Patents by Inventor Hiromi KIDA

Hiromi KIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210395459
    Abstract: The present invention provides a resin composition which has excellent handleability and which provides a cured product having excellent toughness and heat resistance. The present invention relates to a thermosetting resin composition including an allyl compound (A) containing at least two or more allyl groups and one or more benzene rings in a molecule, a maleimide compound (B) containing at least two or more maleimide groups in a molecule, a thiol compound (C) containing at least two or more thiol groups in a molecule, and a cyclic compound (D) containing at least two or more hydroxyl groups in a molecule.
    Type: Application
    Filed: October 30, 2018
    Publication date: December 23, 2021
    Inventors: Hiromi KIDA, Atsushi MIYATA, Shinji IKESHITA, Keita KOBAYASHI