Abstract: An antenna element, an antenna module, and an electronic equipment using these, are small-sized, high in transmitting and receiving performance, and capable of transmitting and receiving electric waves at a plurality of frequencies. The antenna element includes two antennas having at least a feeder portion and an open portion, and current is fed to each feeder portion. The antenna module includes at least an antenna and a mounting body in which the antenna is mounted, and current is fed to each feeder portion. The electronic equipment includes at least the antenna element or antenna module, a signal modulator, a signal demodulator, a controller, a man-machine interface, and a casing.

Abstract: The invention is to provide such an antenna module making broadband of transmitting and receiving frequencies, while realizing miniaturization. The invention has a structure comprising a mounting body; a chip antenna having a substrate mounted on the mounting body and a substrate and a couple of terminal parts provided on the substrate; an feeding portion to which one of the terminal parts provided on the mounting body is connected; a open portion to which the other of the terminal parts provided on the mounting body is connected; and a capacitive conductor provided in opposition to the substrate, thereby to make use of a bottom area hidden when mounting the chip antenna so as to increase capacitive components for realizing broadband of the antenna module.

Abstract: An antenna apparatus includes a plurality of antennas having different resonance frequencies and a feeding section for supplying common power to feeding terminals of the plurality of antennas. Open terminals of the plurality of antennas are separate. As at least one of the plurality of antennas is implemented as a helical antenna having a helical conductor section trimmed, the transmission-reception band can be put into a wide band. Further, an antenna apparatus includes a plurality of antennas, a connection conductor provided between the antennas for connecting the antennas in series, a feeding section provided in one of terminal sections to which the connection conductor is not connected in the plurality of antennas connected in series, and an additional conductor provided in the other terminal section to which the connection conductor is not connected, wherein the additional conductor is an open end part.

Abstract: This invention provides an antenna module comprising: a helical antenna 1 including a base 2 and a pair of terminals 4, 5 and a helical area formed on the base 2; a power supply 7 for supplying power to one of the pair of terminals 4, 5 of the helical antenna 1; an opening connected to the other of the pair of terminals; an antenna substrate 9 on which the antenna 7 is mounted; a grounding area 10 formed in the vicinity of the power supply 7; and a peripheral conductor 16 formed at least a portion on the periphery of the antenna substrate 9, wherein the peripheral length of the peripheral conductor 16 formed on the periphery of the antenna substrate 9 is nearly integer times as long as ¼ wavelength of a resonance frequency.

Abstract: A chip antenna includes a substrate, a plurality of helical conductors provided on the substrate, and a pair of terminals provided on the substrate. One of the plurality of helical conductors is connected electrically to one of the terminals, and another one of the helical conductors is connected electrically to the other terminal. Thus, the antenna is of a small size, yet is a single unit which alone is capable of transmitting and receiving electromagnetic waves of a plurality of frequencies.

Abstract: The invention is to provide such an antenna module making broadband of transmitting and receiving frequencies, while realizing miniaturization. The invention has a structure comprising a mounting body; a chip antenna having a substrate mounted on the mounting body and a substrate and a couple of terminal parts provided on the substrate; an feeding portion to which one of the terminal parts provided on the mounting body is connected; a open portion to which the other of the terminal parts provided on the mounting body is connected; and a capacitive conductor provided in opposition to the substrate, thereby to make use of a bottom area hidden when mounting the chip antenna so as to increase capacitive components for realizing broadband of the antenna module.

Abstract: This invention provides an antenna module comprising: a helical antenna 1 including a base 2 and a pair of terminals 4, 5 and a helical area formed on the base 2; a power supply 7 for supplying power to one of the pair of terminals 4, 5 of the helical antenna 1; an opening connected to the other of the pair of terminals; an antenna substrate 9 on which the antenna 7 is mounted; a grounding area 10 formed in the vicinity of the power supply 7; and a peripheral conductor 16 formed at least a portion on the periphery of the antenna substrate 9, wherein the peripheral length of the peripheral conductor 16 formed on the periphery of the antenna substrate 9 is nearly integer times as long as ¼ wavelength of a resonance frequency.

Abstract: An antenna apparatus includes a plurality of antennas having different resonance frequencies and a feeding section for supplying common power to feeding terminals of the plurality of antennas. Open terminals of the plurality of antennas are separate. As at least one of the plurality of antennas is implemented as a helical antenna having a helical conductor section trimmed, the transmission-reception band can be put into a wide band. Further, an antenna apparatus includes a plurality of antennas, a connection conductor being provided between the antennas for connecting the antennas in series, a feeding section being provided in one of terminal sections to which the connection conductor is not connected in the plurality of antennas connected in series, and an additional conductor being provided in the other of terminal sections to which the connection conductor is not connected, wherein the additional conductor is an open end part.

Abstract: A non-reciprocal circuit device has a length, a width, and a thickness denoted respectively by L1, L2, and L3, and the overall dimensions of 2.5 mm<L1<7.0 mm, 2.5 mm<L2<7.0 mm, and 1.0 mm<L3<3.5 mm. When a projected area of the substrate of the device is orthogonally projected on a plane parallel to a base surface of the substrate is denoted by S1, the substrate holds a proportional relation to S1/(L1×L2)=0.1 to 0.78. When a thickness of the magnet of the device is denoted by L4, the magnet holds a proportional relation of L4/L3=0.2 to 0.5. When a projected area of the magnet orthogonally formed on a plane parallel to a surface of the magnet is denoted by S2, they have a proportional relation of S1/S2=0.15 to 0.83.

