Abstract: A multilayer circuit board 3a includes a core substrate 7; a resin section 8, which covers the side surface and a lower surface 12 of the core substrate 7; and a plurality of metal pins 11, which are disposed within the resin section 8. The core substrate 7 includes a ceramic multilayer section 9, which is disposed on the mother-substrate side of the core substrate 7; and a resin multilayer section 10, which is stacked on a main surface 13 on a side of the ceramic multilayer section 9, the side being opposite to the mother substrate. The resin section 8 includes the plurality of metal pins 11, and a through-hole 22, which extends through the resin section 8 in its thickness direction. A fastening part 24 penetrates the through-hole 22, to mount the multilayer circuit board 3a on the mother substrate.

Abstract: A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1>X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

Abstract: A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1>X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

Abstract: A composite substrate that is composed of a resin layer including an interlayer connection metal conductor and multiple ceramic layers that each include interlayer connection metal conductor, such that the resin layer is interposed between the ceramic layers, and the interlayer connection metal conductor in the resin layer is integrated with the interlayer connection metal conductors in the ceramic layers.

Abstract: A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1>X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

Abstract: An electronic device that includes an electronic component mounted on a multilayer ceramic substrate. The electronic component includes a connection terminal on the mounting surface side thereof, the connection terminal having an end with a rounded convex shape when viewed in cross section. The multilayer ceramic substrate includes a recessed portion at a position corresponding to the connection terminal, the recessed portion having a rounded concave shape when viewed in cross section, and a surface electrode disposed on at least part of the recessed portion and electrically connected to the connection terminal.

Abstract: A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1>X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

Abstract: A composite substrate that is composed of a resin layer including an interlayer connection metal conductor and multiple ceramic layers that each include interlayer connection metal conductor, such that the resin layer is interposed between the ceramic layers, and the interlayer connection metal conductor in the resin layer is integrated with the interlayer connection metal conductors in the ceramic layers.

Abstract: A multilayer circuit board 3a includes a core substrate 7; a resin section 8, which covers the side surface and a lower surface 12 of the core substrate 7; and a plurality of metal pins 11, which are disposed within the resin section 8. The core substrate 7 includes a ceramic multilayer section 9, which is disposed on the mother-substrate side of the core substrate 7; and a resin multilayer section 10, which is stacked on a main surface 13 on a side of the ceramic multilayer section 9, the side being opposite to the mother substrate. The resin section 8 includes the plurality of metal pins 11, and a through-hole 22, which extends through the resin section 8 in its thickness direction. A fastening part 24 penetrates the through-hole 22, to mount the multilayer circuit board 3a on the mother substrate.

Abstract: A low temperature co-fired ceramic material includes a SiO2—BaO—Al2O3-based primary component, and, as secondary components, 0.044 to 0.077 parts by weight of iron in terms of Fe2O3 and 0.30 to 0.55 parts by weight of zirconium in terms of ZrO2 relative to 100 parts by weight of the SiO2—BaO—Al2O3-based primary component. The SiO2—BaO—Al2O3-based primary component preferably includes 47% to 60% by weight of SiO2, 20% to 42% by weight of BaO, and 5% to 30% by weight of Al2O3.

Abstract: A low temperature co-fired ceramic material includes a SiO2—BaO—Al2O3-based primary component, and, as secondary components, 0.044 to 0.077 parts by weight of iron in terms of Fe2O3 and 0.30 to 0.55 parts by weight of zirconium in terms of ZrO2 relative to 100 parts by weight of the SiO2—BaO—Al2O3-based primary component. The SiO2—BaO—Al2O3-based primary component preferably includes 47% to 60% by weight of SiO2, 20% to 42% by weight of BaO, and 5% to 30% by weight of Al2O3.

Abstract: A ceramic multilayer substrate having excellent migration resistance and high bonding strength between a resin sealing material and a ceramic multilayer substrate body, includes a laminated substrate body having lands, and external electrodes, and covered with a siloxane film formed by a PVD process. The thickness of the siloxane film is lower than about 100 nm. After that, external electrodes of a mounting component are electrically connected and firmly hold to the lands of the laminated substrate body via solder. Next, a resin sealing material for sealing the mounting component is formed on the laminated substrate body.

Abstract: A method of producing a ceramic multilayer substrate involves producing a green composite laminate 11 containing first and second shrink-suppressing layers formed on the main surfaces of a green multilayer mother substrate 12 having a plurality of ceramic green layers 17 containing ceramic powder, the shrink-suppressing layers containing a sintering-difficult powder substantially incapable of being sintered under the sintering conditions for the ceramic powder; forming first grooves 16 extending from the first shrink-suppressing layer 13 side into a part of the multilayer mother substrate 12; firing the composite laminate 11; removing the first and second shrink-suppressing layers 13 and 14 and taking out the sintered multilayer mother substrate 11; and dividing the multilayer mother substrate 12 along the grooves 16, and obtaining a plurality of the ceramic multilayer substrates. Thereby, shrinkage in the plan direction at firing can be suppressed.

