Patents by Inventor Hiromitsu Fujiya

Hiromitsu Fujiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110052248
    Abstract: A cooling device is disclosed. The cooling device includes a cooling section which is moveably provided with respect to an image forming device body between a first location and a second location, the second location being different from the first location, and which cools surroundings with a cooling medium to be supplied; a cooling medium supply section which is provided at the image forming device body and which cools the cooling medium to supply the cooled cooling medium to the cooling section; and a connecting member which connects the cooling section and the cooling medium supply section to circulate the cooling medium between the cooling section and the cooling medium supply section, wherein the connecting member includes a flexible member and is supported by a guiding member which guides an operation of tracking the connecting member in conjunction with movement of the cooling section.
    Type: Application
    Filed: August 20, 2010
    Publication date: March 3, 2011
    Inventors: Takayuki Nishimura, Kenichi Takehara, Yasuaki Iijima, Hiromitsu Fujiya, Satoshi Okano, Tomoyasu Hirasawa, Masanori Saitoh, Shingo Suzuki, Takahiro Ogino
  • Publication number: 20110052249
    Abstract: Disclosed is a cooling device that includes a cooling part that is movably provided between a first position and a second position different from the first position with respect to an image forming apparatus main body and cools a periphery thereof with a cooling medium to be supplied; a cooling medium supply part that is provided in the image forming apparatus main body and cools and supplies the cooling medium to the cooling part; and a connecting member that connects the cooling part to the cooling medium supply part to circulate the cooling medium between the cooling part and the cooling medium supply part; wherein the connecting member is configured to include a flexible member and spirally provided with a moving direction of the cooling part as an axis center.
    Type: Application
    Filed: August 27, 2010
    Publication date: March 3, 2011
    Inventors: Yasuaki IIJIMA, Kenichi Takehara, Hiromitsu Fujiya, Takayuki Nishimura, Satoshi Okano, Tomoyasu Hirasawa, Masanori Saitoh, Shingo Suzuki
  • Publication number: 20110052247
    Abstract: A cooling device includes a cooling roller having a dual tube structure including an inner tube disposed inside an outer tube, an outside flow passage and an inside flow passage in which a cooling medium flows, and an opening that allows the outside flow passage to communicate with the inside flow passage, a cooling medium transport unit, and a rotating tube joint unit mounted to one end side of the cooling roller. One end of the outer tube is coaxially rotatably fitted to a first fitting section of the rotating tube joint unit. One end of the inner tube is coaxially fitted into and rotatably or fixedly supported to a second fitting section of the rotating tube joint unit, and the other end is coaxially fitted into and rotatably or fixedly supported to a fitting section on the other end of the outer tube.
    Type: Application
    Filed: August 16, 2010
    Publication date: March 3, 2011
    Applicant: Ricoh Company, Ltd.
    Inventors: Masanori Saitoh, Satoshi Okano, Tomoyasu Hirasawa, Shingo Suzuki, Kenichi Takehara, Yasuaki Iijima, Takayuki Nishimura, Hiromitsu Fujiya, Keisuke Yuasa
  • Publication number: 20110030927
    Abstract: In a cooling device that includes a cooling roller that comprises a hollow tubular member and a cooling medium transport unit for transporting a cooling liquid to the inside of the cooling roller and contacts a sheet-like member to cool down the paper, a turbulence generating unit that generates turbulence in a cooling liquid is disposed near an inner wall of the outer tube.
    Type: Application
    Filed: July 27, 2010
    Publication date: February 10, 2011
    Inventors: Satoshi OKANO, Takayuki NISHIMURA, Kenichi TAKEHARA, Yasuaki IlJIMA, Hiromitsu FUJIYA, Tomoyasu HIRASAWA, Masanori SAITOH, Shingo SUZUKI, Keisuke YUASA, Keisuke IKEDA
  • Publication number: 20100183323
    Abstract: An image forming apparatus including a target part to be cooled detachably attachable to the image forming apparatus, a cooling device including a heat receiving part provided to contact the target part to be cooled to receive heat from the target part to be cooled with a cooling medium provided within the heat receiving part, and a contact/separation mechanism to cause the heat receiving part to contact and separate from the target part to be cooled. The contact/separation mechanism includes a pressing unit to press the heat receiving part against the target part to be cooled. A reaction of a pressing force of the heat receiving part applied to the pressing unit when the heat receiving part is pressed against the target part to be cooled is directed onto a predetermined portion of the target part to be cooled.
