Abstract: An ESD protection device includes first and second discharge electrodes and a discharge auxiliary electrode that is electrically connected to the first and second discharge electrodes. The first and second discharge electrodes are located on or in an insulating substrate to at least partially face each other. The discharge auxiliary electrode includes first metal particles, second metal particles, and a binding agent. The first metal particles have a core-shell structure including a core section mainly including a first metal and a shell section which mainly includes an oxide of a second metal and which includes at least one portion with a cavity. The second metal particles have a core-shell structure including a core section mainly including the first metal and a shell section which mainly includes the oxide of the second metal and which has no cavity.

Abstract: An ESD protection device includes a ceramic element assembly including a glass component, first and second discharge electrodes on the same plane in the ceramic element assembly and opposed to each other with a gap therebetween, a discharge auxiliary electrode that connects the first discharge electrode to the second discharge electrode on the same plane, and a seal layer that is disposed between the discharge auxiliary electrode and the ceramic element assembly and that reduces or prevents a glass component in the ceramic element assembly from entering the discharge auxiliary electrode. The seal layer includes a conductive component.

Abstract: A ceramic circuit board that includes a ceramic insulator layer, grounding pattern conductors, connection lands disposed on a first surface of the ceramic circuit board, and grounding electrodes disposed on a second surface of the ceramic circuit board and connected to the grounding pattern conductors. Each of the grounding pattern conductors contains a metal and an oxide and includes a pattern main portion disposed inside the ceramic circuit board and an extended portion in which a first end thereof is connected to the pattern main portion and a second end thereof is exposed at a side surface of the ceramic circuit board. The metal content of the extended portion is lower than the metal content of the pattern main portion.

Abstract: An ESD protection device includes first and second discharge electrodes and a discharge auxiliary electrode that is electrically connected to the first and second discharge electrodes. The first and second discharge electrodes are located on or in an insulating substrate to at least partially face each other. The discharge auxiliary electrode includes first metal particles, second metal particles, and a binding agent. The first metal particles have a core-shell structure including a core section mainly including a first metal and a shell section which mainly includes an oxide of a second metal and which includes at least one portion with a cavity. The second metal particles have a core-shell structure including a core section mainly including the first metal and a shell section which mainly includes the oxide of the second metal and which has no cavity.

Abstract: An ESD protection device includes a ceramic element assembly including a glass component, first and second discharge electrodes on the same plane in the ceramic element assembly and opposed to each other with a gap therebetween, a discharge auxiliary electrode that connects the first discharge electrode to the second discharge electrode on the same plane, and a seal layer that is disposed between the discharge auxiliary electrode and the ceramic element assembly and that reduces or prevents a glass component in the ceramic element assembly from entering the discharge auxiliary electrode. The seal layer includes a conductive component.

Abstract: A ceramic circuit board that includes a ceramic insulator layer, grounding pattern conductors, connection lands disposed on a first surface of the ceramic circuit board, and grounding electrodes disposed on a second surface of the ceramic circuit board and connected to the grounding pattern conductors. Each of the grounding pattern conductors contains a metal and an oxide and includes a pattern main portion disposed inside the ceramic circuit board and an extended portion in which a first end thereof is connected to the pattern main portion and a second end thereof is exposed at a side surface of the ceramic circuit board. The metal content of the extended portion is lower than the metal content of the pattern main portion.

Abstract: A monolithic piezoelectric element includes a stack, and the stack includes a crack-forming conductive layer arranged to intentionally form a small crack in the stack. The small crack alleviates stress, thereby preventing the occurrence of a large crack that may extend to the piezoelectrically active region.

Abstract: A monolithic piezoelectric element includes a stack, and the stack includes a crack-forming conductive layer arranged to intentionally form a small crack in the stack. The small crack alleviates stress, thereby preventing the occurrence of a large crack that may extend to the piezoelectrically active region.