Patents by Inventor Hiromi Yokota

Hiromi Yokota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10041148
    Abstract: When a Cu—Sn—Bi had—particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 ?m, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.
    Type: Grant
    Filed: July 23, 2012
    Date of Patent: August 7, 2018
    Assignee: TAIHO KOGYO CO., LTD.
    Inventors: Hiromi Yokota, Daisuke Yoshitome
  • Patent number: 9669461
    Abstract: Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: June 6, 2017
    Assignee: TAIHO KOGYO CO., LTD.
    Inventors: Hitoshi Wada, Takashi Tomikawa, Daisuke Yoshitome, Hiromi Yokota
  • Patent number: 9512378
    Abstract: A sliding material based on graphite-added resin containing 5 to 60% by weight of graphite particles having an average particle diameter of from 5 to 50 ?m, and a degree of graphitization of 0.6 or more, with the balance being one or more of polyimide resin and polyamide-imide resin, and further, the number of the graphite particles having a minimum diameter/maximum diameter ratio (hereinafter referred to as “particle ratio”) of 0.5 or more amounts to 50% or more of the total number of the graphite particles observed in a photograph of an optional cross section of the sliding material based on graphite-added resin.
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: December 6, 2016
    Assignee: TAIHO KOGYO CO., LTD.
    Inventors: Ryo Mukai, Hiromi Yokota, Akira Sawamoto, Takao Masamura, Masanori Akizuki
  • Patent number: 9434005
    Abstract: A method of producing a Pb-free copper-alloy sliding material containing 1.0 to 15.0% of Sn, 0.5 to 15.0% of Bi and 0.05 to 5.0% of Ag, and Ag and Bi from an Ag—Bi eutectic. If necessary, at least one of 0.1 to 5.0% of Ni, 0.02 to 0.2% P, 0.5 to 30.0% of Zn, and 1.0 to 10.0 mass % of at least one of a group consisting of Fe3P, Fe2P, FeB, NiB and AlN may be added.
    Type: Grant
    Filed: June 11, 2012
    Date of Patent: September 6, 2016
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Hiromi Yokota, Ryo Mukai, Shinichi Kato, Nahomi Hamaguchi
  • Patent number: 9028582
    Abstract: Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.
    Type: Grant
    Filed: January 22, 2009
    Date of Patent: May 12, 2015
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Hitoshi Wada, Takashi Tomikawa, Daisuke Yoshitome, Hiromi Yokota
  • Patent number: 8993493
    Abstract: Sliding parts are made of Pb-free Cu—Bi based sintered material. The side in contact with a shaft is machined to a predetermined roughness. A number of Bi phases are present on the finished surface. Stable performance of Bi is to be exhibited. Machined sintered material covers a portion of the Bi phases. The ratio of the exposed surface area of the Bi phases is 0.5% or more relative to the area of the finished surface.
    Type: Grant
    Filed: September 9, 2009
    Date of Patent: March 31, 2015
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Ryo Mukai, Hiromi Yokota, Kao Mouri
  • Patent number: 8845776
    Abstract: The present invention relates to sliding material provided by sintering a lead-free copper or copper alloy and contains at least one mineral selected from the group consisting of talc, mica, kaolinite mineral and montmorillonite mineral. Pb has conventionally been included in sliding materials for the purpose of obtaining conformability and seizure resistance. Despite the absence of Pb, the Pb-free copper-based sliding material and sliding parts according to the present invention have improved sliding properties.
    Type: Grant
    Filed: April 27, 2010
    Date of Patent: September 30, 2014
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Ryo Mukai, Atsushi Koyama, Nahomi Hamaguchi, Kao Mouri, Hiromi Yokota
  • Publication number: 20140147326
    Abstract: Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.
    Type: Application
    Filed: January 30, 2014
    Publication date: May 29, 2014
    Applicant: TAIHO KOGYO CO., LTD.
    Inventors: Hitoshi WADA, Takashi TOMIKAWA, Daisuke YOSHITOME, Hiromi YOKOTA
  • Publication number: 20130116157
    Abstract: [Task] Seizure resistance of sliding material based on graphite-added resin is improved. [Means for Solution] A sliding material based on graphite-added resin has composition (1); graphite: average particle diameter of from 5 to 50 ?m, a degree of graphitization of 0.6 or more, the number of graphite particles having a minimum diameter/maximum diameter ratio of 0.5 or more amounts to 50% or more of the total number of the graphite particles observed in a photograph of an optional cross section, content 5 to 60% by weight, as well as composition (2). balance of polyimide resin and/or polyamide-imide resin.
