Patents by Inventor Hiromichi Tokuda

Hiromichi Tokuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8193894
    Abstract: An electronic component capable of obtaining a large inductance value and a high Q value and a method of manufacturing the electronic component are provided. A coil includes a plurality of coil conductors incorporated in a multilayer structure, a plurality of lands provided at the plurality of coil conductors, and a via-hole conductor connecting the plurality of lands. Lead-out conductors are incorporated in the multilayer structure and connect the coil and external electrodes. The plurality of coil conductors form a substantially rectangular loop path in plan view from the z-axis direction by overlapping each other. The plurality of lands protrude toward outside the path at a short side of the path and do not overlap the lead-out conductors in plan view from the z-axis direction.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: June 5, 2012
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiromi Miyoshi, Masaki Inui, Hiromichi Tokuda
  • Publication number: 20100253464
    Abstract: An electronic component capable of obtaining a large inductance value and a high Q value and a method of manufacturing the electronic component are provided. A coil includes a plurality of coil conductors incorporated in a multilayer structure, a plurality of lands provided at the plurality of coil conductors, and a via-hole conductor connecting the plurality of lands. Lead-out conductors are incorporated in the multilayer structure and connect the coil and external electrodes. The plurality of coil conductors form a substantially rectangular loop path in plan view from the z-axis direction by overlapping each other. The plurality of lands protrude toward outside the path at a short side of the path and do not overlap the lead-out conductors in plan view from the z-axis direction.
    Type: Application
    Filed: April 1, 2010
    Publication date: October 7, 2010
    Applicant: MURATA MANUFACTURING CO, LTD.
    Inventors: Hiromi MIYOSHI, Masaki INUI, Hiromichi TOKUDA
  • Patent number: 7009485
    Abstract: A laminate-type electronic component includes has a first coil and a second coil, and the number of turns of the first coil is smaller than that of the second coil due to a positional relationship between input-output electrodes. As a result, the thickness of an outer layer on the first coil side is increased, that is, the magnetic path cross-sectional area of the outer layer is increased. Thus, the inductance of the first coil is decreased. The thickness of the outer layer on the second coil side is decreased, that is, the magnetic path cross-sectional area of the outer layer on the second coil side is decreased. Thus, the inductance of the second coil is decreased.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: March 7, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takashi Tomohiro, Hiromichi Tokuda, Yoshihiro Imanishi
  • Patent number: 6956455
    Abstract: In a method of manufacturing a laminated ceramic electric component, a first transfer sheet in which a composite green sheet having a non-magnetic ceramic area and a magnetic ceramic area is supported by a supporting film, and a second transfer sheet in which a ceramic green sheet is supported by a supporting film are prepared. The method includes the first transfer step of sequentially transferring the ceramic green sheet onto a lamination stage, the second transfer step of transferring the composite green sheet, the third transfer step of transferring the ceramic green sheet of the second transfer sheet, and the step of obtaining a laminate.
    Type: Grant
    Filed: January 8, 2004
    Date of Patent: October 18, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiromichi Tokuda, Takashi Tomohiro
  • Publication number: 20050128042
    Abstract: A laminate-type electronic component includes has a first coil and a second coil, and the number of turns of the first coil is smaller than that of the second coil due to a positional relationship between input-output electrodes. As a result, the thickness of an outer layer on the first coil side is increased, that is, the magnetic path cross-sectional area of the outer layer is increased. Thus, the inductance of the first coil is decreased. The thickness of the outer layer on the second coil side is decreased, that is, the magnetic path cross-sectional area of the outer layer on the second coil side is decreased. Thus, the inductance of the second coil is decreased.
    Type: Application
    Filed: November 12, 2004
    Publication date: June 16, 2005
    Inventors: Takashi Tomohiro, Hiromichi Tokuda, Yoshihiro Imanishi
  • Patent number: 6871391
    Abstract: In a method of manufacturing a laminated ceramic electronic component, a first transfer sheet in which a composite green sheet having a non-magnetic ceramic area and a magnetic ceramic area is supported by a supporting film, and a second transfer sheet in which a ceramic green sheet is supported by a supporting film are prepared. The method includes the first transfer step of sequentially transferring the ceramic green sheet onto a lamination stage, the second transfer step of transferring the composite green sheet, the third transfer step of transferring the ceramic green sheet of the second transfer sheet, and the step of obtaining a laminate.
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: March 29, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiromichi Tokuda, Takashi Tomohiro
  • Publication number: 20040141297
    Abstract: In a method of manufacturing a laminated ceramic electronic component, a first transfer sheet in which a composite green sheet having a non-magnetic ceramic area and a magnetic ceramic area is supported by a supporting film, and a second transfer sheet in which a ceramic green sheet is supported by a supporting film are prepared. The method includes the first transfer step of sequentially transferring the ceramic green sheet onto a lamination stage, the second transfer step of transferring the composite green sheet, the third transfer step of transferring the ceramic green sheet of the second transfer sheet, and the step of obtaining a laminate.