Abstract: The invention provides an antenna element, antenna module, and electronic equipment using these, which are small-sized, high in transmitting and receiving performance, and capable of transmitting and receiving electric waves at a plurality of frequencies. Such antenna element comprises two antennas having at least a feeder portion and an open portion, and current is fed to each feeder portion. The antenna module comprises at least an antenna and a mounting body in which the antenna is mounted, and current is fed to each feeder portion. The electronic equipment comprises at least the antenna element or antenna module, a signal modulator, a signal demodulator, a controller, a man-machine interface, and a casing.

Abstract: A compact non-reciprocal circuit device capable of handling a high power without impairment of the characteristics. The non-reciprocal circuit device contains a magnetic substrate that exhibits anisotropic behavior by application of a direct-current magnetic field. On the surface of the substrate, strip-lines are disposed at an angle, being insulated with each other. One end of each strip-line is grounded, and the other end of each is connected through a capacitor to a ground. Of the ends connecting the capacitors, one end connects to a termination resistor; the remaining ends connect each to an input terminal and an output terminal. The non-reciprocal circuit device exhibits non-reciprocal characteristics between the input and output terminals. The case of the device contains an insulating thermal conductor that serves as a heat-radiator for the termination resistor and the strip-lines.

Abstract: A chip antenna includes a substrate, a plurality of helical conductors provided on the substrate, and a pair of terminals provided on the substrate. One of the plurality of helical conductors is connected electrically to one of the terminals, and another one of the helical conductors is connected electrically to the other terminal. Thus, the antenna is of a small size, yet is a single unit which alone is capable of transmitting and receiving electromagnetic waves of a plurality of frequencies.

Abstract: A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them from the upper and lower surfaces thereof. The mold resin defines a chip mounting recess at an upper side on the first surfaces of the leads, so that a semiconductor chip is to be mounted in the recess. The upper surfaces of the leads are partially exposed in the recess so as to define internal connecting terminals to which the semiconductor chip is to be electrically connected. The mold resin is provided with a plurality of holes by which the lower surfaces of the leads are partially exposed to define external connecting terminals.

Abstract: A compact non-reciprocal circuit device capable of handling a high power without impairment of the characteristics. The non-reciprocal circuit device contains a magnetic substrate that exhibits anisotropic behavior by application of a direct-current magnetic field. On the surface of the substrate, strip-lines are disposed at an angle, being insulated with each other. One end of each strip-line is grounded, and the other end of each is connected through a capacitor to a ground. Of the ends connecting the capacitors, one end connects to a termination resistor; the remaining ends connect each to an input terminal and an output terminal. The non-reciprocal circuit device exhibits non-reciprocal characteristics between the input and output terminals. The case of the device contains an insulating thermal conductor that serves as a heat-radiator for the termination resistor and the strip-lines.

Abstract: A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them from the upper and lower surfaces thereof. The mold resin defines a chip mounting recess at an upper side on the first surfaces of the leads, so that a semiconductor chip is to be mounted in the recess. The upper surfaces of the leads are partially exposed in the recess so as to define internal connecting terminals to which the semiconductor chip is to be electrically connected. The mold resin is provided with a plurality of holes by which the lower surfaces of the leads are partially exposed to define external connecting terminals.

Abstract: A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them from the upper and lower surfaces thereof. The mold resin defines a chip mounting recess at an upper side on the first surfaces of the leads, so that a semiconductor chip is to be mounted in the recess. The upper surfaces of the leads are partially exposed in the recess so as to define internal connecting terminals to which the semiconductor chip is to be electrically connected. The mold resin is provided with a plurality of holes by which the lower surfaces of the leads are partially exposed to define external connecting terminals.

Abstract: The object of the present invention is to provide a premolded-type package for a semiconductor device which can be produced easily and exhibits a good airtightness, and to provide a method for effectively producing the same. A package for a semiconductor device has a wiring substrate 32 having a resin substrate 35 which is provided on its one surface with a wiring pattern 37, a chip-mounting portion 36 and a frame-like pattern 38 of a metal surrounding the wiring pattern 37 and the chip-mounting portion 36, and on the other surface with a plurality of terminals 41 electrically connected to the wiring pattern, and a frame-like molded portion 45 of thermosetting resin, molded on the frame-like pattern 38 on the wiring substrate 32.

Abstract: A dielectric ceramic composition represented by the compositional formula: .sub.x BaO-.sub.y TiO.sub.2 -.sub.z Nd.sub.2 O.sub.3 -.sub.t Sm.sub.2 O.sub.3 -.sub.w Bi.sub.2 O.sub.3 so composed as to be in the molar fractions of 0.06.ltoreq.x.ltoreq.0.25, 0.60.ltoreq.y.ltoreq.0.80, 0.05.ltoreq.z.ltoreq.0.18, 0<t.ltoreq.0.07 and 0<w.ltoreq.0.05, provided that x+y+z+t+w=1, and a compositional range of Y<0.68 and Z>0.15 is excluded. As an additive, at least one of Al.sub.2 O.sub.3, ZrO.sub.2, etc. may be added. Part of Ba may be replaced with at least one of Sr, Ca and Mg. The Sm.sub.2 O.sub.3 and Nd.sub.2 O.sub.3 each may have a purity of at least 70 wt. %.