Patents by Inventor Hiromi Ooniwa

Hiromi Ooniwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer and wafer cutting and dividing method
    Patent number: 7763526
    Abstract: A laser beam is applied to an interior of a wafer through a top surface to form modified areas in a plurality of layers of modified area groups. Intervals of the modified areas in one of the layers of modified area groups differ from intervals of the modified areas in another one of the layers of the modified area groups, which is closer to the top surface of the wafer in comparison to the one of the layers of the modified area groups.
    Type: Grant
    Filed: November 14, 2006
    Date of Patent: July 27, 2010
    Assignee: DENSO CORPORATION
    Inventors: Muneo Tamura, Hiromi Ooniwa
  • Wafer and wafer cutting and dividing method
    Publication number: 20070111481
    Abstract: A laser beam is applied to an interior of a wafer through a top surface to form modified areas in a plurality of layers of modified area groups. Intervals of the modified areas in one of the layers of modified area groups differ from intervals of the modified areas in another one of the layers of the modified area groups, which is closer to the top surface of the wafer in comparison to the one of the layers of the modified area groups.
    Type: Application
    Filed: November 14, 2006
    Publication date: May 17, 2007
    Applicant: DENSO CORPORATION
    Inventors: Muneo Tamura, Hiromi Ooniwa