    Type: Application
    Filed: January 8, 2004
    Publication date: July 22, 2004
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Hiromichi Tokuda, Takashi Tomohiro
  • Patent number: 6730183
    Abstract: A manufacturing method for a laminated ceramic electronic component is performed such that the thickness of the inner electrode is greatly increased, delamination does not occur, and reliability is superior. The manufacturing method for the laminated ceramic electronic component includes a process in which a green sheet including the inner electrode paste layer and the ceramic paste layer, is provided on a carrier sheet such that the inner electrode paste layer penetrates the green sheet from the top surface to the bottom surface thereof, and a process, in which laminates of the green sheet and the carrier film are adhered by pressing, and thereafter the carrier film is peeled off, are repeated to obtain the ceramic laminate, and the ceramic laminate is fired after pressing in the direction of the thickness to obtain the ceramic sintered body.
    Type: Grant
    Filed: December 20, 2000
    Date of Patent: May 4, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiromichi Tokuda, Shingo Okuyama, Tsuyoshi Tatsukawa, Makoto Fukuda
  • Patent number: 6696911
    Abstract: A common-mode choke coil includes first to third spiral coils, in which the diameters of coil portions are substantially the same and the axes of the coil portions are aligned collinearly. Extended portions of the first and second coils have a flectional pattern and connect coil portions located at substantially the center in the longitudinal direction of sheets and input/output electrodes. The junctions of the extended portions and the coil portions have a folded configuration. Accordingly, the number of turns and the line length of the first coil are the same as those of the second coil.
    Type: Grant
    Filed: September 4, 2002
    Date of Patent: February 24, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takashi Tomohiro, Hiromichi Tokuda
  • Patent number: 6683523
    Abstract: In a laminated impedance device, coil conductor patterns are electrically connected in series through via-holes to form a substantially U-shaped spiral coil. A first group of the coil conductor patterns defines a first coil portion of a high-permeability coil unit. A second group of the coil conductor patterns defines a second coil portion of a low-permeability coil unit, and a third group of the coil conductor patterns defines a third coil portion of the low-permeability coil unit. A fourth group of the coil conductor patterns defines a fourth coil portion of the high-permeability coil unit. The first, second and third coil portions are wound clockwise, while the fourth coil portion is wound counterclockwise, as viewed from the top of the impedance device. Therefore, the laminated impedance device yields a high inductance in the low-permeability coil unit, and can be mounted in any direction and orientation.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: January 27, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koichi Takashima, Hiromichi Tokuda
  • Patent number: 6669796
    Abstract: In a method for manufacturing a laminated ceramic electronic component, a first transfer member and a second transfer member are prepared on a lamination stage to produce the laminated ceramic electronic component. The first transfer member includes a conductor-attached composite green sheet having a conductor on a portion of the surface thereof, including a non-magnetic ceramic region and a magnetic ceramic region, and a first carrier film that carries the conductor-attached composite green sheet. The second transfer member includes a ceramic green sheet and a carrier film that carries the ceramic green sheet. The laminated ceramic electronic component is thus produced through a first transfer step in which the ceramic green sheets are successively transferred, through a second transfer step in which the conductor-attached composite green sheet is transferred, and through a third transfer step in which the ceramic green sheet of the second transfer member is transferred.
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: December 30, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiromichi Tokuda, Takashi Tomohiro
  • Patent number: 6627021
    Abstract: A method of manufacturing a laminated ceramic electronic component includes the steps of forming a conductor having a large thickness, which includes a plurality of first coil conductor layers and a plurality of second conductor layers, transferring the plurality of first coil conductor layers, which are each provided on a carrier film, onto the upper surface of a ceramic green sheet, and transferring the plurality of second coil conductor layers, which are each held on a carrier film, onto the lower surface of the same ceramic green sheet.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: September 30, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tsuyoshi Tatsukawa, Hiromichi Tokuda
  • Patent number: 6603380
    Abstract: A method of producing a laminated ceramic electronic component results in an increased thickness of an internal electrode, reduced delamination, and produces a laminated ceramic electronic component having outstanding reliability. The method of producing a laminated ceramic electronic component includes the step of forming a green sheet supported on a carrier film and having an internal electrode paste layer configured to pass through the green sheet from the upper surface to the lower surface thereof, and a ceramic paste layer, the two layers being provided with a space therebetween, and the step of repeating the step of press-bonding the laminate of the green sheet and the carrier film, and separating the carrier film to obtain a ceramic laminate, pressing the ceramic laminate in the thickness direction, and then firing the laminate to obtain a ceramic sintered body.
