Patents by Inventor Hiromichi Akiyama

Hiromichi Akiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10717243
    Abstract: Provided is a preform member bonding method of bonding a preform member and another member with an adhesive in an RTM process. The preform member bonding method includes increasing viscosity of the adhesive by heat-treating only the adhesive in advance before inserting the adhesive between bonding surfaces of the preform member and the other member.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: July 21, 2020
    Assignee: MITSUBISHI AIRCRAFT CORPORATION
    Inventors: Yuichi Yui, Akihisa Okuda, Hiromichi Akiyama
  • Publication number: 20200169322
    Abstract: An information transmitter apparatus for use in an information transmission system is provided, where the information transmission system includes the information transmitter apparatus and an information receiver apparatus. The information transmitter apparatus transmits a surface-shaped visible light signal using a light source, where the visible light signal is modulated according to a modulated signal modulated using a plurality of respective-order carriers different from each other, and the respective-order carriers has a fundamental frequency and multiple frequencies of a frame output signal of a video camera of rolling shutter system provided in an information receiver apparatus. The information receiver apparatus receives the visible light signal using the video camera.
    Type: Application
    Filed: July 2, 2018
    Publication date: May 28, 2020
    Inventors: Hiromichi HASHIZUME, Masanori SUGIMOTO, Takayuki AKIYAMA, Hayato KUMAKI, Shota SHIMADA
  • Publication number: 20200047376
    Abstract: A method for producing a composite material structure contains a film attachment step (S2) of attaching a protective film to a molding member; a molding step (S3) of attaching a composite material which is a heating target to the molding member from above the protective film, accommodating the molding member in a pressure container, and molding a molded article; and a molded article removal step (S4) of removing the molded article from the molding member to which the protective film is attached. The protective film is a heat-resistance mold release film having a fluorine content of less than 0.1%.
    Type: Application
    Filed: June 13, 2018
    Publication date: February 13, 2020
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Yosuke TAKAHASHI, Akihito SUZUKI, Hiromichi AKIYAMA
  • Patent number: 10369753
    Abstract: The present invention aims to sufficiently impregnate each layer of a fiber substrate group composed of fiber substrates, which are used for fiber-reinforced resin molding by a resin injection method, with a resin. To successively stack a plurality of fiber substrates, each of which has arrayed fiber bundles and is a material composing a fiber-reinforced resin along with a resin, with their fiber bundles oriented in the same direction, the plurality of fiber substrates are integrated in a state where border zones between the fiber bundles adjacent to each other in an array direction are aligned with one another among the fiber substrates.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: August 6, 2019
    Assignee: MITSUBISHI AIRCRAFT CORPORATION
    Inventors: Hiromichi Akiyama, Hideki Horizono, Kazuaki Kishimoto, Masahiro Shinya, Shinya Suzukake
  • Patent number: 10105912
    Abstract: The present invention aims to sufficiently impregnate each layer of a fiber substrate group composed of fiber substrates, which are used for fiber-reinforced resin molding by a resin injection method, with a resin. To successively stack a plurality of fiber substrates, each of which has arrayed fiber bundles and is a material composing a fiber-reinforced resin along with a resin, with their fiber bundles oriented in the same direction, the plurality of fiber substrates are integrated in a state where border zones between the fiber bundles adjacent to each other in an array direction are aligned with one another among the fiber substrates.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: October 23, 2018
    Assignee: MITSUBISHI AIRCRAFT CORPORATION
    Inventors: Hiromichi Akiyama, Hideki Horizono, Kazuaki Kishimoto, Masahiro Shinya, Shinya Suzukake
  • Patent number: 10022918
    Abstract: The present invention aims to sufficiently impregnate each layer of a fiber substrate group composed of fiber substrates, which are used for fiber-reinforced resin molding by a resin injection method, with a resin. To successively stack a plurality of fiber substrates, each of which has arrayed fiber bundles and is a material composing a fiber-reinforced resin along with a resin, with their fiber bundles oriented in the same direction, the plurality of fiber substrates are integrated in a state where border zones between the fiber bundles adjacent to each other in an array direction are aligned with one another among the fiber substrates.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: July 17, 2018
