Patents by Inventor Hiromi Chaya
Hiromi Chaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7477064Abstract: In a prober, a post-contact image representing a region including a pad is acquired by capturing an image of a substrate after a probe has been brought into contact with the pad having an existing probe mark. An image storage unit stores in advance a pre-contact image representing the pad-inclusive region before the probe is brought into contact with the pad. A latest probe mark position acquiring unit acquires a position of a latest probe mark region created by the contact of the probe with the pad from among a plurality of probe mark regions in the post-contact image respectively corresponding to a plurality of probe marks on the pad by comparing the post-contact image with the pre-contact image. A positional deviation acquiring unit finds a deviation in a contact position of the probe with respect to the pad, based on the position of the latest probe mark region.Type: GrantFiled: March 23, 2006Date of Patent: January 13, 2009Assignee: Tokyo Electron LimitedInventors: Daiki Kurihara, Hiromi Chaya, Takanori Hyakudomi
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Patent number: 7224175Abstract: A probe mark reading device for reading probe marks stormed on electrode pads of semiconductor chips contained in a semiconductor wafer (90), comprising a CCD camera (20) for taking an image of the semiconductor wafer (90) and outputting the image as an image signal Si, an optical unit (21) for optically enlarging a location to be photographed by the CCD camera (20), a light source (30) for illuminating the location to be photographed by the CCD camera (20) with a flash of light generated for a short period of time from when a flash signal Sf is provided, an X-Y stage (40) capable of changing a position to be photographed by the CCD camera (20) based on a motor control signal Sm by moving a mounted semiconductor wafer (90) in an X-direction and a Y-direction, and a computer (10) for providing control and saving the images after receiving and trimming the image signal Si. With the above configuration, it is possible to read probe marks in a short time without a user having to expend much time or effort.Type: GrantFiled: February 17, 2006Date of Patent: May 29, 2007Assignees: Dainippon Screen Mfg. Co., Ltd., Tokyo Electron LimitedInventors: Hiromi Chaya, Takahisa Hayashi, Shigekazu Komatsu
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Patent number: 7221177Abstract: A probe apparatus with control-position detection means is provided for testing an electrical characteristic of a to-be-tested object formed on a substrate W. The probe apparatus includes a prober chamber, a susceptor provided in the prober chamber for placing thereon a to-be-tested object, and a moving mechanism for moving the susceptor in X-, Y-, Z- and ?-directions. The probe apparatus further includes a probe card having a plurality of probes and opposing the susceptor, and a first optical length-measuring unit. The first length-measuring unit emits light to the surface of the to-be-tested object placed on the susceptor, and detects the Z-directional position of the to-be-tested object based on the light reflected from the object. The probe apparatus can have a second length-measuring unit.Type: GrantFiled: July 20, 2005Date of Patent: May 22, 2007Assignee: Tokyo Electron LimitedInventors: Shigekazu Komatsu, Takanori Hyakudomi, Hiromi Chaya, Takahisa Hayashi, Yukihide Shigeno
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Publication number: 20060238905Abstract: In a prober, a post-contact image representing a region including a pad is acquired by capturing an image of a substrate after a probe has been brought into contact with the pad having an existing probe mark. An image storage unit stores in advance a pre-contact image representing the pad-inclusive region before the probe is brought into contact with the pad. A latest probe mark position acquiring unit acquires a position of a latest probe mark region created by the contact of the probe with the pad from among a plurality of probe mark regions in the post-contact image respectively corresponding to a plurality of probe marks on the pad by comparing the post-contact image with the pre-contact image. A positional deviation acquiring unit finds a deviation in a contact position of the probe with respect to the pad, based on the position of the latest probe mark region.Type: ApplicationFiled: March 23, 2006Publication date: October 26, 2006Applicant: TOKYO ELECTRON LIMITEDInventors: Daiki Kurihara, Hiromi Chaya, Takanori Hyakudomi
