed: January 28, 2020
    Publication date: May 28, 2020
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Hiromasa KATO, Hideaki HIRABAYASHI, Fumiyuki KAWASHIMA, Akito SASAKI
  • Patent number: 10595403
    Abstract: A ceramic circuit board comprises: a ceramic substrate with a 1.0 mm thickness or less including a first surface and a second surface, the first surface including a first area and a second area; a first metal plate joined to the first area; and a second metal plate joined to the second surface. The second area has a first waviness profile along a first side of the first surface, the first waviness profile having one extreme value or less. The second area has a second waviness profile along a second side of the first surface, the second waviness profile has not less than two nor more than three extreme values.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: March 17, 2020
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA MATERIALS CO., LTD.
    Inventors: Takayuki Naba, Hiromasa Kato, Keiichi Yano
  • Publication number: 20200013696
    Abstract: To improve a TCT characteristic of a circuit substrate. The circuit substrate comprises a ceramic substrate including a first and second surfaces, and first and second metal plates respectively bonded to the first and second surfaces via first and second bonding layers. A three-point bending strength of the ceramic substrate is 500 MPa or more. At least one of L1/H1 of a first protruding portion of the first bonding layer and L2/H2 of a second protruding portion of the second bonding layer is 0.5 or more and 3.0 or less. At least one of an average value of first Vickers hardnesses of 10 places of the first protruding portion and an average value of second Vickers hardnesses of 10 places of the second protruding portion is 250 or less.
    Type: Application
    Filed: September 18, 2019
    Publication date: January 9, 2020
    Applicants: Kabushiki Kaisha Toshiba, Toshiba Materials Co., Ltd.
    Inventors: Takayuki NABA, Hiromasa KATO, Masashi UMEHARA
  • Patent number: 10515868
    Abstract: To improve a TCT characteristic of a circuit substrate. The circuit substrate comprises a ceramic substrate including a first and second surfaces, and first and second metal plates respectively bonded to the first and second surfaces via first and second bonding layers. A three-point bending strength of the ceramic substrate is 500 MPa or more. At least one of L1/H1 of a first protruding portion of the first bonding layer and L2/H2 of a second protruding portion of the second bonding layer is 0.5 or more and 3.0 or less. At least one of an average value of first Vickers hardnesses of 10 places of the first protruding portion and an average value of second Vickers hardnesses of 10 places of the second protruding portion is 250 or less.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: December 24, 2019
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Materials Co., Ltd.
    Inventors: Takayuki Naba, Hiromasa Kato, Masashi Umehara
  • Publication number: 20190385926
    Abstract: According to one embodiment, a ceramic metal circuit board is a ceramic metal circuit board formed by bonding metal circuit plates to at least one surface of a ceramic substrate. At least one of the metal circuit plates has an area of not less than 100 mm2 and includes a concave portion having a depth of not less than 0.02 mm within a range of 1% to 70% of a surface of the at least one of the metal circuit plates. The concave portion is provided not less than 3 mm inside from an end of the metal circuit plate.
    Type: Application
    Filed: August 21, 2019
    Publication date: December 19, 2019
    Inventors: Takayuki NABA, Keiichi YANO, Hiromasa KATO
  • Publication number: 20190327831
    Abstract: According to one embodiment, a ceramic copper circuit board a ceramic substrate, a copper circuit board provided at one surface of the ceramic substrate. A ratio of a thickness of the copper circuit board to a thickness of the ceramic substrate is 1.25 or more. A number of grain boundaries is not less than 5 and not more than 250 along every 10-mm straight line drawn in a front surface of the copper circuit board.
    Type: Application
    Filed: June 28, 2019
    Publication date: October 24, 2019
    Applicants: Kabushiki Kaisha Toshiba, Toshiba Materials Co., Ltd.
    Inventors: Hiromasa KATO, Takashi SANO