Abstract: An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.

Abstract: An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.

Abstract: An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.

Abstract: An outer case connector portion, a gauge housing case, and the like for use with a pressure sensor, for example, are generally made of a thermoplastic or thermosetting resin. However, the resin physically causes curing shrinkage. Especially when a metal is insert molded with a resin, curing shrinkage of the resin generates a gap at the interface between the resin and the metal. By filling an anaerobic, high-permeability adhesive in the gap, hermetic sealing can be ensured and reliability can be enhanced. Inexpensive hermetic sealing and enhanced reliability are realized.

Abstract: An outer case connector portion, a gauge housing case, and the like for use with a pressure sensor, for example, are generally made of a thermoplastic or thermosetting resin. However, the resin physically causes curing shrinkage. Especially, when a metal is insert molded with a resin, curing shrinkage of the resin generates a gap at the interface between the resin and the metal. By filling an anaerobic, high-permeability adhesive in the gap, hermetic sealing can be ensured and reliability can be enhanced. Inexpensive hermetic sealing and enhanced reliability are realized.

Abstract: An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.

Abstract: The present invention provides a pressure detector capable of easily responding to changes in specification. The pressure detector has a sensor unit for detecting pressure and electronic parts for reducing electrical disturbance which are electrically joined to an exposed part of lead material of an opening of an external case. Thermoset resin is injected and set in the opening to obtain fixed members. An external electronic part for compensating for transient voltage resistance and electromagnetic failure resistance of a single one-chip semiconductor sensor can be mounted, and cost can be reduced by miniaturization, light weight, and reduction in man-hours required for assembly.

Abstract: The present invention provides a pressure detector capable of easily responding to changes in the specification. The pressure detector that the sensor unit 11 for detecting pressure and the electronic parts 35 and 36 for reducing electrical disturbance are electrically joined to the exposed part 24 of the lead material of the opening 28 of the external case 28 and the thermoset resin 38 is injected and set in the opening, thus the members are fixed can be obtained. An external electronic part for compensating for the transient voltage resistance and electromagnetic failure resistance of a single one-chip semiconductor sensor can be mounted and the cost can be reduced by miniaturization, lightweight, and reduction in the assembly man-hour.

Abstract: A semiconductor acceleration sensor is formed by a cantilever having a conductive movable electrode of predetermined mass at one end, at least one pair of fixed conductive electrodes which are stationary with respect to the movable electrode located on opposing sides of the movable electrode, and gaps provided between the movable electrode and the fixed electrodes. To prevent the movable electrode becoming fused to the contacted fixed electrode, in a first aspect of this invention, an insulating layer is provided between the movable electrode and fixed electrodes, the layer being either on the movable electrode or on the fixed electrodes and in a second aspect the movable electrode or, preferably, the fixed electrodes, are formed of a high melting point material. In such a second aspect, to improve adhesion between the high melting point material and a substrate to which the fixed electrodes are mounted, a lower melting point material is firstly coated on the substrates.

Abstract: An electrostatic type micro accelerometer comprising means for preventing permanent sticking between a movable electrode and a stationary electrode due to residual dielectric polarization, resisual electric charges and water adsorption and condensation around possible contacting portions therebetween when the movable electrode excessively displaces. The sticking preventing means is realized by disposing one of electric field reducing means, water adsorption and condensation reducing means and contacting area limiting means around the possible contacting portions.

Abstract: A capacitive type semiconductor accelerometer has an intermediate silicon plate of n type conductivity including a movable electrode constituting a pendulum mass formed within the intermediate silicon plate and supported thereby via a beam so as to permit movement in a direction perpendicular to its plane. A first conductive island is formed within the intermediate plate and is immovably supported thereby via a first insulating leg so as to be isolated therefrom, and an upper glass plate is anodic bonded to the intermediate silicon plate. A first stationary electrode is formed on the upper glass plate at the position facing one face of the movable electrode with a predetermined gap. A lower glass plate is anodic bonded to the intermediate silicon plate and a second stationary electrode is formed on the lower glass plate at the position facing the other face of the movable electrode with a predetermined gap.