Patents by Inventor Hiromi Seko

Hiromi Seko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Honeycomb sandwich structure and method of manufacturing honeycomb sandwich structure
    Patent number: 10161810
    Abstract: A honeycomb sandwich structure formed of face skin materials made of fiber reinforced plastics and a honeycomb core has a structure in which an optical fiber sensor structure is embedded in an adhesive layer formed between the face skin materials and the honeycomb core. With this, it is possible to provide a honeycomb sandwich structure and a method of manufacturing the honeycomb sandwich structure that enable precise thermal control to be implemented even when a thermal control device is bonded onto a surface of the honeycomb sandwich structure and enable evaluation of a temperature with high resolution and high accuracy.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: December 25, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazushi Sekine, Hajime Takeya, Hiromi Seko, Yoshikazu Tanaka
  • HONEYCOMB SANDWICH STRUCTURE AND METHOD OF MANUFACTURING HONEYCOMB SANDWICH STRUCTURE
    Publication number: 20160109303
    Abstract: A honeycomb sandwich structure formed of face skin materials made of fiber reinforced plastics and a honeycomb core has a structure in which an optical fiber sensor structure is embedded in an adhesive layer formed between the face skin materials and the honeycomb core. With this, it is possible to provide a honeycomb sandwich structure and a method of manufacturing the honeycomb sandwich structure that enable precise thermal control to be implemented even when a thermal control device is bonded onto a surface of the honeycomb sandwich structure and enable evaluation of a temperature with high resolution and high accuracy.
    Type: Application
    Filed: December 19, 2013
    Publication date: April 21, 2016
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kazushi SEKINE, Hajime TAKEYA, Hiromi SEKO, Yoshikazu TANAKA
  • Honeycomb sandwich panel with built in heat pipes
    Patent number: 5727619
    Abstract: A sandwiched honeycomb panel with built in heat pipes includes a radiating fin which is integral with an envelope having a heat pipe formed therein. A heat block may be used in place of the radiating fin.
    Type: Grant
    Filed: July 10, 1996
    Date of Patent: March 17, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Akira Yao, Hiromi Seko
  • Honeycomb sandwich panel with built in heat pipes
    Patent number: 5682943
    Abstract: A sandwiched honeycomb panel with built in heat pipes includes a radiating fin which is integral with an envelope having a heat pipe formed therein. A heat block may be used in place of the radiating fin.
    Type: Grant
    Filed: July 1, 1996
    Date of Patent: November 4, 1997
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Akira Yao, Hiromi Seko