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Publication number: 20060139628Abstract: A probe mark reading device for reading probe marks stormed on electrode pads of semi conductor chips contained in a semiconductor wafer (90), comprising a CCD camera (20) for taking an image of the semiconductor wafer (90) and outputting the image as an image signal Si, an optical unit (21) for optically enlarging a location to be photographed by the CCD camera (20), a light source (30) for illuminating the location to be photographed by the CCD camera (20) with a flash of light generated for a short period of time from when a flash signal Sf is provided, an X-Y stage (40) capable of changing a position to be photographed by the CCD camera (20) based on a motor control signal Sm by moving a mounted semiconductor wafer (90) in an X-direction and a Y-direction, and a computer (10) for providing control and saving the images after receiving and trimming the image signal Si. With the above configuration, it is possible to read probe marks in a short time without a user having to expend much time or effort.Type: ApplicationFiled: February 17, 2006Publication date: June 29, 2006Applicants: DAINIPPON SCREEN MFG. CO., LTD., TOKYO ELECTRON LIMITEDInventors: Hiromi Chaya, Takahisa Hayashi, Shigekazu Komatsu
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Patent number: 7026832Abstract: A probe mark reading device for reading probe marks stormed on electrode pads of semiconductor chips contained in a semiconductor wafer (90), comprising a CCD camera (20) for taking an image of the semiconductor wafer (90) and outputting the image as an image signal Si, an optical unit (21) for optically enlarging a location to be photographed by the CCD camera (20), a light source (30) for illuminating the location to be photographed by the CCD camera (20) with a flash of light generated for a short period of time from when a flash signal Sf is provided, an X-Y stage (40) capable of changing a position to be photographed by the CCD camera (20) based on a motor control signal Sm by moving a mounted semiconductor wafer (90) in an X-direction and a Y-direction, and a computer (10) for providing control and saving the images after receiving and trimming the image signal Si. With the above configuration, it is possible to read probe marks in a short time without a user having to expend much time or effort.Type: GrantFiled: October 9, 2003Date of Patent: April 11, 2006Assignees: Dainippon Screen Mfg. Co., Ltd., Tokyo Electron LimitedInventors: Hiromi Chaya, Takahisa Hayashi, Shigekazu Komatsu
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Publication number: 20050253613Abstract: A probe apparatus with control-position detection means is provided for testing an electrical characteristic of a to-be-tested object formed on a substrate W. The probe apparatus includes a prober chamber, a susceptor provided in the prober chamber for placing thereon a to-be-tested object, and a moving mechanism for moving the susceptor in X-, Y-, Z- and ?-directions. The probe apparatus further includes a probe card having a plurality of probes and opposing the susceptor, and a first optical length-measuring unit. The first length-measuring unit emits light to the surface of the to-be-tested object placed on the susceptor, and detects the Z-directional position of the to-be-tested object based on the light reflected from the object. The probe apparatus can have a second length-measuring unit.Type: ApplicationFiled: July 20, 2005Publication date: November 17, 2005Applicant: TOKYO ELECTRON LIMITEDInventors: Shigekazu Komatsu, Takanori Hyakudomi, Hiromi Chaya, Takahisa Hayashi, Yukihide Shigeno
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Publication number: 20040081349Abstract: A probe mark reading device for reading probe marks stormed on electrode pads of semiconductor chips contained in a semiconductor wafer (90), comprising a CCD camera (20) for taking an image of the semiconductor wafer (90) and outputting the image as an image signal Si, an optical unit (21) for optically enlarging a location to be photographed by the CCD camera (20), a light source (30) for illuminating the location to be photographed by the CCD camera (20) with a flash of light generated for a short period of time from when a flash signal Sf is provided, an X-Y stage (40) capable of changing a position to be photographed by the CCD camera (20) based on a motor control signal Sm by moving a mounted semiconductor wafer (90) in an X-direction and a Y-direction, and a computer (10) for providing control and saving the images after receiving and trimming the image signal Si. With the above configuration, it is possible to read probe marks in a short time without a user having to expend much time or effort.Type: ApplicationFiled: October 9, 2003Publication date: April 29, 2004Applicants: DAINIPPON SCREEN MFG, CO., LTD, TOKYO ELECTRON LIMITEDInventors: Hiromi Chaya, Takahisa Hayashi, Shigekazu Komatsu
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Patent number: 4639879Abstract: While characters are being displayed on a graphic display device according to commands from a computer, the light emitting intensity of a desired pixel is controlled by outputting only commands related to the light emitting intensity control from said computer. This is done by providing, associated with the graphic display device, for memorizing a group of numerical values corresponding to desired changes of light emitting intensity of a desired pixel belonging to a character or a graphic display displayed on the graphic display device, or by providing for obtaining numerical values corrsponding to the light emitting intensity changes. A device for practicing this method is also disclosed.Type: GrantFiled: February 15, 1983Date of Patent: January 27, 1987Assignee: Dainippon Screen Seizo Kabushiki KaishaInventor: Hiromi Chaya