Patents by Inventor Hiromi Otake

Hiromi Otake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210284783
    Abstract: Provided are a curable resin mixture and a curable resin composition which contain a polyalkenylphenol resin and an aromatic polymaleimide compound having high crystallinity and a high melting point, and which exhibit excellent fluidity and reactivity. Also provided is a method for producing a curable resin mixture that contains: (A) a polyalkenylphenol resin which contains a polyalkenylphenol compound having at least 2 phenol skeletons in the molecule, a prescribed 2-alkenyl group being bonded to some or all of aromatic rings that form the phenol skeletons in the molecule; and (B) an aromatic polymaleimide compound. The method comprises: heating the aromatic polymaleimide compound (B) to the melting point or above and thereby melting the compound; and mixing the molten aromatic polymaleimide compound (B) and the polyalkenylphenol resin (A) within a temperature range at which the aromatic polymaleimide compound (B) does not recrystallize.
    Type: Application
    Filed: May 25, 2017
    Publication date: September 16, 2021
    Applicant: SHOWA DENKO K.K.
    Inventors: Aoi HASEGAWA, Chika YAMASHITA, Yoshitaka ISHIBASHI, Tomonori TAJIMA, Hiromi OTAKE
  • Patent number: 10689493
    Abstract: A thermosetting resin composition includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). Polyalkenyl phenol resin (A) has at least one aromatic ring unit (a1) which may have a 2-alkenyl group bonded thereto and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group and which may have a 2-alkenyl group bonded thereto. At least one of aromatic ring units (a1, a2) has a 2-alkenyl group. Each aromatic ring unit is bonded by a linking group. When m represents the number of aromatic ring units (a1), and n represents the number of aromatic ring units (a2), n to (m+n) is 10-60%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: June 23, 2020
    Assignee: SHOWA DENKO K.K.
    Inventors: Hiromi Otake, Aoi Nakano, Chika Yamashita, Yoshitaka Ishibashi, Hiroshi Uchida
  • Patent number: 10160856
    Abstract: Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: December 25, 2018
    Assignee: SHOWA DENKO K.K.
    Inventors: Hiromi Otake, Aoi Nakano, Chika Yamashita, Yoshitaka Ishibashi, Hiroshi Uchida
  • Publication number: 20180282494
    Abstract: Provided is a thermosetting resin composition which is capable of obtaining, as a result of being cured, a highly reliable cured product exhibiting excellent moisture resistance, heat resistance, and mechanical strength. The present invention includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has or does not have a 2-alkenyl group bonded thereto, and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group, and which has or does not have a 2-alkenyl group bonded thereto. At least one of the aromatic ring units (a1, a2) has a 2-alkenyl group. Each of the aromatic ring units is bonded by a linking group. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of n to (m+n) is 10-60%.
    Type: Application
    Filed: December 11, 2015
    Publication date: October 4, 2018
    Applicant: SHOWA DENKO K.K.
    Inventors: Hiromi OTAKE, Aoi NAKANO, Chika YAMASHITA, Yoshitaka ISHIBASHI, Hiroshi UCHIDA
  • Publication number: 20170349743
    Abstract: Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (al) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%.
    Type: Application
    Filed: December 11, 2015
    Publication date: December 7, 2017
    Applicant: SHOWA DENKO K.K.
    Inventors: Hiromi OTAKE, Aoi NAKANO, Chika YAMASHITA, Yoshitaka ISHIBASHI, Hiroshi UCHIDA
  • Publication number: 20150188025
    Abstract: A container for electronic component includes a base and a cover. The base has a side surface and an upper surface. A depressed castellation in plan view is disposed on the side surface. The cover seals the upper surface airtight. The cover has an outside dimension smaller than an outside dimension of the base. The cover has a notch with a radial dimension larger than a depressed radial dimension of the castellation.
    Type: Application
    Filed: December 25, 2014
    Publication date: July 2, 2015
    Inventors: HIROMI OTAKE, SHARIMAN BIN ABDUL RAHMAN
  • Patent number: 7990026
    Abstract: In a crystal unit, a crystal blank is accommodated in a container body composed of a bottom wall layer and a frame wall layer, and a metal cover is bonded to the container body by a eutectic alloy. The crystal blank is held by a pair of crystal connecting terminals formed at a position to be an inner bottom surface of a container body on one end portion side of the container body. A grounding external terminal is arranged at one corner of the outer bottom surface of the container body at the other end portion side of the container body.
    Type: Grant
    Filed: January 17, 2008
    Date of Patent: August 2, 2011
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventor: Hiromi Otake
  • Publication number: 20100066210
    Abstract: In a crystal unit, a crystal blank is accommodated in a container body composed of a bottom wall layer and a frame wall layer, and a metal cover is bonded to the container body by a eutectic alloy. The crystal blank is held by a pair of crystal connecting terminals formed at a position to be an inner bottom surface of a container body on one end portion side of the container body. A grounding external terminal is arranged at one corner of the outer bottom surface of the container body at the other end portion side of the container body.
    Type: Application
    Filed: January 17, 2008
    Publication date: March 18, 2010
    Applicant: NIHON DEMPA KOGYO CO., LTD.
    Inventor: Hiromi Otake
  • Patent number: 5672947
    Abstract: The automatic guide method for vehicles relates to an automatic guide method for the operation of unmanned vehicles which, guided along guide paths preset on the floor in factories and warehouses, etc., carry and handle various loads in a fully automated fashion, and more particularly to an automatic guide method which has a course-search function and function to prevent straying such that a vehicle which is positioned at the start of an operation with its magnetic sensor off the guide path within certain limits or which strays off course abruptly for some reason during ordinary operation, is restored to the guide path by searching and finding the magnetic tape.
    Type: Grant
    Filed: September 15, 1995
    Date of Patent: September 30, 1997
    Assignee: Yazaki Industrial Chemical Co., Ltd.
    Inventors: Yukio Hisada, Hiromi Otake, Tadashi Ike, Motohiro Sugiyama