    Type: Application
    Filed: November 12, 2009
    Publication date: July 22, 2010
    Inventors: Hiromitsu Fujiya, Kenichi Takehara, Yasuaki Iljima, Takayuki Nishimura, Satoshi Okano, Tomoyasu Hirasawa, Shingo Suzuki, Masanori Saitoh
  • Patent number: 7733648
    Abstract: A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel with the first duct. A fourth duct extends between the second and third ducts. A second printed wiring board extends in the horizontal direction within the fourth duct. A second axial flow fan is connected to the third duct. The second axial flow fan generates airflow which absorbs heat from the second printed wiring board. The electronic apparatus can be reduced in size.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: June 8, 2010
    Assignee: Fujitsu Limited
    Inventors: Hiromitsu Fujiya, Hideki Kimura, Eiji Makabe
  • Publication number: 20100129107
    Abstract: An image forming apparatus includes an image forming unit including an image carrier and a development device, a transfer unit to transfer an image formed on the image carrier onto a sheet, a fixing device to fix the image on the sheet, a sheet transport unit, a sheet stack portion, an air duct, and a first liquid-cooling device. The first liquid-cooling device includes a first heat receiving member disposed in thermal contact with a first heated portion, a first heat releaser, a first circulation pipe connecting the first heat receiving member and the first heat releaser to circulate a coolant therebetween, a first transport member to transport the coolant through the first circulation pipe, and an airflow generator to generate an airflow with external air to cool the first heat releaser. The air duct guides the air taken in by the airflow generator to a second heated portion.
    Type: Application
    Filed: November 18, 2009
    Publication date: May 27, 2010
    Inventors: Kenichi Takehara, Yasuaki Iijima, Hiromitsu Fujiya, Takayuki Nishimura, Satoshi Okano, Tomoyasu Hirasawa, Shingo Suzuki, Masanori Saitoh
  • Patent number: 7623346
    Abstract: Airflow is introduced into an enclosure through an air inlet in an electronic component unit. The airflow runs toward a first electronic component. The airflow absorbs heat from the first electronic component. The first electronic component is thus sufficiently cooled. A second electronic component is mounted on a printed wiring board at a position remoter from the air inlet than the position of the first electronic component. An air intake opening is formed in the enclosure. The air intake opening is defined at a section of the enclosure opposed to the printed wiring board at least between the first and second electronic components. Airflow is introduced toward the second electronic component through the air intake opening. The second electronic opening is thus sufficiently cooled. In this manner, the first and second electronic components are cooled equally to the utmost.
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: November 24, 2009
    Assignee: Fujitsu Limited
    Inventors: Hiromitsu Fujiya, Hideki Kimura
  • Publication number: 20080278910
    Abstract: Airflow is introduced into an enclosure through an air inlet in an electronic component unit. The airflow runs toward a first electronic component. The airflow absorbs heat from the first electronic component. The first electronic component is thus sufficiently cooled. A second electronic component is mounted on a printed wiring board at a position remoter from the air inlet than the position of the first electronic component. An air intake opening is formed in the enclosure. The air intake opening is defined at a section of the enclosure opposed to the printed wiring board at least between the first and second electronic components. Airflow is introduced toward the second electronic component through the air intake opening. The second electronic opening is thus sufficiently cooled. In this manner, the first and second electronic components are cooled equally to the utmost.
    Type: Application
    Filed: May 21, 2008
    Publication date: November 13, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Hiromitsu Fujiya, Hideki Kimura
  • Publication number: 20080225496
    Abstract: A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel with the first duct. A fourth duct extends between the second and third ducts. A second printed wiring board extends in the horizontal direction within the fourth duct. A second axial flow fan is connected to the third duct. The second axial flow fan generates airflow which absorbs heat from the second printed wiring board. The electronic apparatus can be reduced in size.
    Type: Application
    Filed: March 12, 2008
    Publication date: September 18, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Hiromitsu Fujiya, Hideki Kimura, Eiji Makabe
  • Patent number: 7391618
    Abstract: Airflow is introduced into an enclosure through an air inlet in an electronic component unit. The airflow runs toward a first electronic component. The airflow absorbs heat from the first electronic component. The first electronic component is thus sufficiently cooled. A second electronic component is mounted on a printed wiring board at a position remoter from the air inlet than the position of the first electronic component. An air intake opening is formed in the enclosure. The air intake opening is defined at a section of the enclosure opposed to the printed wiring board at least between the first and second electronic components. Airflow is introduced toward the second electronic component through the air intake opening. The second electronic opening is thus sufficiently cooled. In this manner, the first and second electronic components are cooled equally to the utmost.