    Assignee: MITSUBISHI AIRCRAFT CORPORATION
    Inventors: Hiromichi Akiyama, Hideki Horizono, Kazuaki Kishimoto, Masahiro Shinya, Shinya Suzukake
  • Patent number: 9993949
    Abstract: Provided is a preform member bonding method, in a RTM process, for bonding a preform member and another member (a preform member or a hardened member) together with an adhesive. The preform member bonding method includes: beforehand obtaining data on a range of a level of progress in hardening of the adhesive which allows the adhesive to penetrate the preform member, and data on a range of the level of progress in the hardening of the adhesive which decreases bonding strength of the adhesive; and controlling the level of progress in the hardening of the adhesive by heat-treating the adhesive based on these data, before the preform member comes into contact with the adhesive.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: June 12, 2018
    Assignee: MITSUBISHI AIRCRAFT CORPORATION
    Inventors: Yuichi Yui, Akihisa Okuda, Hiromichi Akiyama
  • Publication number: 20160346963
    Abstract: Provided is a preform member bonding method, in a RTM process, for bonding a preform member and another member (a preform member or a hardened member) together with an adhesive. The preform member bonding method includes: beforehand obtaining data on a range of a level of progress in hardening of the adhesive which allows the adhesive to penetrate the preform member, and data on a range of the level of progress in the hardening of the adhesive which decreases bonding strength of the adhesive; and controlling the level of progress in the hardening of the adhesive by heat-treating the adhesive based on these data, before the preform member comes into contact with the adhesive.
    Type: Application
    Filed: April 26, 2016
    Publication date: December 1, 2016
    Inventors: Yuichi Yui, Akihisa Okuda, Hiromichi Akiyama
  • Publication number: 20160346973
    Abstract: Provided is a preform member bonding method of bonding a preform member and another member with an adhesive in an RTM process. The preform member bonding method includes increasing viscosity of the adhesive by heat-treating only the adhesive in advance before inserting the adhesive between bonding surfaces of the preform member and the other member.
    Type: Application
    Filed: April 26, 2016
    Publication date: December 1, 2016
    Inventors: Yuichi Yui, Akihisa Okuda, Hiromichi Akiyama
  • Publication number: 20160243770
    Abstract: The present invention aims to sufficiently impregnate each layer of a fiber substrate group composed of fiber substrates, which are used for fiber-reinforced resin molding by a resin injection method, with a resin. To successively stack a plurality of fiber substrates, each of which has arrayed fiber bundles and is a material composing a fiber-reinforced resin along with a resin, with their fiber bundles oriented in the same direction, the plurality of fiber substrates are integrated in a state where border zones between the fiber bundles adjacent to each other in an array direction are aligned with one another among the fiber substrates.
    Type: Application
    Filed: December 28, 2015
    Publication date: August 25, 2016
    Inventors: Hiromichi AKIYAMA, Hideki HORIZONO, Kazuaki KISHIMOTO, Masahiro SHINYA, Shinya SUZUKAKE
  • Publication number: 20140070452
    Abstract: Provided is a method for molding a molded article without voids, porosity, and resin sinks on the surface or inside while maintaining a plate thickness accuracy even for a thick plate member having a plate thickness of 10 mm or more. A RTM method comprising a first temperature raising step comprising impregnating a thermosetting resin in a dry fiber preform disposed in a molding die comprising two or more separate die members, and thereafter raising temperature of any of the die members constituting the molding die to form a temperature gradient having a temperature difference of a predetermined value or more from one side of the dry fiber preform toward the other side; and a second temperature raising step of raising temperature of a die member different from the die member whose temperature is raised in the first temperature raising step.
    Type: Application
    Filed: March 15, 2012
    Publication date: March 13, 2014
    Inventors: Hiromichi Akiyama, Masayuki Kanemasu