Patents by Inventor HIROMASA OHNO

HIROMASA OHNO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050181338
    Abstract: According to the present invention, in an education training management system, a computer for use in training management, a terminal for a trainee, a terminal for a manager, an education training management method and an education training method, the computer for use in training management comprises aggregate storing means for aggregating received lecture information and for storing the aggregate result, the terminal for a manager comprises reading means for accessing the computer for use in training management to read the aggregate result. As a result, managers easily can read lecture information of a trainee from a remote location, and can give appropriate instruction to the trainee depending on the level of understanding and the progress status of the trainee, which is obtained from the computer for use in training management.
    Type: Application
    Filed: April 5, 2005
    Publication date: August 18, 2005
    Applicants: Nikon TEC Corporation, Nikon Corporation
    Inventor: Hiromasa Ohno
  • Publication number: 20030145461
    Abstract: A semiconductor device is disclosed which can prevent the leakage of resin and improve the production efficiency. The semiconductor device comprises a substrate, the substrate having plural connecting terminals formed around a recess and plural bump lands arranged side by side around the connecting terminals, a semiconductor chip disposed in the recess, plural wires for connecting pads on the semiconductor chip and the connecting terminals on the substrate with each other, a seal portion embedded in the recess, and plural ball electrodes provided on the bump lands of the substrate. A dummy wiring covered with solder resist is formed in an area between the plural connecting terminals and the plural bump lands on the substrate. According to this construction, a gap between a mold surface of an upper mold and the surface of the substrate, which gap is formed at the time of die clamping, is filled up with the dummy wiring and the solder resist which covers the dummy wiring.
    Type: Application
    Filed: October 25, 2002
    Publication date: August 7, 2003
    Inventors: Norihiko Kasai, Hiromasa Ohno
  • Publication number: 20030069866
    Abstract: According to the present invention, in an education training management system, a computer for use in training management, a terminal for a trainee, a terminal for a manager, an education training management method and an education training method, the computer for use in training management comprises aggregate storing means for aggregating received lecture information and for storing the aggregate result, the terminal for a manager comprises reading means for accessing the computer for use in training management to read the aggregate result. As a result, managers easily can read lecture information of a trainee from a remote location, and can give appropriate instruction to the trainee depending on the level of understanding and the progress status of the trainee, which is obtained from the computer for use in training management.
    Type: Application
    Filed: July 26, 2000
    Publication date: April 10, 2003
    Inventor: HIROMASA OHNO