    Type: Grant
    Filed: March 24, 2006
    Date of Patent: June 24, 2008
    Assignee: Fujitsu Limited
    Inventors: Hiromitsu Fujiya, Hideki Kimura
  • Patent number: 7365977
    Abstract: Air in the first section is allowed to run into a second section through first and second air vents in an electronic apparatus. This causes an increase in the amount of airflow in the first section. In particular, if the pressure loss is larger in the first section, airflow blocked in the first section is forced to run into the second section. A smooth airflow can be established in the first section. Moreover, if the pressure in the first section is set larger than the pressure in the second section, a smoother airflow is established from the first section to the second section. A further superior airflow can be established in the first section.
    Type: Grant
    Filed: March 24, 2006
    Date of Patent: April 29, 2008
    Assignee: Fujitsu Limited
    Inventors: Hiromitsu Fujiya, Hideki Kimura
  • Patent number: 7365976
    Abstract: A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel with the first duct. A fourth duct extends between the second and third ducts. A second printed wiring board extends in the horizontal direction within the fourth duct. A second axial flow fan is connected to the third duct. The second axial flow fan generates airflow which absorbs heat from the second printed wiring board. The electronic apparatus can be reduced in size.
    Type: Grant
    Filed: March 24, 2006
    Date of Patent: April 29, 2008
    Assignee: Fujitsu Limited
    Inventors: Hiromitsu Fujiya, Hideki Kimura, Eiji Makabe
  • Patent number: 7319596
    Abstract: A second duct is designed to oppose its air outlet to a portion of an air inlet of a first duct in an electronic apparatus. The wall member closes the air inlet of the first duct at a position outside the air outlet of the second duct. An opening is defined in the wall member. The opening enables a connection between the outer space of the second duct and the air inlet of the first duct. Airflow enters the air inlet of the first duct from the air outlet of the second duct as well as from the opening of the wall member, respectively.
    Type: Grant
    Filed: March 24, 2006
    Date of Patent: January 15, 2008
    Assignee: Fujitsu Limited
    Inventors: Hiromitsu Fujiya, Eiji Makabe
  • Publication number: 20070223199
    Abstract: A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel with the first duct. A fourth duct extends between the second and third ducts. A second printed wiring board extends in the horizontal direction within the fourth duct. A second axial flow fan is connected to the third duct. The second axial flow fan generates airflow which absorbs heat from the second printed wiring board. The electronic apparatus can be reduced in size.
    Type: Application
    Filed: March 24, 2006
    Publication date: September 27, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Hiromitsu Fujiya, Hideki Kimura, Eiji Makabe
  • Publication number: 20070223201
    Abstract: A second duct is designed to oppose its air outlet to a portion of an air inlet of a first duct in an electronic apparatus. The wall member closes the air inlet of the first duct at a position outside the air outlet of the second duct. An opening is defined in the wall member. The opening enables a connection between the outer space of the second duct and the air inlet of the first duct. Airflow enters the air inlet of the first duct from the air outlet of the second duct as well as from the opening of the wall member, respectively.
    Type: Application
    Filed: March 24, 2006
    Publication date: September 27, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Hiromitsu Fujiya, Eiji Makabe
  • Publication number: 20070223191
    Abstract: Air in the first section is allowed to run into a second section through first and second air vents in an electronic apparatus. This causes an increase in the amount of airflow in the first section. In particular, if the pressure loss is larger in the first section, airflow blocked in the first section is forced to run into the second section. A smooth airflow can be established in the first section. Moreover, if the pressure in the first section is set larger than the pressure in the second section, a smoother airflow is established from the first section to the second section. A further superior airflow can be established in the first section.
    Type: Application
    Filed: March 24, 2006
    Publication date: September 27, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Hiromitsu Fujiya, Hideki Kimura
  • Publication number: 20070223200
    Abstract: Airflow is introduced into an enclosure through an air inlet in an electronic component unit. The airflow runs toward a first electronic component. The airflow absorbs heat from the first electronic component. The first electronic component is thus sufficiently cooled. A second electronic component is mounted on a printed wiring board at a position remoter from the air inlet than the position of the first electronic component. An air intake opening is formed in the enclosure. The air intake opening is defined at a section of the enclosure opposed to the printed wiring board at least between the first and second electronic components. Airflow is introduced toward the second electronic component through the air intake opening. The second electronic opening is thus sufficiently cooled. In this manner, the first and second electronic components are cooled equally to the utmost.
    Type: Application
    Filed: March 24, 2006
    Publication date: September 27, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Hiromitsu Fujiya, Hideki Kimura