Abstract: A lead frame of this invention, which is made of a die-cut conductive plate and used for manufacturing a semiconductor device, comprises a frame portion at the peripheral area of the lead frame, a main bed portion supported by support members extending from the frame portion for mounting a semiconductor main chip, a plurality of leads extending from opposite sides of the frame portion toward the inner area of the lead frame, with the tip portion thereof being positioned near at the main bed portion, some of the plurality of leads having a sub-bed portion formed at a predetermined area for mounting a semiconductor sub-chip, and a suspension pin formed outside of a predetermined lead which is positioned at the outmost position of the plurality of leads, the suspension pin extending along the predetermined lead and being resin sealed with the plurality of leads at a resin molding process of semiconductor device manufacturing processes.