Abstract: Provided is a cleanser for organic-inorganic composite fouling. This cleanser is composed of an aqueous solution of hydrogen peroxide, acetic acid, peracetic acid, a nonionic surfactant, and a cationic and/or amphoteric surfactant, has disinfectant activities and, especially when biofilms have occurred as organic fouling, can effectively remove by itself composite fouling of the biofilms and inorganic fouling such as calcium carbonate and calcium phosphate.

Abstract: A plating bath additive and a plating bath using the said additive are provided, which plating bath contains a hydroxyalkanesulfonic acid and which even when applied to an electronic part such as a semiconductor device does not give rise to a problem such as circuit-to-circuit insulation becoming defective. The plating bath additive contains a hydroxyalkanesulfonic acid as a main component and has an alkali metal content of less than 0.05 mass % relative to the hydroxyalkanesulfonic acid. The plating bath incorporates the said additive therein.

Abstract: A novel polymerizable surfactant represented by the general formula (1): ##STR1## (wherein, R.sup.1 represents a hydrogen atom or a methyl group, Rf represents a hydrocarbon group in which one or more hydrogen atoms are replaced by a fluorine atom or atoms, or an acyl group in which one or more hydrogen atoms are replaced by a fluorine atom or atoms, AO and AO' represent a group selected from an oxyalkylene group having 2-4 carbon atoms or a styrene oxide residue, m and m' are 0 or a number between 1 and 1,000, X represents a hydrogen atom or a hydrophilic group).