Patents by Inventor Hiromi Okazaki

Hiromi Okazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11271025
    Abstract: A solid-state imaging device includes a semiconductor layer on which a plurality of pixels are arranged along a light-receiving surface being a main surface of the semiconductor layer, photoelectric conversion units provided for the respective pixels in the semiconductor layer, and a trench element isolation area formed by providing an insulating layer in a trench pattern formed on a light-receiving surface side of the semiconductor layer, the trench element isolation area being provided at a position displaced from a pixel boundary between the pixels.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: March 8, 2022
    Assignee: SONY CORPORATION
    Inventor: Hiromi Okazaki
  • Publication number: 20210217789
    Abstract: A solid-state imaging device includes a semiconductor layer on which a plurality of pixels are arranged along a light-receiving surface being a main surface of the semiconductor layer, photoelectric conversion units provided for the respective pixels in the semiconductor layer, and a trench element isolation area formed by providing an insulating layer in a trench pattern formed on a light-receiving surface side of the semiconductor layer, the trench element isolation area being provided at a position displaced from a pixel boundary between the pixels.
    Type: Application
    Filed: March 29, 2021
    Publication date: July 15, 2021
    Applicant: Sony Corporation
    Inventor: Hiromi Okazaki
  • Publication number: 20200212084
    Abstract: A solid-state imaging device includes a semiconductor layer on which a plurality of pixels are arranged along a light-receiving surface being a main surface of the semiconductor layer, photoelectric conversion units provided for the respective pixels in the semiconductor layer, and a trench element isolation area formed by providing an insulating layer in a trench pattern formed on a light-receiving surface side of the semiconductor layer, the trench element isolation area being provided at a position displaced from a pixel boundary between the pixels.
    Type: Application
    Filed: March 13, 2020
    Publication date: July 2, 2020
    Applicant: Sony Corporation
    Inventor: Hiromi Okazaki
  • Patent number: 10615207
    Abstract: A solid-state imaging device includes a semiconductor layer on which a plurality of pixels are arranged along a light-receiving surface being a main surface of the semiconductor layer, photoelectric conversion units provided for the respective pixels in the semiconductor layer, and a trench element isolation area formed by providing an insulating layer in a trench pattern formed on a light-receiving surface side of the semiconductor layer, the trench element isolation area being provided at a position displaced from a pixel boundary between the pixels.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: April 7, 2020
    Assignee: SONY CORPORATION
    Inventor: Hiromi Okazaki
  • Patent number: 10319769
    Abstract: A solid-state imaging device includes a semiconductor layer on which a plurality of pixels are arranged along a light-receiving surface being a main surface of the semiconductor layer, photoelectric conversion units provided for the respective pixels in the semiconductor layer, and a trench element isolation area formed by providing an insulating layer in a trench pattern formed on a light-receiving surface side of the semiconductor layer, the trench element isolation area being provided at a position displaced from a pixel boundary between the pixels.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: June 11, 2019
    Assignee: Sony Corporation
    Inventor: Hiromi Okazaki
  • Patent number: 10074684
    Abstract: Systems and methods for providing a solid state image sensor (30) are provided. More particularly, an image sensor (30) that suppresses color mixing is provided. Moreover, embodiments of the present disclosure provide for the creation of light blocking features (32) that avoid the creation of stress concentrations. More particularly, embodiments of the present disclosure provide for the creation of light blocking structures (32) using trenches formed in a substrate (44) that are arranged such that no two trenches intersect one another.
    Type: Grant
    Filed: May 16, 2013
    Date of Patent: September 11, 2018
    Assignee: SONY CORPORATION
    Inventors: Hiromi Okazaki, Masayuki Uchiyama, Kazufumi Watanabe
  • Publication number: 20180138216
    Abstract: A solid-state imaging device includes a semiconductor layer on which a plurality of pixels are arranged along a light-receiving surface being a main surface of the semiconductor layer, photoelectric conversion units provided for the respective pixels in the semiconductor layer, and a trench element isolation area formed by providing an insulating layer in a trench pattern formed on a light-receiving surface side of the semiconductor layer, the trench element isolation area being provided at a position displaced from a pixel boundary between the pixels.
