Abstract: According to one embodiment, a ceramic metal circuit board is a ceramic metal circuit board formed by bonding metal circuit plates to at least one surface of a ceramic substrate. At least one of the metal circuit plates has an area of not less than 100 mm2 and includes a concave portion having a depth of not less than 0.02 mm within a range of 1% to 70% of a surface of the at least one of the metal circuit plates. The concave portion is provided not less than 3 mm inside from an end of the metal circuit plate.

Abstract: A bonded object production method according to an embodiment uses a continuous furnace to process a stacked body including a metal member, a ceramic member, and a brazing material layer located therebetween, while conveying the stacked body; and the method includes a process of heating the stacked body in an inert atmosphere from 200° C. to a bonding temperature at an average temperature raising rate of the stacked body of not less than 15° C./min, a process of bonding the stacked body in an inert atmosphere at the bonding temperature that is within a range of not less than 600° C. and not more than 950° C., and a process of cooling the stacked body from the bonding temperature to 200° C. at an average temperature lowering rate of the stacked body of not less than 15° C./min. A ceramic substrate is favorably a silicon nitride substrate.

Abstract: According to the embodiment, in a method for manufacturing a ceramic circuit board in which a copper plate is bonded to at least one surface of a ceramic substrate via a brazing material layer, the brazing material layer does not include Ag, but includes Cu, Ti, and one or two of Sn or In, and a ceramic circuit board is prepared in which a portion of the brazing material layer is exposed between the patterned configuration of the copper plate. The method includes a chemical polishing process of chemically polishing the portion of the brazing material layer, and a brazing material etching process of etching the chemically polished portion of the brazing material layer by using an etchant that includes one or two selected from hydrogen peroxide and ammonium peroxodisulfate and has a pH of not more than 6.

Abstract: A ceramic circuit board includes a ceramic substrate and a metal plate bonded together via a bonding layer, wherein when the ceramic circuit board is observed through a cross-section defined by a thickness direction and lateral direction of the ceramic circuit board: a side surface of the metal plate has an inclined shape; and the bonding layer has a bonding-layer protruding portion which protrudes by 20 ?m or more and 150 ?m or less from an edge where the bonding layer is in contact with the side surface of the metal plate. The shape and Vickers hardness of the side surface of the metal plate are controlled. The ceramic substrate is preferably a silicon nitride substrate.

Abstract: An endoscopic treatment device includes a hollow tube; an electrode; and an insulative support member. In a radial direction relative to a longitudinal axis of the hollow tube, the insulative support member is radially outward of the electrode and the hollow tube is radially outward of the insulative support member.

Abstract: An endoscope treatment tool, comprising: a sheath; a handle body; a wire; a treatment portion connected to a distal end of the wire and arranged on a distal end side of the sheath; a rotating handle movable with respect to the handle body and connected to the wire; a conductive connector having an insertion passage through which the wire is inserted, wherein the wire is movable in a wire movement direction to advance and retreat in a direction that is parallel to a longitudinal axis of the handle body, wherein the wire is rotatable around an axis of the wire movement direction, and wherein the conductive connector extends in a direction that intersects the wire movement direction.

Abstract: According to one embodiment, a ceramic metal circuit board is a ceramic metal circuit board formed by bonding metal circuit plates to at least one surface of a ceramic substrate. At least one of the metal circuit plates has an area of not less than 100 mm2 and includes a concave portion having a depth of not less than 0.02 mm within a range of 1% to 70% of a surface of the at least one of the metal circuit plates. The concave portion is provided not less than 3 mm inside from an end of the metal circuit plate.

Abstract: A ceramic copper circuit board according to an embodiment includes a ceramic substrate and a first copper part. The first copper part is bonded at a first surface of the ceramic substrate via a first brazing material part. The thickness of the first copper part is 0.6 mm or more. The side surface of the first copper part includes a first sloped portion. The width of the first sloped portion is not more than 0.5 times the thickness of the first copper part. The first brazing material part includes a first jutting portion jutting from the end portion of the first sloped portion. The length of the first jutting portion is not less than 0 ?m and not more than 200 ?m. The contact angle between the first jutting portion and the first sloped portion is 65° or less.

Abstract: An endoscope treatment tool includes a sheath, a knife, a connecting unit and a body. The sheath includes a first channel opened at a distal end of the sheath. The knife inserted into the first channel, the knife having a second channel extending from a distal end of the knife to a proximal end of the knife. The connecting unit is located inside the sheath, the connecting unit including a cavity internal to the connecting unit and defining a storage path. A cross-sectional area of the cavity is larger than a cross-sectional area of the second channel. The body disposed in the cavity. The body is translatable in the cavity between a first position and a second position. The body forms a passage and, in the first position, the passage is in communication with the second channel.

Abstract: An endoscope treatment tool includes a sheath, an electrode and a needle. The sheath includes a first hole opened at a distal end of the sheath. The electrode is inserted into the first hole and includes a second hole opened at a distal end of the electrode. The needle is inserted into the second hole. The needle is movable to protrude from a distal end of the second hole of the electrode. A gap between the electrode and the needle is configured to pass a fluid.

