Patents by Inventor Hiromitsu HIRAI

Hiromitsu HIRAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF PRODUCING RESIN AND METHOD OF PRODUCING INSULATING STRUCTURE
    Publication number: 20220356311
    Abstract: A resin producing method is a method of producing a resin with which an insulating structure formed on an outer peripheral portion of a conductor is impregnated, the method including: a filler mixing step of mixing a nanofiller at a ratio of 15 wt % or more with an epoxy resin to form a mixture; a shear mixing step of causing the mixture to be subjected to shear mixing; a diluent mixing step of mixing a reactive diluent that reduces a viscosity of the epoxy resin, with the mixture after the shear mixing step; and a curing agent mixing step of mixing an acid anhydride curing agent with the mixture after the diluent mixing step.
    Type: Application
    Filed: December 22, 2020
    Publication date: November 10, 2022
    Applicant: Toshiba Mitsubishi-Electric Industrial Systems Corporation
    Inventors: Kodai USHIWATA, Yu YAMASHITA, Tetsuo YOSHIMITSU, Takahiro IMAI, Hiromitsu HIRAI