    Type: Application
    Filed: April 7, 2011
    Publication date: May 9, 2013
    Applicant: TAIHO KOGYO CO., LTD.
    Inventors: Ryo Mukai, Hiromi Yokota, Akira Sawamoto, Takao Masamura, Masanori Akizuki
  • Publication number: 20120294750
    Abstract: When a Cu—Sn—Bi had-particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 ?m, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.
    Type: Application
    Filed: July 23, 2012
    Publication date: November 22, 2012
    Inventors: HIROMI YOKOTA, Daisuke Yoshitome
  • Publication number: 20120251375
    Abstract: A method of producing a Pb-free copper-alloy sliding material containing 1.0 to 15.0% of Sn, 0.5 to 15.0% of Bi and 0.05 to 5.0% of Ag, and Ag and Bi from an Ag—Bi eutectic. If necessary, at least one of 0.1 to 5.0% of Ni, 0.02 to 0.2% P, 0.5 to 30.0% of Zn, and 1.0 to 10.0 mass % of at least one of a group consisting of Fe3P, Fe2P, FeB, NiB and AlN may be added.
    Type: Application
    Filed: June 11, 2012
    Publication date: October 4, 2012
    Inventors: Hiromi YOKOTA, Ryo Mukai, Shinichi Kato, Nahomi Hamaguchi
  • Publication number: 20120096988
    Abstract: The present invention relates to sliding material provided by sintering a lead-free copper or copper alloy and contains at least one mineral selected from the group consisting of talc, mica, kaolinite mineral and montmorillonite mineral. Pb has conventionally been included in sliding materials for the purpose of obtaining conformability and seizure resistance. Despite the absence of Pb, the Pb-free copper-based sliding material and sliding parts according to the present invention have improved sliding properties.
    Type: Application
    Filed: April 27, 2010
    Publication date: April 26, 2012
    Applicant: TAIHO KOGYO CO., LTD.
    Inventors: Ryo Mukai, Atsushi Koyama, Nahomi Hamaguchi, Kao Mouri, Hiromi Yokota
  • Publication number: 20110224112
    Abstract: Sliding parts are made of Pb-free Cu-Bi based sintered material. The side in contact with a shaft is machined to a predetermined roughness. A number of Bi phases are present on the finished surface. Stable performance of Bi is to be exhibited. Machined sintered material covers a portion of the Bi phases. The ratio of the exposed surface area of the Bi phases is 0.5% or more relative to the area of the finished surface.
    Type: Application
    Filed: September 9, 2009
    Publication date: September 15, 2011
    Applicant: TAIHO KOGYO CO., LTD.
    Inventors: Ryo Mukai, Hiromi Yokota, Kao Mouri
  • Publication number: 20110129173
    Abstract: [Task] In the provided Cu-based sliding material, the properties equivalent to those of a Pb-containing material is attained even free of Pb, and material has stable friction coefficient. [Solution Means] A Pb-free copper-alloy sliding material contains 1.0 to 15.0% of Sn, 0.5 to 15.0% of Bi and 0.05 to 5.0% of Ag, and Ag and Bi from an Ag—Bi eutectic. If necessary, at least one of 0.1 to 5.0% of Ni, 0.02 to 0.2% P, and 0.5 to 30.0% of Zn is contained. Further, if necessary, 1.0 to 10.0 mass % of at least one of a group consisting of Fe3P, Fe2P, FeB, NiB and AlN, having an average particle diameter of 1.5 to 70 ?m is contained.
    Type: Application
    Filed: May 14, 2008
    Publication date: June 2, 2011
    Applicant: TAIHO KOGYO CO., LTD.
    Inventors: Hiromi Yokota, Ryo Mukai, Shinichi Kato, Nahomi Hamaguchi
  • Patent number: 7883588
    Abstract: In a Cu—Bi based sintered alloy, to which hard particles, such as Fe3P, are added, the main constituent components of the microstructure are a Cu matrix, Bi phase and the hard particles. In the sintering method of the present invention, the flow of the Bi phase is suppressed to as low level as possible. The novel structure is that the contact between the Bi phase and hard particles is kept to a low ratio. A lead-free bearing used for a fuel injection pump according to the present invention contains from 1 to 30 mass % of Bi and from 0.1 to 10 mass % of hard particles having from 10 to 50 ?m of the average particle diameter, the balance being Cu and unavoidable impurities. The properties of the main component phases are utilized at a high level such that the sliding properties are equivalent to those of a Pb containing Cu-based sintered alloy.