    Type: Application
    Filed: December 21, 2017
    Publication date: May 17, 2018
    Inventor: Hiromi Okazaki
  • Patent number: 9893106
    Abstract: A solid-state imaging device includes a semiconductor layer on which a plurality of pixels are arranged along a light-receiving surface being a main surface of the semiconductor layer, photoelectric conversion units provided for the respective pixels in the semiconductor layer, and a trench element isolation area formed by providing an insulating layer in a trench pattern formed on a light-receiving surface side of the semiconductor layer, the trench element isolation area being provided at a position displaced from a pixel boundary between the pixels.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: February 13, 2018
    Assignee: Sony Corporation
    Inventor: Hiromi Okazaki
  • Patent number: 9853077
    Abstract: A solid-state imaging device includes a semiconductor layer on which a plurality of pixels are arranged along a light-receiving surface being a main surface of the semiconductor layer, photoelectric conversion units provided for the respective pixels in the semiconductor layer, and a trench element isolation area formed by providing an insulating layer in a trench pattern formed on a light-receiving surface side of the semiconductor layer, the trench element isolation area being provided at a position displaced from a pixel boundary between the pixels.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: December 26, 2017
    Assignee: Sony Corporation
    Inventor: Hiromi Okazaki
  • Publication number: 20170179171
    Abstract: A solid-state imaging device includes a semiconductor layer on which a plurality of pixels are arranged along a light-receiving surface being a main surface of the semiconductor layer, photoelectric conversion units provided for the respective pixels in the semiconductor layer, and a trench element isolation area formed by providing an insulating layer in a trench pattern formed on a light-receiving surface side of the semiconductor layer, the trench element isolation area being provided at a position displaced from a pixel boundary between the pixels.
    Type: Application
    Filed: March 3, 2017
    Publication date: June 22, 2017
    Inventor: Hiromi Okazaki
  • Patent number: 9647026
    Abstract: A solid-state image pickup device, including: a plurality of pixels; a separation structure provided along a boundary line adjacent to the plurality of pixels; the separation structure includes a groove provided from a back surface of the semiconductor substrate to a depth corresponding to a wavelength, the groove being positioned along the boundary line, a first separation layer provided in the groove, and a second separation layer provided above the first separation layer and corresponding to the boundary line, the second separation layer being connected to the first separation layer; and methods including the same.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: May 9, 2017
    Assignee: Sony Corporation
    Inventors: Yoshiki Ebiko, Atsuhiko Yamamoto, Yasushi Tateshita, Hiromi Okazaki
  • Patent number: 9570501
    Abstract: A solid-state imaging device includes a semiconductor layer on which a plurality of pixels are arranged along a light-receiving surface being a main surface of the semiconductor layer, photoelectric conversion units provided for the respective pixels in the semiconductor layer, and a trench element isolation area formed by providing an insulating layer in a trench pattern formed on a light-receiving surface side of the semiconductor layer, the trench element isolation area being provided at a position displaced from a pixel boundary between the pixels.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: February 14, 2017
    Assignee: Sony Corporation
    Inventor: Hiromi Okazaki
  • Publication number: 20160211304
    Abstract: A solid-state imaging device includes a semiconductor layer on which a plurality of pixels are arranged along a light-receiving surface being a main surface of the semiconductor layer, photoelectric conversion units provided for the respective pixels in the semiconductor layer, and a trench element isolation area formed by providing an insulating layer in a trench pattern formed on a light-receiving surface side of the semiconductor layer, the trench element isolation area being provided at a position displaced from a pixel boundary between the pixels.
    Type: Application
    Filed: March 30, 2016
    Publication date: July 21, 2016
    Inventor: Hiromi Okazaki
  • Publication number: 20150091122
    Abstract: Systems and methods for providing a solid state image sensor (30) are provided. More particularly, an image sensor (30) that suppresses color mixing is provided. Moreover, embodiments of the present disclosure provide for the creation of light blocking features (32) that avoid the creation of stress concentrations. More particularly, embodiments of the present disclosure provide for the creation of light blocking structures (32) using trenches formed in a substrate (44) that are arranged such that no two trenches intersect one another.
    Type: Application
    Filed: May 16, 2013
    Publication date: April 2, 2015
    Inventors: Hiromi Okazaki, Masayuki Uchiyama, Kazufumi Watanabe
  • Publication number: 20150041942
    Abstract: A solid-state image pickup device, including: a plurality of pixels; a separation structure provided along a boundary line adjacent to the plurality of pixels; the separation structure includes a groove provided from a back surface of the semiconductor substrate to a depth corresponding to a wavelength, the groove being positioned along the boundary line, a first separation layer provided in the groove, and a second separation layer provided above the first separation layer and corresponding to the boundary line, the second separation layer being connected to the first separation layer; and methods including the same.