Abstract: A treatment tool includes a sheath, a hollow pipe extending in the sheath and an elastically deformable constricting member. The hollow pipe includes a flow channel formed in a direction of a longitudinal axis of the hollow pipe and extending between a distal end of the hollow pipe and a proximal end of the hollow pipe. The elastically deformable constricting member includes a first end that is reversibly insertable into the flow channel.

Abstract: An endoscope treatment tool includes a sheath and an incision device. The sheath includes a distal end portion having a first channel. The first channel extends internal to the distal end portion between a distal opening at a distal end surface of the distal end portion and a proximal opening at a main flow chamber. The incision device is inserted in the first channel and includes a second channel extending between a distal end of the incision device and a proximal end of the incision device. The endoscope treatment tool is switchable between a first mode and a second mode. In the first mode, a first path for fluid is formed between the main flow chamber and the first channel. In the second mode, a second path for fluid is formed between the main flow chamber and the second channel.

Abstract: According to one embodiment, a ceramic metal circuit board is a ceramic metal circuit board formed by bonding metal circuit plates to at least one surface of a ceramic substrate. At least one of the metal circuit plates has an area of not less than 100 mm2 and includes a concave portion having a depth of not less than 0.02 mm within a range of 1% to 70% of a surface of the at least one of the metal circuit plates. The concave portion is provided not less than 3 mm inside from an end of the metal circuit plate.

Abstract: A packaging container for transporting ceramic substrates according to the present embodiment includes a bottom portion in a rectangular shape, and four side portions connected to four edges of the bottom portion respectively. Side protrusions having a height of 2 mm or more and protruding inward are provided on at least two opposite side portions among the four side portions. The bottom portion is provided with a bottom protrusion having a height of 2 mm or more and protruding inward.

Abstract: A system includes a database, a camera, a tracking arrangement, and a processing arrangement. The database stores profiles including visual profiles of a plurality of sports players, each visual profile comprising identifying information for a player, each profile comprising an associated playerID. The camera captures a video stream comprising images of the sports players. The tracking arrangement captures data corresponding to trajectories of sports balls launched by the sports players. The processing arrangement coupled to the database. The camera and the tracking arrangement configured to; detect a first sports player in an image from the video stream and determine visual characteristics of the first detected sports player; match the determined visual characteristics to a first visual profile of a first profile and an associated first playerID stored in the database; and associate a first trajectory associated with a first sports shot with the first playerID.

Abstract: An endoscopic surgical tool including a housing having a proximal end and a distal end, the housing having a central axis and a first aperture forming an opening disposed at the distal end, an insulator disposed within the housing and having a central bore and a second aperture, the insulator configured to extend distally from the first aperture along the central axis, and a knife disposed within the first aperture and including a tip. The knife having a retracted position and an extended position, wherein in the extended position, the knife is extended distally from the first aperture along the central axis and in the retracted position, the knife is retracted proximally towards the proximal end along the central axis. The endoscopic surgical tool including a biasing element coupled to the knife and biasing the knife toward the retracted position when the knife is in the extended position.

Abstract: An endoscopic treatment device includes a sheath formed from a resin; a flow-passage formation member attached to a distal end portion of the sheath to be rotatable around a longitudinal axis of the sheath; a pair of forceps pieces supported by the flow-passage formation member such that the pair of forceps pieces are able to be opened and closed; a link mechanism connected to the pair of forceps pieces and configured to open and close the pair of forceps pieces; an operation wire extending along the longitudinal axis of the sheath; and a connection member configured to connect a proximal end arm of the link mechanism and the operation wire.

Abstract: An endoscopic treatment device includes a sheath formed from a resin; a tubular hollow needle inserted into the sheath and having a sharp distal end; a rod formed from a metal and having a conduit; a shaft attached to a proximal end of the rod and having an internal space communicating with the conduit of the rod; and an operation portion including (i) a slider attached to a proximal end of the shaft, and (ii) and a lever attached to a proximal end of the hollow needle.

Abstract: A ceramic copper circuit board according to an embodiment includes a ceramic substrate and a first copper part. The first copper part is bonded at a first surface of the ceramic substrate via a first brazing material part. The thickness of the first copper part is 0.6 mm or more. The side surface of the first copper part includes a first sloped portion. The width of the first sloped portion is not more than 0.5 times the thickness of the first copper part. The first brazing material part includes a first jutting portion jutting from the end portion of the first sloped portion. The length of the first jutting portion is not less than 0 ?m and not more than 200 ?m. The contact angle between the first jutting portion and the first sloped portion is 65° or less.

Abstract: A ceramic copper circuit board according to an embodiment includes a ceramic substrate and a first copper part. The first copper part is bonded at a first surface of the ceramic substrate via a first brazing material part. The thickness of the first copper part is 0.6 mm or more. The side surface of the first copper part includes a first sloped portion. The width of the first sloped portion is not more than 0.5 times the thickness of the first copper part. The first brazing material part includes a first jutting portion jutting from the end portion of the first sloped portion. The length of the first jutting portion is not less than 0 ?m and not more than 200 ?m. The contact angle between the first jutting portion and the first sloped portion is 65° or less.