Patents by Inventor Hiromasa Tanzaki

Hiromasa Tanzaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of and apparatus for mounting an electronic part
    Patent number: 4670979
    Abstract: A simplified method of and apparatus for mounting an electronic part such as a transistor on a circuit board. Two or more selected ones of terminals of an electronic part are angularly bent in prior, and when the electronic part is to be mounted on a circuit board, the terminals are forcibly inserted into through-holes of the circuit board to an extent wherein bent portions of the terminals are projected below the circuit board. As a result, if a weak force is applied to pull the part off, the bent portions of the terminals will frictionally engage with edges of the through-holes to prevent the part from being removed from the board.
    Type: Grant
    Filed: May 9, 1985
    Date of Patent: June 9, 1987
    Assignee: Silver Seiko Ltd.
    Inventors: Shigeru Yoshino, Junzo Ueki, Ichiro Shibuya, Shigeo Kawada, Akira Iino, Hiromasa Tanzaki, Kazuo Murano