Abstract: An integrated circuit package is configured to host an electric circuit chip therein and have connected thereto a set of external terminals that provide electrical connections between the electric circuit chip and components that are external to the integrated circuit package. The set of external terminals is arranged in subsets, where each subset includes a predetermined number of external terminals that are arranged in a stepped configuration, so as to reduce an overall size of the integrated circuit package.

Abstract: A complementary wiring package including a package, a first set of external pins mounted in a central region on a top surface of the package in a vertical direction and connected to a plurality of respectively corresponding through holes, a second set of external pins being mounted in a perimeter region on a top surface of the package in a vertical direction and connected to printed wiring of a printed wiring board, and a plurality of internal lines that connect the first set of external pins to the second set of external pins. The complementary wiring package does not require a semi-conductor integrated circuit and is capable of being coupled with an semi-conductor integrated circuit package via the plurality of respectively corresponding through holes of the printed wiring board which is sandwiched between the complementary wiring package and the semi-conductor integrated circuit package.