Patents by Inventor Hiromasa Kitazawa

Hiromasa Kitazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9303192
    Abstract: A heat curable sheet-like adhesive for an organic EL panel, comprising components (A) to (C), which has tack in the surface of a composition comprising the components (A) to (C) at 25° C.: the component (A): a film forming component having an epoxy equivalent of 7000 to 20000 g/eq and having compatibility with the component (B); the component (B): an epoxy resin having an epoxy equivalent of 150 to 5000 g/eq and comprising 0 to 20% by weight of a solid epoxy resin at 25° C. with respect to the whole of the component (B); and the component (C): an encapsulated epoxy adduct-type latent curing agent.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: April 5, 2016
    Assignee: THREE BOND FINE CHEMICAL CO., LTD.
    Inventors: Hiromasa Kitazawa, Yoshihide Arai
  • Publication number: 20150137089
    Abstract: [Problem] A conventional sheet-like adhesive has low adhesion to an adherend and, at the same time, is required to be heated at a high temperature of 100° C. or higher when adhered to an adherend, and hence, when an adherend is an electronic part with deterioration by a high temperature, damage to the adherend is large. In addition, since a sheet-like adhesive in the B-stage hardly exhibited flowability when heating, bubbles may be remained when there is unevenness on an adherend. [Solution] A heat curable sheet-like adhesive for an organic EL panel, comprising components (A) to (C), which has tack in the surface of a composition comprising the components (A) to (C) at 25° C.: the component (A): a film forming component having an epoxy equivalent of 7000 to 20000 g/eq and having compatibility with the component (B); the component (B): an epoxy resin having an epoxy equivalent of 150 to 5000 g/eq and comprising 0 to 20% by weight of a solid epoxy resin at 25° C.
    Type: Application
    Filed: July 1, 2013
    Publication date: May 21, 2015
    Inventors: Hiromasa Kitazawa, Yoshihide Arai
  • Patent number: 8828500
    Abstract: A photocurable resin composition for sealing an organic EL device is provided, which can seal the organic EL device without exerting any bad influence on the device, thereby suppress the formation and growth of dark spots positively, and which can ensure a high transmittance of light, thereby maintain a stable light emitting characteristic over a long period of time. The composition comprises (A) an epoxy resin containing at least two glycidyl groups in each molecule thereof and having a molecular weight of 200 to 7000, (B) an epoxy resin containing at least one glycidyl group in each molecule thereof and having a molecular weight of 20000 to 100000, (C) a latent acid photo catalyst adapted to be activated and produce an acid upon being irradiated with energy beam, and (D) a silane coupling agent containing a glycidyl group in each molecule thereof, the composition exhibiting non-fluidity at 25° C., but exhibiting fluidity in a temperature range of 50° to 100° C.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: September 9, 2014
    Assignee: Three Bond Co., Ltd.
    Inventors: Yoshihide Arai, Hiromasa Kitazawa, Kenichi Horie
  • Publication number: 20140167021
    Abstract: The present invention provides a sealing member for organic EL elements that enables organic EL elements, in particular, organic EL elements for illumination devices to maintain stable luminescence over a long period and that can be fabricated at reduced cost. The sealing member for organic EL elements of the present invention includes a barrier film including a plastic film and at least one thin metal layer, and a curable resin composition layer on the barrier film. The curable resin composition layer has a thickness of 5 to 100 ?m and the curable resin composition exhibits nonfluidity at 25° C. in an uncured state and gains fluidity at an elevated temperature in the range of 40 to 80° C.
    Type: Application
    Filed: February 6, 2014
    Publication date: June 19, 2014
    Applicant: THREEBOND CO., LTD.
    Inventors: Yoshihide Arai, Hiromasa Kitazawa, Kenichi Horie
  • Publication number: 20120207991
    Abstract: The present invention provides a sealing member for organic EL elements that enables organic EL elements, in particular, organic EL elements for illumination devices to maintain stable luminescence over a long period and that can be fabricated at reduced cost. The sealing member for organic EL elements of the present invention includes a barrier film including a plastic film and at least one thin metal layer, and a curable resin composition layer on the barrier film. The curable resin composition layer has a thickness of 5 to 100 ?m and the curable resin composition exhibits nonfluidity at 25° C. in an uncured state and gains fluidity at an elevated temperature in the range of 40 to 80° C.
    Type: Application
    Filed: September 2, 2010
    Publication date: August 16, 2012
    Applicant: THREEBOND CO., LTD.
    Inventors: Yoshihide Arai, Hiromasa Kitazawa, Kenichi Horie
  • Publication number: 20100137530
    Abstract: A photocurable resin composition for sealing an organic EL device is provided, which can seal the organic EL device without exerting any bad influence on the device, thereby suppress the formation and growth of dark spots positively, and which can ensure a high transmittance of light, thereby maintain a stable light emitting characteristic over a long period of time. The composition comprises (A) an epoxy resin containing at least two glycidyl groups in each molecule thereof and having a molecular weight of 200 to 7000, (B) an epoxy resin containing at least one glycidyl group in each molecule thereof and having a molecular weight of 20000 to 100000, (C) a latent acid photo catalyst adapted to be activated and produce an acid upon being irradiated with energy beam, and (D) a silane coupling agent containing a glycidyl group in each molecule thereof, the composition exhibiting non-fluidity at 25° C., but exhibiting fluidity in a temperature range of 50° to 100° C.
    Type: Application
    Filed: November 6, 2009
    Publication date: June 3, 2010
    Applicant: THREE BOND CO., LTD.
    Inventors: Yoshihide Arai, Hiromasa Kitazawa, Kenichi Horie