Abstract: A thermally conductive sheet comprising an anisotropic filler 12 in a polymer matrix 14, wherein the anisotropic filler 12 appears on at least one surface and the at least one surface has an arithmetic mean peak curvature (Spc) of 18000 (1/mm) or less.

Abstract: The present invention is a thermally conductive sheet comprising: a matrix comprising an organic polymer, and a carbon fiber X, the carbon fiber X being oriented in a thickness direction of the sheet, wherein a proportion of a carbon fiber (A) having a fiber length of 100 µm or less is 40% or more and a proportion of a carbon fiber (B) having a fiber length of 200 µm or more is 3 to 13% of the carbon fiber X. According to the present invention, a thermally conductive sheet in which the thermal resistance value is effectively reduced by polishing the surface, resulting in a sheet having a low thermal resistance value can be provided.

Abstract: Provided is a heat-conductive sheet including: a binder component that is a mixture of a silicone matrix (A) and a hydrocarbon compound (B); and a heat-conductive filler (C) dispersed in the binder component, wherein the heat-conductive sheet has a compression ratio at 80° C. and 0.276 MPa of 15% or more and a shape retention.

Abstract: A thermally conductive sheet comprising an anisotropic filler 12 in a polymer matrix 14, wherein the anisotropic filler 12 appears on at least one surface and the at least one surface has an arithmetic mean peak curvature (Spc) of 18000 (1/mm) or less.