    Type: Grant
    Filed: June 9, 2005
    Date of Patent: February 8, 2011
    Assignees: Taiho Kogyo Co., Ltd., Denso Corporation
    Inventors: Hiromi Yokota, Daisuke Yoshitome, Hiroaki Hayakawa, Naruhiko Inayoshi, Youichi Murakami, Masashi Suzuki, Takahiro Nozu
  • Publication number: 20110020171
    Abstract: Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.
    Type: Application
    Filed: January 22, 2009
    Publication date: January 27, 2011
    Inventors: Hitoshi Wada, Takashi Tomikawa, Daisuke Yoshitome, Hiromi Yokota
  • Publication number: 20100266444
    Abstract: When a Cu—Sn—Bi had-particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 ?m, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.
    Type: Application
    Filed: August 2, 2007
    Publication date: October 21, 2010
    Applicant: TAIHO KOGYO CO., LTD.
    Inventors: Hiromi Yokota, Daisuke Yoshitome
  • Patent number: 7678173
    Abstract: In a Pb-free copper-based sintered alloy containing from 1 to 30% of Bi and from 0.1 to 10% of hard matter particles having from 10 to 50 ?m of average particle diameter, the Bi phase has a smaller average particle diameter than that of the hard matter particles and is dispersed in the Cu matrix, or the hard matter particles having 50% or less of a contact length ratio with the Bi phase based on the total circumferential length of the hard particle, which are in contact with said Bi phase, are present in a ratio of 70% or more based on the entire number of the hard matter particles.
    Type: Grant
    Filed: January 13, 2005
    Date of Patent: March 16, 2010
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Hiromi Yokota, Daisuke Yoshitome, Hiroaki Kobayashi, Hiroyuki Kawaguti
  • Publication number: 20080095658
    Abstract: [PROBLEMS] To provide a Cu—Bi—hard substance base sintered alloy in which the respective properties of Bi and hard substance can be satisfactorily exerted. [MEANS FOR SOLVING PROBLEMS] There is provided a Ph free copper base sintered alloy, comprising 1 to 30% of Bi and 0.1 to 10% of hard substance particles of 10 to 50 ?m average diameter, (1) wherein a Bi phase having an average particle diameter smaller than that of the hard substance particles is dispersed in a matrix of Cu, or wherein with respect to a Bi phase in contact with the hard substance particles, the ratio of presence of hard substance particles exhibiting a ratio of hard substance particle contact length to entire circumference of Bi phase of 50% or less is 70% or greater based on the total number of hard substance particles.
    Type: Application
    Filed: January 13, 2005
    Publication date: April 24, 2008
    Inventors: Hiromi Yokota, Daisuke Yoshitome, Hiroaki Kobayashi, Hiroyuki Kawaguti
  • Publication number: 20060000527
    Abstract: In a Cu—Bi based sintered alloy, to which hard particles, such as Fe3P, are added, the main constituent components of the microstructure are a Cu matrix, Bi phase and the hard particles. In the sintering method of the present invention, the flow of the Bi phase is suppressed to as low level as possible. The novel structure is that the contact between the Bi phase and hard particles is kept to a low ratio. A lead-free bearing used for a fuel injection pump according to the present invention contains from 1 to 30 mass % of Bi and from 0.1 to 10 mass % of hard particles having from 10 to 50 ?m of the average particle diameter, the balance being Cu and unavoidable impurities. The properties of the main component phases are utilized at a high level such that the sliding properties are equivalent to those of a Pb containing Cu-based sintered alloy.
    Type: Application
    Filed: June 9, 2005
    Publication date: January 5, 2006
    Applicants: TAIHO KOGYO Co., Ltd., Kabushiki Kaisya Denso
    Inventors: Hiromi Yokota, Daisuke Yoshitome, Hiroaki Hayakawa, Naruhiko Inayoshi, Youichi Murakami, Masashi Suzuki, Takahiro Nozu