    Type: Application
    Filed: August 1, 2014
    Publication date: February 12, 2015
    Inventors: Yoshiki Ebiko, Atsuhiko Yamamoto, Yasushi Tateshita, Hiromi Okazaki
  • Publication number: 20140346628
    Abstract: A solid-state imaging device includes a semiconductor layer on which a plurality of pixels are arranged along a light-receiving surface being a main surface of the semiconductor layer, photoelectric conversion units provided for the respective pixels in the semiconductor layer, and a trench element isolation area formed by providing an insulating layer in a trench pattern formed on a light-receiving surface side of the semiconductor layer, the trench element isolation area being provided at a position displaced from a pixel boundary between the pixels.
    Type: Application
    Filed: May 16, 2014
    Publication date: November 27, 2014
    Applicant: Sony Corporation
    Inventor: Hiromi Okazaki
  • Patent number: 8558158
    Abstract: A solid-state imaging device includes a semiconductor substrate, photodiodes, a first insulating film, a second insulating film, a third insulating film, and a color filter. The photodiodes are disposed on the semiconductor substrate. The first insulating film covers a multilayer wiring on the semiconductor substrate. The first insulating film comprises a material having a first refractive index lower than a refractive index of the semiconductor substrate for at least bottom surface and top surface portions of the first insulating film. The second insulating film has a second refractive index higher than the first refractive index. The third insulating film has a third refractive index higher than the second refractive index.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: October 15, 2013
    Assignee: Sony Corporation
    Inventors: Kyoko Izuha, Hiromi Okazaki, Yoshiaki Kitano
  • Publication number: 20110108705
    Abstract: A solid-state imaging device includes: a semiconductor substrate that includes a photodiode separately provided for each of pixels disposed in a matrix on a light-receiving surface; a first insulating film formed on the semiconductor substrate so as to cover multilayer wiring formed on and in contact with the semiconductor substrate, wherein the first insulating film is formed using material of a first refractive index lower than a refractive index of the semiconductor substrate for at least bottom surface and top surface portions of the first insulating film; a second insulating film of a second refractive index higher than the first refractive index formed on the first insulating film; a third insulating film of a third refractive index higher than the second refractive index formed on the second insulating film; and a color filter formed on the third insulating film in a corresponding manner with each pixel so as to transmit light in a wavelength region of red, green, or blue.
    Type: Application
    Filed: October 29, 2010
    Publication date: May 12, 2011
    Applicant: SONY CORPORATION
    Inventors: Kyoko Izuha, Hiromi Okazaki, Yoshiaki Kitano
  • Patent number: 7695068
    Abstract: A seat reclining apparatus for a vehicle includes first, second, and third gear mechanisms, each gear mechanism including a first frame having an internal gear and a second frame having an external gear engaging with the internal gear, the number of teeth of the external gear being fewer than the internal gear, wherein the first gear mechanism is provided at one side of a vehicle seat, and the second and third gear mechanisms are provided at the other side, a shaft connecting the first gear mechanism with the second and third gear mechanisms, and an electric motor rotating the shaft to shift an engagement position between the internal gear and the external gear for tilting the seatback relative to the seat cushion, wherein the electric motor is disposed at one of the first frame and the second frame of the first gear mechanism provided at the one side.
    Type: Grant
    Filed: March 25, 2008
    Date of Patent: April 13, 2010
    Assignees: Aisin Seiki Kabushiki Kaisha, Toyota Boshoku Kabushiki Kaisha, Toyota Shatai Kabushiki Kaisha
    Inventors: Kenji Maeda, Toshiyuki Tanaka, Hiromi Okazaki, Takuya Mizuno, Daisuke Ono, Eiji Mizutani
  • Publication number: 20080238172
    Abstract: A seat reclining apparatus for a vehicle includes first, second, and third gear mechanisms, each gear mechanism including a first frame having an internal gear and a second frame having an external gear engaging with the internal gear, the number of teeth of the external gear being fewer than the internal gear, wherein the first gear mechanism is provided at one side of a vehicle seat, and the second and third gear mechanisms are provided at the other side, a shaft connecting the first gear mechanism with the second and third gear mechanisms, and an electric motor rotating the shaft to shift an engagement position between the internal gear and the external gear for tilting the seatback relative to the seat cushion, wherein the electric motor is disposed at one of the first frame and the second frame of the first gear mechanism provided at the one side.
    Type: Application
    Filed: March 25, 2008
    Publication date: October 2, 2008
    Applicants: AISIN SEIKI KABUSHIKI KAISHA, TOYOTA BOSHOKU KABUSHIKI, Toyota Shatai Kabushiki Kaisha
    Inventors: Kenji Maeda, Toshiyuki Tanaka, Hiromi Okazaki, Takuya Mizuno, Daisuke Ono, Eiji Mizutani