Patents by Inventor Hiromitsu Hayashi

Hiromitsu Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive paste and conductive coating film
    Patent number: 5158708
    Abstract: An electrically conductive paste composition comprises an electric conductive powder, an organic binder comprising (A) a polyhydroxystyrene derivative and (B) a thermosetting resin at a weight ratio of (A) to (B) in the range between 5/95 and 95/5 and a solvent. The paste is used for an electric circuit printed on a substrate and improved in view of migration resistance, flexibility and reliability.
    Type: Grant
    Filed: November 28, 1990
    Date of Patent: October 27, 1992
    Assignee: Kao Corporation
    Inventors: Yuzo Yamamoto, Tomoyuki Haishi, Hiromitsu Hayashi, Masaki Iwasaki, Yumi Rakue
  • Electrically conductive paste composition
    Patent number: 5156771
    Abstract: An electrically conductive paste composition comprises an electrically conductive powder, an organic binder comprising a polymer of a hydroxystyrene having the formula (A) or a copolymer of hydroxystyrene having the formula (B), said polymer and copolymer each having a weight-average molecular weight of 1,000 to 2,000,000, and a solvent. In the formula, Y and Z are an amine group and others.
    Type: Grant
    Filed: May 24, 1990
    Date of Patent: October 20, 1992
    Assignee: Kao Corporation
    Inventors: Yuzo Yamamoto, Masaki Iwasaki, Tomoyuki Haishi, Hiromitsu Hayashi, Yumi Rakue