    Type: Grant
    Filed: August 26, 2002
    Date of Patent: August 5, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiromichi Tokuda, Tsuyoshi Tatsukawa
  • Patent number: 6597270
    Abstract: A multilayer impedance component which has no directivity when mounted and which achieves outstanding electrical characteristics includes a high permeability coil having a first winding portion and a third winding portion defined by stacking relatively high permeability magnetic sheets, a low permeability coil having a second winding portion defined by stacking relatively low permeability magnetic sheets, and an intermediate layer defined by an intermediate sheet. The three winding portions are electrically connected in series with each other to define a helical coil. Each end of the helical coil is led from coil conductor patterns provided in the high-permeability coil to each of input and output external electrodes.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: July 22, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koichi Takashima, Hiromichi Tokuda
  • Patent number: 6590486
    Abstract: A multilayer inductor includes first and second conductive coil patterns which are disposed in two layers in an upper portion of a multi-layered body and are electrically connected consecutively in series to third and fourth conductive coil patterns disposed in a lower portion of the multi-layered body through via-holes formed in an insulation sheet, thereby forming a spiral coil. The first conductive coil patterns and the second conductive coil patterns overlap each other at edges thereof. The fourth conductive coil patterns and the third conductive coil patterns overlap each other at edges thereof.
    Type: Grant
    Filed: May 13, 2002
    Date of Patent: July 8, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tadashi Tanaka, Hiromichi Tokuda
  • Patent number: 6544365
    Abstract: A method of producing a laminated ceramic electronic component results in an increased thickness of an internal electrode, reduced delamination, and produces a laminated ceramic electronic component having outstanding reliability. The method of producing a laminated ceramic electronic component includes the step of forming a green sheet supported on a carrier film and having an internal electrode paste layer configured to pass through the green sheet from the upper surface to the lower surface thereof, and a ceramic paste layer, the two layers being provided with a space therebetween, and the step of repeating the step of press-bonding the laminate of the green sheet and the carrier film, and separating the carrier film to obtain a ceramic laminate, pressing the ceramic laminate in the thickness direction, and then firing the laminate to obtain a ceramic sintered body.
    Type: Grant
    Filed: January 12, 2001
    Date of Patent: April 8, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiromichi Tokuda, Tsuyoshi Tatsukawa
  • Patent number: 6541968
    Abstract: It is an object of the present invention to provide a magnetic sensor which is suitable to be manufactured in a large amount, has a high sensitivity, and is easy to handle. A first outer layer section A is formed by laminating a plurality of magnetic sheets one upon another. A coil section is formed by laminating a plurality of coil-patterned sheets one upon another. A second outer layer section is formed by laminating a plurality of magnetic sheets one upon another. Each of the sheets forming the coil section B has its central portion formed by an elliptical magnetic body and its surrounding portion formed by a non-magnetic body on which a coil pattern is formed by a film located on the non-magnetic body.
    Type: Grant
    Filed: May 4, 2000
    Date of Patent: April 1, 2003
    Assignee: Murata Manufacturing Co. Ltd.
    Inventor: Hiromichi Tokuda
  • Publication number: 20030052766
    Abstract: A common-mode choke coil includes first to third spiral coils, in which the diameters of coil portions are substantially the same and the axes of the coil portions are aligned collinearly. Extended portions of the first and second coils have a flectional pattern and connect coil portions located at substantially the center in the longitudinal direction of sheets and input/output electrodes. The junctions of the extended portions and the coil portions have a folded configuration. Accordingly, the number of turns and the line length of the first coil are the same as those of the second coil.
    Type: Application
    Filed: September 4, 2002
    Publication date: March 20, 2003
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takashi Tomohiro, Hiromichi Tokuda
  • Publication number: 20030001711
    Abstract: A multilayer inductor includes first and second conductive coil patterns which are disposed in two layers in an upper portion of a multi-layered body and are electrically connected consecutively in series to third and fourth conductive coil patterns disposed in a lower portion of the multi-layered body through via-holes formed in an insulation sheet, thereby forming a spiral coil. The first conductive coil patterns and the second conductive coil patterns overlap each other at edges thereof. The fourth conductive coil patterns and the third conductive coil patterns overlap each other at edges thereof.
    Type: Application
    Filed: May 13, 2002
    Publication date: January 2, 2003
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Tadashi Tanaka, Hiromichi Tokuda
  • Publication number: 20030000622
    Abstract: A method of producing a laminated ceramic electronic component results in an increased thickness of an internal electrode, reduced delamination, and produces a laminated ceramic electronic component having outstanding reliability. The method of producing a laminated ceramic electronic component includes the step of forming a green sheet supported on a carrier film and having an internal electrode paste layer configured to pass through the green sheet from the upper surface to the lower surface thereof, and a ceramic paste layer, the two layers being provided with a space therebetween, and the step of repeating the step of press-bonding the laminate of the green sheet and the carrier film, and separating the carrier film to obtain a ceramic laminate, pressing the ceramic laminate in the thickness direction, and then firing the laminate to obtain a ceramic sintered body.
    Type: Application
    Filed: August 26, 2002
    Publication date: January 2, 2003
    Applicant: Murata Manufacturing Co., Ltd
    Inventors: Hiromichi Tokuda, Tsuyoshi Tatsukawa