Abstract: A ceramic multilayer substrate having excellent migration resistance and high bonding strength between a resin sealing material and a ceramic multilayer substrate body, includes a laminated substrate body having lands, and external electrodes, and covered with a siloxane film formed by a PVD process. The thickness of the siloxane film is lower than about 100 nm. After that, external electrodes of a mounting component are electrically connected and firmly hold to the lands of the laminated substrate body via solder. Next, a resin sealing material for sealing the mounting component is formed on the laminated substrate body.

Abstract: A method of producing a ceramic multilayer substrate involves producing a green composite laminate 11 containing first and second shrink-suppressing layers formed on the main surfaces of a green multilayer mother substrate 12 having a plurality of ceramic green layers 17 containing ceramic powder, the shrink-suppressing layers containing a sintering-difficult powder substantially incapable of being sintered under the sintering conditions for the ceramic powder; forming first grooves 16 extending from the first shrink-suppressing layer 13 side into a part of the multilayer mother substrate 12; firing the composite laminate 11; removing the first and second shrink-suppressing layers 13 and 14 and taking out the sintered multilayer mother substrate 11; and dividing the multilayer mother substrate 12 along the grooves 16, and obtaining a plurality of the ceramic multilayer substrates. Thereby, shrinkage in the plan direction at firing can be suppressed.

Abstract: A method of producing a ceramic multilayer substrate involves: producing a green composite laminate 11 containing first and second shrink-suppressing layers formed on the main surfaces of a green multilayer mother substrate 12 containing ceramic powder, the first and second shrink-suppressing layers containing a sintering-difficult powder substantially incapable of being sintered under the sintering conditions for the ceramic powder; forming first grooves 16 extending from the first shrink-suppressing layer 13 side into a part of the multilayer mother substrate 12; firing the composite laminate 11; removing the first and second shrink-suppressing layers 13 and 14; dividing the multilayer mother substrate 12 along the grooves 16 and obtaining a plurality of the ceramic multilayer substrates. Thereby, shrinkage in the plan direction at firing can be suppressed. Thus, a ceramic multilayer substrate having a high dimensional accuracy and a high reliability can be produced with a high production efficiency.

Abstract: To produce a green composite laminate 11, a green multilayer collective substrate 13 containing low-temperature sinterable glass ceramic powder as a main ingredient is disposed between first and second shrinkage-restraining layers 14a and 14b containing alumina powder as a main ingredient. Grooves 16 are formed on one main surface 11a of the green composite laminate 11 such as to pass through the first shrinkage-restraining layer 14a and the green multilayer collective substrate 13 and reach the second shrinkage-restraining layer 14b, but not to reach the other main surface 11b of the green composite laminate 11. The green composite laminate 11 provided with the grooves 16 is sintered under conditions where the low-temperature sinterable glass ceramic powder is sintered and the green first and second shrinkage-restraining layers 14a and 14b are removed to prepare a plurality of ceramic multilayer substrates.

Abstract: A method for manufacturing multilayer ceramic substrates in accordance with a multiple formation method using a non-shrinkage process allows the multilayer ceramic substrates to be smoothly formed by dividing a sintered multilayer mother substrate, and in addition, external terminal electrodes in a preferable state can be efficiently formed. When a green composite laminate comprising shrinkage suppression layers and a green multilayer mother substrate provided therebetween is formed, through-holes are provided on dividing lines so as to divide conductors, and in addition, cut-in grooves are provided along the dividing lines. After the shrinkage suppression layers are removed from the fired composite laminate, the multilayer ceramic substrates are obtained by dividing the multilayer mother substrate along the through-holes and the cut-in grooves.

Abstract: To produce a green composite laminate 11, a green multilayer collective substrate 13 containing low-temperature sinterable glass ceramic powder as a main ingredient is disposed between first and second shrinkage-restraining layers 14a and 14b containing alumina powder as a main ingredient. Grooves 16 are formed on one main surface 11a of the green composite laminate 11 such as to pass through the first shrinkage-restraining layer 14a and the green multilayer collective substrate 13 and reach the second shrinkage-restraining layer 14b, but not to reach the other main surface 11b of the green composite laminate 11. The green composite laminate 11 provided with the grooves 16 is sintered under conditions where the low-temperature sinterable glass ceramic powder is sintered and the green first and second shrinkage-restraining layers 14a and 14b are removed to prepare a plurality of ceramic multilayer substrates.

Abstract: A photosensitive insulating paste contains a borosilicate glass powder and a crystalline SiO2 powder, wherein the powders are dispersed in a photosensitive organic vehicle and the paste contains the crystalline SiO2 component in an amount of about 3-40 wt. % after sintering. A thick-film multi-layer circuit substrate (e.g., chip inductor) comprising an insulating substrate on which insulating layers are formed, wherein the insulating layers are formed through exposure, development and sintering, after the application of the photosensitive insulating paste.